Advance Program

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November 20, 2017 (Monday)
Hall I Hall II Hall III
9:00 Registration
10:00-
11:55
Session 1: Advanced Package 1 Session 2: Optoelectronics 1 Session 3: RF 1
Chairperson Chairperson Chairperson
Shinya Takyu (Lintec Corporation) Scott Bickham (Corning Research and Development Corporation) Masahiro Aoyagi (AIST)
Hiroshi Yamada (Toshiba Corporation) Yi Sun (OFS FITEL, LLC) Kazuyuki Nakagawa (Renesas Electronics Corp.)
10:00 Electromigration Mechanism on Interconnected Cu Pillar in Flip Chip Package 51 Single TO-Can GPON ONU Bi-directional Optical Sub-assembly with Si-Micromechanics 49 A 5-12 GHz Double-Balanced Power Mixer with Differential Transmission-Line Transformer in 0.18 µm CMOS 6
Toshihiko Akiba,Takuo Funaya ,Hideaki Tsuchiya Kazuyuki Nakagawa, and Kenji Sakata Mao-Chieh Hsu1, Leos Halmo1, and Joerg-R. Kropp2 Hwann-Kaeo Chiou, Yu-Jen Chen, Hsu-Liang Yen, and Hwann-Kaeo Chiou
(Renesas Electronics Corporation) (1. Ezconn Corporation, 2. InBeCon GmbH) (National Central University)
10:25 Demonstration of High Electromigration Resistance of Enhanced Sub-2 Micron-Scale Cu Redistribution Layer for Advanced Fine-Pitch Packaging 20 An Ultra-Compact 25Gbit/s x 4ch Active Optical Cable with Gapped Ground Electrode Structure 30 On the Development of a Dual-Band 0.18-um BiCMOS Transmit/Receive Switch for Microwave and Millimeter-Wave Array Transceivers 7
Hiroshi Kudo and Satoru Kuramochi Naohiro Kohmu, Toshiaki Takai, Norio Chujo, and Hideo Arimoto Cam Nguyen, D. Lee, C. Huynh, and C. Nguyen
(DNP Co., Ltd.) (Hitachi, Ltd.) (Texas A&M University)
10:50 The Influence of Intermetallic Compounds on High Speed Shear Testing with a Specific Interest in Electroless Palladium and Autocatalytic Gold 16 (Invited) Key design elements of a High Density Mid Board Optical Interconnect I-05 A Switchable Tunable Dual-Band Filter Using Varator Diodes for Tuning and Switching 17
Rick Nichols, Gustavo Ramos, Robin Taylor, Petra Schreier, and Sandra Heinemann Kevin Burt  ChiYang Chang, Chi-Yang Chang, Po-Jung Chou, and Chiao-Yi Hu
(Atotech Deutschland GmbH) (Samtec Incorporated) (National Chiao Tung University)
11:15 (Invited) 28-Gb/s x 24-channel On-Board Optical Transceiver Operated under an Air-Cooling Environment I-16 High Reliable Doherty Power Amplifier Module for LTE Small Cell Base Station 27
Hideyuki Nasu, Kazuya Nagashima, Toshinori Uemura, Atsushi Izawa, and Yozo Ishikawa Yu-Cheng Hsu1, Jian-Yu Li2, and Lin-Kun Wu1
(Furukawa Electric Co., Ltd.) (1. National Chiao Tung University, 2. Yuan Ze University)
11:40 Interview with the Authors (Discussion after the session)
11:55 Lunch (free time) & Platinum Sponsor's Seminar
12:50-
14:45
Session 4: Advanced Package 2 Session 5: Optoelectronics 2 Session 6: RF 2
Chairperson Chairperson Chairperson
Osamu Suzuki (Namics Corporation) Kevin Burt (Samtec Incorporated) Kazuyuki Nakagawa (Renesas Electronics Corp.)
Masahiro Inoue (Gunma University) Naohiro Kohmu (Hitachi, Ltd.) Masahiro Aoyagi (AIST)
12:50 (Invited) Neuromorphic Device for Edge Computing I-09 Spot Size Converting Fiber with a 4-µm Mode Field Diameter for Low-Loss Coupling to Silicon Photonic Circuits 21 Millimeter-Wave Antenna in Package on Low-Cost Organic Substrate for Flip Chip Chip Scale (FCCSP) package 39
Yasumitsu Orii Takuya Oda, Keisuke Hirakawa, Kentaro Ichii, and Kazuhiko Aikawa  Cheng Yu Ho, Cheng-Yu Ho, Ming-Fong Jhong, Po-Chih Pan, Chen-Chao Wang, and Chun-Yen Ting 
(NAGASE & CO., LTD.) (Fujikura Ltd.) (Advanced Semiconductor Engineering, Inc.)
