Advanced Program
Last update: September 20, 2022
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| November 9, 2022 | (Wednesday) | |||||
| Hall I&II | Room III | Room IV | ||||
| Remote discussion via interactive voice | Remote discussion via chat | Remote discussion via chat | ||||
| 9:00 | Registration | |||||
| 10:10 | Opening Remark (General Chair) | |||||
| 10:25 | Award Ceremony | |||||
| 10:40-11:30 | Hall I & II Chairperson TBD |
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| Plenary Speech I | ||||||
| 10:40 | Plenary
Speech I : Electronic-Photonic Integration Brad Booth (Microsoft Corporation) |
P-05 | ||||
| 11:30-12:20 | Hall I & II Chairperson TBD |
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| Plenary Speech II | ||||||
| 11:30 | Plenary Speech II : TBD |
P-06 | ||||
| 12:20 | Lunch (free time) | |||||
| 13:20-15:15 | Session 1: Co-Packaged Optics | Session 2: Advanced PKG I | ||||
| Chairperson | Chairperson | |||||
| TBD | TBD | |||||
| TBD | TBD | |||||
| 13:20 | 56-Gb/s PAM4 × 8-channel VCSEL-Based Optical Transceiver for Co-Packaged Optics | 38 | Targeted Sample Preparation and Analysis of Advanced Packaging using Correlated X-Ray Microscopy and Laser FIB | 5 | ||
| Ryo Otsubo, Yuta Ishige, Kazuya Nagashima, Hideyuki Nasu | Vignesh Viswanathan1), Etsuo Maeda2), Chisato Yamamoto2), Takehide Oda2), Longan Jiao3) | |||||
| (Furukawa Electric Co., Ltd) | 1) Carl
Zeiss Pte Ltd., 2) Carl Zeiss Co. Ltd. 3) Carl Zeiss (Shanghai) Co. Ltd. |
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| 13:45 | Testing station using a 0.3-mm-pitch LGA interface for a 25-Gbaud x 16-channel CPO transceiver | 34 | PCB Embedding Technology for the Miniaturization of complex electronic Systems | 21 | ||
| Yuta Ishige, Kazuya Nagashima, Ryo Otsubo, Hideyuki Nasu | Thomas Löher1), David Schütze2), Malte Spanier2), Andreas Ostmann1), Martin Schneider-Ramelow2) | |||||
| (Furukawa Electric Co., Ltd) | 1)
Fraunhofer IZM 2) Technische Universität Berlin |
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| 14:10 | Novel Packaging Structure Using VCSEL Array and Multi-Core Fiber for Co-Packaged Optics | 36 | Low Temperature Fluxless Cu Bonding with Cu Micropillar Array | 9 | ||
| Takatoshi Yagisawa, Makoto MIyoshi, Jumpei Miike, Tomonori Azuma, Yoshiyuki Harada, Satoshi Ide, Ken Morito | Han Jiang, Liguo Zhao, Changqing Liu, Zhaoxia Zhou | |||||
| (Fujitsu Optical Components Limited) | (Loughborough University) | |||||
| 14:35 | Design of CPO Daughter Board with FPGA and 25-Gbaud x 16-Channel Ultra-Compact Optical Transceivers | 48 | Low-temperature and rapid direct bonding through nano-Ag coating for high-temperature and high-power density electronics packaging | 14 | ||
| Kei Takahashi1), Kensuke Miura1), Hikaru Nakajima1), Naoki Soya1), Satoru Torimitsu1), Yuta Ishige1), Kazuya Nagashima1), Hideyuki Nasu1), Shoji Fukutomi2) | Canyu Liu, Allan Liu, Zhaoxia Zhou, Changqing Liu | |||||
| 1) Furukawa Electric Co., Ltd 2) Furukawa Network Solutions Corporation |
(Loughborough University) | |||||
| 15:00 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | Interview with the Authors (Discussion after the session) | ||||
| 15:15 | Coffee break + Sponsor's Exhibition | |||||
| 15:25-17:20 | Session 3: Bioelectronics | Session 4: Optical Waveguide technology | ||||
| Chairperson | Chairperson | |||||
| Beomjoon Kim (The University of Tokyo) | TBD | |||||
| Shigenori Aoki (LINTEC Corporation) | TBD | |||||
| 15:25 | (Invited) Chemical sensors based on organic field-effect transistors for real-sample analysis | I-07 | Design and Fabrication of Three-dimensional Polymer Optical Waveguide-based Fan-in/out Device for Multicore Fibers | 17 | ||
| Tsuyoshi Minami | Yuto Yamaguchi, Sho Yakabe, Takaaki Ishigure | |||||
| (The University of Tokyo) | (Keio University) | |||||
| 15:50 | (Invited) Rubber-like stretchable electronics for skin-conformable wearable devices | I-08 | Fabrication for Y-branched Polymer Optical Waveguide Using the Imprint Method and Its Application for Mode Division Multiplexing Devices | 20 | ||
| Naoji Matsuhisa | Shinnosuke Ono, Takaaki Ishigure | |||||
| (The University of Tokyo) | (Keio University) | |||||
| 16:15 | Microfluidic technology for making strings made of cells | 30 | Optical polymer waveguides with precise core location by mechanical planarization of bottom clad layer for efficient and uniform optical coupling | 47 | ||
| Katsuo Mogi, Hiroyuki Kimura, Naoki Takada | Taro Itatani, Takeru Amano | |||||
