Call for papers


Open at 2017.02.28.

You can download the information about Call for papers of ICSJ2017 (PDF file).

November 20-22, 2017,

Kyoto Univ. Clock Tower Centennial Hall, KYOTO, JAPAN

"Integrated Package all around your life"

“IEEE CPMT Symposium Japan (ICSJ)” is a widely-recognized international conference of the IEEE CPMT Society, and held annually in Kyoto in November. ICSJ will provide a platform for you to communicate and interact with global leaders in packaging technology.

Integrated Package all around your life: The conference started in 1992 as "The VLSI Packaging Workshop in Japan" and was renamed to "ICSJ" in 2010 and will focus on a variety of packaging technologies. Internet of Things (IoT) will make revolutionary changes to the packaging technologies for smarter usage of the devices in various application fields such as healthcare, Industry 4.0, automotive, and so on. The IoT will be supported by “Integrated Package” which is composed of various types of devices (sensors, RFIDs, MEMS, wireless components, etc.). Integrated Package is one of the key technologies and exists all around your life. In 2017, the conference will feature three main topics: Fan-Out technologies, Optoelectronics and Heterogeneous Integration Roadmap. Additional topics of primary interest to the participants are listed below.

Other topics include (but not limited to):

+ 3D Packaging & Chip on Chip

+ Advanced Fine Pitch Packaging, Micro Bumping, Wafer Level CSP

+ Board-Level Integration & Integrated Substrate

+ Laminated Materials & Processing, Materials for Packaging

+ Thermal Management

+ Reliability & Failure Mechanisms

+ Packaging for High-Speed Electrical Interconnect

+ Signal Integrity / Power Integrity

+ RF Components & Modules

+ Packaging for Bio-Healthcare & Wearable

+ Packaging for Automotive & Power Electronics

+ Additive Manufacturing, 3D Printed Electronics

Bring your latest research results, share them with experts from industry and academia, and discuss your work with them. Anybody in the field of the packaging technologies is very welcome to present their latest accomplishments and participate in the discussion. The conference will provide a perfect opportunity to communicate, interact, and exchange technical idea.
Young researchers within 2 years' experience in their professions and all students including Ph.D are also welcome to the newly planned poster session called "Early Career Researcher's (ECR) session" for their start-up to the technical presentation and fruitful communication with experts.

Authors are invited to submit 1-page PDF file which includes 500-word abstract and figures through the Abstract Submission Website.

Abstract Submission

The Extended Deadline for Abstract Submissions: June 17, 2017

Acceptance notifications will be sent by July 7, 2017. Accepted authors are requested to submit the manuscript by September 8, 2017 for the Technical Digest, which will be available via IEEE Explore. 4-pages manuscript is required for the regular session, while 2-page manuscript is enough for ECR session.

You can download the information about Call for papers of ICSJ2017 (PDF file).


Program Chair:

Prof. Takaaki Ishigure

Keio University

3-14-1 Hiyoshi, Kohoku-ku, Yokohama, Kanagawa 223-8522, Japan

Phone: +81-45-566-1593

Mr. Kazuyuki Nakagawa

Renesas Electronics Corporation

5-20-1, Josuihon-cho, Kodaira-shi, Tokyo, 187-8588, Japan

Phone: +81-42-320-7300

Mr. Daisuke Iguchi

Fuji Xerox Co., Ltd.

2274 Hongo, Ebina-shi, Kanagawa 243-0494, Japan

Phone: +81-46-238-3112 (ext.519268)

Dr. Hideyuki Nasu

Furukawa Electric Co., Ltd.

6, Yawatakaigandori, Ichihara-shi, Chiba 290-8555, Japan

Phone: +81-436-42-1784




Kyoto University Clock Tower Centennial Hall
Yoshidahonmachi, Sakyo-ku, Kyoto, 606-8501, Japan

Official Sponsors

Platinum Sponsor

Gold Sponsor

ECR Session Sponsor

Silver Sponsors

Bronze Sponsor


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