13:15 Micro-bump challenges and reliability improvements in stack-die packages 18 Ultra-Broadband, Polarization-Insensitive SMF-28 Fiber Edge Couplers for Silicon Photonics 59 3D Packaging based 4-Channel LTCC Receiver Module 47
Yi-Ting (Henry) Chen and Raghu Chaware Bradley Snyder, Guy Lepage, Sadhishkumar Balakrishnan, Peter De Heyn, Peter Verheyen, Philippe Absil, and Joris Van Campenhout Bo Zho, Qipeng Wang,Yue Lu,Qiang Ma,Pu Ge, and Chonghu Cheng
(Xilinx Inc.) (imec) (Nanjing University of Posts and Telecommunications)
13:40 Development of Extremely Thin Profile Flip Chip CSP using Laser Assisted Bonding Technology 28 (Invited) Optical Fibers for High Density Interconnects I-04 Miniaturized Wideband Bandpass Filter in IPD Technology with Passive Equalizer to Improve the Flatness of Insertion Loss Response 9
ChoongHoe Kim, YangGyoo Jung, MinHo Kim, TaeHo Yoon, YunSeok Song, DongJoo Park, SeokHo Na, DaeByoung Kang, and KwangMo Lim Scott Bickham  Yo-Shen Lin, Chia-Ching Huang, Wei-Ting Fang, and Yo-Shen Lin
(Amkor Technology Korea, Inc.) (Corning Research and Development Corporation) (National Central University)
14:05 (Invited) Recent Advances for High Speed Short Reach Optical Interconnects for Datacom Links I-02 Compact LTCC Filter with Vertically End-Coupled Resonators 46
Yi Sun  Bo Zhou,Yue Lu,Qiang Ma,Qipeng Wang, and Chonghu Cheng
(OFS FITEL, LLC) (Nanjing University of Posts and Telecommunications)
14:30 Interview with the Authors (Discussion after the session) Gold Sponsor's Seminar@Hall III
"Enabling faster design and implementation decisions using virtual prototyping"
Yoko Fujita (ZUKEN INC.)
 
14:45 Coffee break + Sponsor's Exhibition @Conference room IV
15:00-
16:10
Hall I & II
Chairperson Hideyuki Nasu (Furukawa Electric Co., Ltd.) & Takaaki Ishigure (Keio University)
Opening & Plenary Speech I
15:00 Opening Remarks & Welcome Talk
Shinya Takyu (General Chair, IEEE CPMT Symposium Japan; Lintec Corporation)
15:15 Plenary Speech I: Short Reach Optical Interconnects
Stephen E. Ralph (Georgia Institute of Technology)
P-03
16:10-
17:40
Hall I & II 
Chairperson Yasumitsu Orii(NAGASE & CO., LTD.) & Shigenori Aoki (Fujitsu Laboratories, Ltd.)
CPMT Special Talk
16:10 Heterogeneous Integration Roadmap: (Title TBD)
Bill Chen (ASE Global)
S-01
16:55 Heterogeneous Integration Roadmap: (Title TBD)
Bill Bottoms (ADVANCED POLYMER MONITORING TECHNOLOGIES)
S-02
18:30 Welcome Reception
20:30 Close
November 21, 2017 (Tuesday)
Hall I Hall II Hall III
9:00 Registration
9:15-
10:45
Session 7: Fan-out Package Session 8: Thermal 1 Session 9: Bioelectronics
Chairperson Chairperson Chairperson
Yoichiro Sato (Asahi Glass Co. Ltd.) Tomoyuki Hatakeyama (Toyama Prefectural Univ.) Yoshio Nogami (Toray Engineering Co. Ltd.)
Masao Tomikawa (Toray Industries Inc.) TBD TBD
9:15 (Invited) Integrated dry process for panel level package as novel technology of desmear, seed and lithography I-13 (Invited) Latest Development and Application of Heat Pipes for Electronics and Automotive I-18 (Invited) Industrialization of Microwave Chemical Process I-15
Shinichi Endo Masataka Mochizuki Iwao Yoshino
(Ushio Inc.) (The Heat Pipes) (Microwave Chemical Co., Ltd.)
9:40 1l and 2l RDL Design for Fan-Out Panel Level Packaging and Electrical Simulation 60 Design Optimization of Heat Sink using Additive Manufacturing 25 (Invited) The "NanoSuit" for the observation of living and wet organisms in an electronmicroscope I-17
Yanwen Bai, Shineng Ma, Xuyi Yang, Yazhou Zhang, Kuancheng Chen, Cong Zhang, and Chih-Chin Liao CHin-Tien Chiu Y.Tateishi1, H.Gohara2, R.Kato2, Y.Ikeda2, V.Parque1, and T.Miyashita1 Takahiko Hariyama
(SanDisk InfoTech Shanghai) (1. Waseda University, 2. Fujielectric CO.) (Hamamatsu Univ. School of Medicine)
10:05 Research of Fan-Out Panel Level Package (FOPLP) manufacturing process using single-sided adhesive tape 29 Thermal Modeling and Experimental Verification using Large-sized Stacked Chips 64 Development of micro-system encapsulation for silicon devices which are in contact with human cells 48
Kazuhiro Kikuchi, Yasunori Karasawa, Yuusuke Nedzu, Ken Takano, Takeo Yoshinobu, and Takashi Sugino Shunichi Kikuchi1, Makoto Suwada1, Yoshihisa Iwakiri2, and Naoaki Nakamura2 Jean-Charles Souriau, Laetitia Castagné, and Simon Gilles
(Lintec corporation) (1. Fujitsu Limited, 2. Fujitsu Advanced Technologies Limited) (CEA-Leti)
10:30 Interview with the Authors (Discussion after the session)
10:45-
12:15
Session 10: Material Session 11: Thermal 2 Session 12: Power Electronics 1
Chairperson Chairperson Chairperson
Kenji Takahashi (Toshiba Memory Corporation) Tomoyuki Hatakeyama (Toyama Prefectural Univ.) Yoshinari Ikeda (Fuji Electric Co., Ltd.)
Kazuyuki Mitsukura (Hitachi Chemical Co. Ltd.) TBD Daisuke Iguchi (Fuji Xerox Co., Ltd.)
10:45 (Invited) Higher Reliability for Low-temperature Curable Positive-Tone Photosensitive Dielectric Materials I-11 Thermal Management in a Printing Machine for Improvement of Temperature Response of Printing Process using Design of Experiments 73 (Invited) Advanced Power Semiconductors and Development of High performance Power Module I-06
Yu Shoji Ryota MATSUTAKE1, Koichi HIROSE1, Tomoko WAUKE2, Hisashi HOSHINO2, Koji SATO1, Hirotoshi TERAO2, and Takashi FUKUE1 Hiroshi Yamaguchi
(Toray Industries, Inc.) (1. Iwate University, 2. ALPS Electric co., Ltd.) (National Institute of Advanced Industrial Science and Technology (AIST))
11:10 Development of Newly Bump Support Film (BSF) for WLCSP 50 Novel Simulation Method for Thermal Dissipation 44 (Invited) Power device applications of Ga2O3 for SBDs and bipolar devices I-07
Akinori Sato Kaoru Hashimoto and Kanji Otsuka Kentaro Kaneko
(LINTEC Corporation) (Meisei University) (Kyoto University, FLOSFIA Inc.)
11:35 New design concept of thermal conductive sheet showing low total thermal resistance 72 Study of temperature estimation method for densely mounted surface mount components 52 Enhanced Breakdown Voltage for All-SiC Modules 19
Masao Tomikawa, Atsushi Shimada, and Yoichi Shimba Yoshinori Aruga1,Koichi Hirasawa1,Takayuki Yamabe1,Hirotoshi Aoki1,Tomoyuki Hatakeyama2,Shinji Nakagawa2, and Masaru Ishizuka2 Motohito HORI, Yuichiro HINATA, and Katsumi TANIGUCHI
(Toray Industries Inc.) (1. KOA Corporation, 2. Toyama Prefectural University) (Fuji Electric Co., Ltd.)
12:00 Interview with the Authors (Discussion after the session)
12:15 Lunch (free time) & Platinum Sponsor's Seminar
13:15-
14:45
Hall I & II    
Chairperson Shinya Takyu (Lintec Corporation) & Tomonori Minegishi (Hitachi Chemical Co. Ltd.)
Advanced Packaging Special "Integrated Package all around your life"
13:15 New industries come out through FOWLP in the future
Shuzo Akejima (Toshiba Corporation)
S-05
14:00 Fan-out WLP versus Flip Chip, PoP, and SiP: When is it cost effective?
Amy P. Lujan (SavanSys Solutions LLC)
S-04
14:45 Coffee break + Sponsor's Exhibition @Conference room IV
15:00-
15:55
Hall I & II
Chairperson Kiyokazu Yasuda (Osaka University) & Shinya Takyu (Lintec Corporation)
Plenary Speech II
15:00 Plenary Speech II: A New Era in Advanced Packaging: FO-WLP Emerges!
Jan Vardaman (TechSearch International, Inc.)
P-01
15:55-
16:50
Hall I & II
Chairperson Takaaki Ishigure (Keio University) & Hideyuki Nasu (Furukawa Electric Co., Ltd.)
Plenary Speech III
15:55 Plenary Speech III: Packaging of Photonic Integrated Circuits – Technology, Design Rules and Scale-Up to Manufacturing
Peter O' Brien (Tyndall National Institute)
P-02
16:50 Break
17:00-
18:30
Early Career Researcher's (ECR) Session
(Open Forum with Beer) @Hall III
A Dual-Band Millimeter-Wave High-Gain Dielectric Resonator Antenna Using Vertical Assembly Technology 3 High Signal Integrity Design for Transmission System Including High-Parasitic Inductance Connectors 24 Optical Sensing by Exposed Core Fiber using Self-Written Waveguide 32
Ta-Yeh Lin1, Tsenchieh Chiu2, Yin-Cheng Chang1,  Da-Chiang Chang1, Mao-Hsu Yen3, Chiu-Kuo Chen4, and Ming-Shan Lin4 Shumpei Matsuoka, Shun Akutsu, and Moritoshi Yasunaga Amalina Athira Ibrahim1, Nurul Atiqah Baharudin1, Osamu Mikami1, Sumiaty Ambran1, Fauzan Ahmad1, Chiemi Fujikawa2, Mohd Adzir Mahdi3, and Mohd Hanif Yaacob3
(1. National Applied Research Laboratories, 2. National Central University, 3. National Taiwan Ocean University, 4. Metrology and Inspection, M.O.E.A) (Graduate School of Systems and Information Engineering, University of Tsukuba) (1. Universiti Teknologi Malaysia, 2. Tokai University, 3. Universiti Putra Malaysia)
A Built-in Current Sensor Made of a Comparator of Offset Cancellation Type for Electrical Interconnect Tests of 3D ICs 34 Low temperature, low pressure, fluxless and plateless Cu-Cu bonding by Cu nano particle transient liquid phase sintering 37 Microcosmic mechanisms of Cu to Cu bonding by molecular dynamic simulation. 38
Michiya Kanda1, Masaki Hashizume1, Hiroyuki Yotsuyanagi1, and Shyue-Kung Lu2 Takehiro Yamamoto1, M. Khairi Faiz1, and Makoto Yoshida2 Ying Xu Lu1, Ying-Ta Chiu1, Tang-Yuan Chen1, Meng-Kai Shih1, and Sheng-Rui Jian2
(1. Tokushima University, 2. National Taiwan Univ. of Science and Technology) (1. Graduate School of Creative Science and Engineering, Waseda University, 2. Kagami Memorial Research Institute for Materials Science and Technology, Waseda University) (1. Advanced Semiconductor Engineering, Inc., 2. I-Shou University)
Accurate Core Alignment Technique in the Mosquito Method for realizing 3-dimensional Optical Wiring 53 Low-loss Light Coupling Design for Multimode Polymer Optical Waveguides with VCSEL Light Sources 61 A System-in-Package device which can reach 200 degC at most 63
Kumi Date1,Koji Fukagata2, and Takaaki Ishigure2 Kohei Suganuma1 and Takaaki Ishigure2 Yunlong Fan Pu and Zhang Jingjing Cheng
(1. Graduate School of Science and Technology, Keio University, 2. Faculty of Science and Technology, Keio University) (1. Graduate School of Science and Technology, Keio University, 2. Faculty of Science and Technology, Keio University) (Huazhong University of Science and Technology)
Time evolution of strain distribution under bonding pad during ultrasonic wire-bonding at 200 degC 65 Low Loss Multimode Polymer Shuffling Optical Waveguide for High-Density Optical Circuit 66 Carbon Fiber Reinforced Platform for Automotive Electronics 67
Mamoru Sakamoto, Kenichi Nakadozono, Keiichiro Iwanabe, and Tanemasa Asano Kohei Abe1 and Takaaki Ishigure2 Yuki Uchida, Kiyokazu Yasuda, and Yoshinori Hirata
(Kyushu University, Japan) (1. Graduate School of Science and Technology, Keio University, 2. Faculty of Science and Technology, Keio University) (Osaka University)
Hydrogen radical treatment of printed indium solder paste for bump formation 74
Kohta Furuyama1, Eiji Higurashi1,2, and Tadatomo Suga1
(1. The University of Tokyo, 2. National Institute of Advanced Industrial Science and Technology (AIST))
18:30 Close
November 22, 2017 (Wednesday)
Hall I Hall II Hall III
9:00 Registration
9:10-
9:55
Hall I & II
Chairperson Kazuyuki Nakagawa (Renesas Electronics Corporation) & Daisuke Iguchi (Fuji Xerox Co., Ltd.)
CPMT Special Talk 
9:10 Packaging of UV Light-Emitting Diodes for Non-Lighting Applications
S.W. Ricky Lee (HKUST) 
S-03
9:55 Early Career Researcher Session Award @Hall I & II
10:00 Coffee Break + Sponsor's Exhibition @Conference room IV
10:25-
12:20
Session 13: Substrate and Interposer Session 14: Optoelectronics 3 Session 15: Power Electronics 2
Chairperson Chairperson Chairperson
Taiji Sakai (Fujitsu Laboratories Ltd.) Hideyuki Nasu (Furukawa Electric Co., Ltd.) Yoshikazu Takahashi (Tohoku University)
Kei Murayama (Shinko Electric Industries Co. Ltd.) Blanca Ruiz (Reichle & De-Massati AG) Daisuke Iguchi (Fuji Xerox Co., Ltd.)
10:25 (Invited) Development of Large-size CPU Package Structure Using Embedded Thin Film Capacitor Substrate I-14 3-Dimensionally Crossed Polymer Optical Waveguide with GI Circular Core Using the Mosquito Method 43 (Invited) An Mathematical Analysis of False Turn-On Phenomenon of GaN HEMT I-12
Masateru Koide Md. Omar Faruk Rasel and Takaaki Ishigure Masayoshi Yamamoto
(Fujitsu Advanced Technologies Ltd.) (Graduate School of Science and Technology, Keio University) (Nagoya University)
10:50 Improvement of Power Integrity with Sub-RDL STO Thin Film Capacitors for WLP/FO-WLP 75 Single-mode polymer waveguide with circular core operating at 1550 nm for high-density and high-speed optical interconnect applications 58 (Invited) Recent Progress of Power Semiconductor Devices and Their Futures I-19
Masamitsu Yoshizawa1, Atsunori Hattori1, Hirotaka Hatano1, Younggun Han2, Osamu Horiuchi2, Yoshihisa Katoh2, and Toru Nakura3 Xiao Xu, Lin Ma, and Zuyuan He Noriyuki Iwamuro
(1. Noda Techno Co. Ltd.,  2. Fukuoka University, 3. The University of Tokyo) (Shanghai Jiao Tong University) (University of Tsukuba)
11:15 Novel Ultra-fine line 2.1 D package with organic interposer 12 Polymer waveguide incorporated with europiumaluminum polymer composite for compact and efficient amplification devices 68 Low temperature and low pressure fluxless Cu-Cu bonding by Ag-based transient liquid phase sintering for high temperature application 35
Wei-Chung Chen, Chiu-Wen Lee, Min-Hua Chung, Chuang-Chi Wang, Shang-Kun Huang, and Yen-Sen Liao Yurie Yoshida1, Toshimi Fukui2, Hitomi Miki2, and Takaaki Ishigure3 M. Khairi Faiz1, Takehiro Yamamoto1, and Makoto Yoshida2
(ASE) (1. Graduate School of Science and Technology, Keio University, 2. Intelligence & Energy Materials Research laboratory, KRI, Inc., 3. Faculty of Science and Technology, Keio University) (1. Graduate School of Creative Science and Engineering, Waseda University, 2. Kagami Memorial Research Institute for Materials Science and Technology, Waseda University)
11:40 (Invited) Polymer based Photonic Integration for Sensors, Communication, and Active Optical PCB I-03 3.3kV All-SiC Module for Power Distribution Apparatus 56
Martin Schell Katsumi Taniguchi, Ryouhei Takayanagi, Satoshi Kaneko, and Naoyuki Kanai
(Fraunhofer Heinrich-Hertz-Institut) (Fuji Electric Co., Ltd.)
12:05 Interview with the Authors (Discussion after the session)
12:20 Lunch (free time)
13:15-
15:10
Session 16: Reliability Session 17: Optoelectronics 4 Session 18: Test & PI/SI
Chairperson Chairperson Chairperson
Masahiro Aoyagi (AIST) Takaaki Ishigure (Keio University) Keitaro Yamagishi (Mitsubishi Electric Corporation)
Hiroshi Yamada (Toshiba Corporation) Martin Schell (Fraunhofer Heinrich-Hertz-Institut) Kazuyuki Nakagawa (Renesas Electronics Corp.)
13:15 Analysis of the Wire/Substrate Interface during Ultrasonic Bonding Process 23 (Invited) Low-loss Multi-fiber to Waveguide Connector for On-Board Applications I-01 Resistive Open Defects Detected by Interconnect Testing Based on Charge Volume Injected to 3D ICs 36
Yangyang Longa1, Folke Denckerb2, Andreas Isaakb2, Friedrich Schneiderc3, Jörg Hermsdorfc3, Marc Wurzb2, Jens Twiefela1, and Jörg Wallascheka1 Blanca Ruiz  Kouhei Ohtani1, Naho Osato1,Masaki Hashizume1, Hiroyuki Yotsuyanagi1, and Shyue-Kung Lu2
(1. Institute of Dynamics and Vibration Research, Leibniz Universitat Hannover, 2. Institute of Micro Production Technology, Leibniz Universitat Hannover, 3. Laser Zentrum Hannover e.V.) (Reichle & De-Massati AG) (1. Tokushima University, 2. National Taiwan Univ. of Science and Technology)
13:40 Improvement of Board Level-Reliability for Fine Pitch PoP 31 Guided-wave leaking cavity-resonator-integrated guided-mode resonance filters for a compact WDM light source 40 Resonant-Plane Common-Mode Filter in Differential Lines 42
GyuWan Han, JinYoung Khim, KwangSeok Oh, WoonKab Jung, DongGun Lee, and YunAh Kim  Junichi Inoue1, Atsushi Tsuji1, Nobutaka Miyauchi1, Kenji Kintaka2, Kenzo Nishio1, and Shogo Ura1 A. Ege Engin1 and Hiroyasu Oomori2
(Amkor Technology Korea) (1. Kyoto Institute of Technology, 2. National Institute of Advanced Industrial Science and Technology) (1. San Diego State University, 2. Sumitomo Electric Industries)
14:05 New, Old JEDEC Board Level Drop Reliability Test Standards Evaluation - Measurement and Simulation Study 33 Heterogeneous and Multi-Level Integration on Mature 25Gb/s Silicon Photonic Platform 70 Power Source Consideration for 56Gbps I/O Interface 57
Ryan Chen, Ming-Han Wang, Sarah Lee, Janae Ho, and Ian Hu Stéphane Malhouitre, Bertrand Szelag, Stéphane Brision, Daivid Fowler, Cécilia Dupré, and Christophe Kopp Daisuke Ogawa, Fumiaki Fujii, Kaoru Hashimoto, Yutaka Akiyama, and Kanji Otsuka
(Advanced Semiconductor Engineering Inc.) (Univ. Grenoble Alpes, CEA-LETI, Minatec, CEA-Grenoble) (Meisei University)
14:30 Optically reconfigurable gate array driven by a lithium-ion battery 71 Analysis of Coupling Capacitance between TSV and Adjacent RDL Interconnections 69
Shinya Fujisaki and Minoru Watanabe  Zheng Mei and Gang Dong
(Shizuoka University) (Xidian University)
14:55 Interview with the Authors (Discussion after the session)
15:10 Close

 

 

 

 

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