| (Tokyo Denki University) | (AIST) | |||||
| 16:40 | Studying the effect of electrodes on the electrical impedance measurement of meat | 11 | (Invited) Optical coupling structures printed with Two-Photon-Polymerization | I-12 | ||
| Dang Thanh Trung, Nguyen Phan Kien, Hoang ChuDuc | Jörg Smolenski | |||||
| (Hanoi University of Science & Technology) | (Nanoscribe GmbH & Co. KG) | |||||
| 17:05 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | Interview with the Authors (Discussion after the session) | ||||
| 17:20 | Coffee break + Sponsor's Exhibition | |||||
| 17:30-18:20 | Hall I & II Chairperson Beomjoon Kim (The University of Tokyo) & Takaaki Ishigure (Keio University) |
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| Plenary Speech III | ||||||
| 17:30 | Plenary Speech III: Microfabricated Optical
Probes for Neuromodulation Chang-Hyeon Ji (Ewha Womans University) |
P-02 | ||||
| 19:00 | Welcome Reception | |||||
| 21:00 | Close | |||||
| November 10, 2022 | (Thursday) | |||||
| Hall I&II | Room III | Room IV | ||||
| Remote discussion via interactive voice | Remote discussion via chat | Remote discussion via chat | ||||
| 9:00 | Registration | |||||
| 9:20-10:10 | Hall I & II Chairperson Eiji Higurashi (Tohoku University) & Shinya Takyu(Lintec corporation) |
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| Plenary Speech IV | ||||||
| 9:20 | Plenary Speech IV:Semiconductor Packaging - The
Future is Now! Madhavan Swaminathan (Georgia Institute of Technology) |
P-01 | ||||
| 10:10-11:00 | Hall I & II Chairperson TBD |
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| Plenary Speech V | ||||||
| 10:10 | Plenary Speech V: Heterogenous Package
Integration for Consumer and Automotive Sensor Adrian Arcedera (Amkor Technology, Inc.) |
P-03 | ||||
| 11:00 | Coffee break + Sponsor's Exhibition | |||||
| 11:10-12:40 | Session 5: Advanced PKG II | Session 6: Silicon Photonics Transceivers & Laser Sources | ||||
| Chairperson | Chairperson | |||||
| TBD | TBD | |||||
| TBD | TBD | |||||
| 11:10 | Surface Activated Bonding of ALD Al2O3 films | 41 | (Invited) Packaging technologies for high-bandwidth silicon photonic datacom transceivers | I-10 | ||
| Junsha Wang1), Ryo Takigawa2), Tadatomo Suga1) | Hiren Thacker | |||||
| 1) Meisei Univerisity, 2) Kyushu University | (Cisco Systems, Inc.) | |||||
| 11:35 | Control of Adsorbed Water on Wafers for Surface Activated Bonding | 46 | 8-channel CWDM TOSA for CPO External Laser Sources | 19 | ||
| Kai Takeuchi1), Junsha Wang1), Akira Yamauchi2), Tadatomo Suga1) | Taketsugu Sawamura1), Kazuhiko Kashima1), Kyoko Nagai1), Nitidet Thudsalingkarnsakul2), Rattanaporn Suksomboon2), Sanguan Anantathanasarn2), Hideyuki Nasu1) | |||||
| 1) Meisei University, 2) Bondtec. Co. Ltd. | 1)
Furukawa Electric Co., Ltd 2) Furukawa FITEL (Thailand) Co.,Ltd, |
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| 12:00 | Study on DFN Package Interfacial Delamination Between Lead Frame and Epoxy Mold Compound | 2 | Low-loss, polarization-independent spot-size converter manufacturable with a 0.18 μm CMOS process | 22 | ||
| Siying Wu, ShwuMiin Tan, Jianlu Xue, Zhigang Li | Reona Motoji, Hirotaka Uemura, Naoki Matsui, Dan Maeda, Tomoya Sugita | |||||
| (Nexperia China Ltd.) | (Kyocera Corporation) | |||||
| 12:25 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | Interview with the Authors (Discussion after the session) | ||||
| 12:40 | Platinum Sponsors' Seminar (with a light meal) @Hall I & II | |||||
| 13:40-15:10 | Session 7: Automotive | Session 8: Emerging process | ||||
| Chairperson | Chairperson | |||||
| Yutaka Uematsu (Hitachi,
Ltd.) |
Shinya Takyu (LINTEC Corporation) |
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| Masayoshi Yamamoto (Nagoya University) | Naoko Araki (Daicel Corporation) | |||||
| 13:40 | (Invited) Trends in reverb chamber Testing | I-01 | (Invited) TBD | I-02 | ||
| Garth D'Abreu | Tsutomu Matsumoto | |||||
| (ETS-Lindgren) | (Yokohama National University) | |||||
| 14:05 | Electromagnetic Noise Evaluation of Transceiver IC and Communication Modules in CAN-FD Communication | 33 | Direct write electrospinning on insulating surfaces | 15 | ||
| Shohei Nishida, Yuki Fukumoto, Tohlu Matsushima | Céline Mandon, Laura Bourdon, Saloua Saghir, Selma Bounabi, Julia Brando, Vincent Salles | |||||
| (Kyushu Institute of Technology) | (Université Claude Bernard Lyon 1) | |||||
| 14:30 | Improving traffic participant safety using connected active safety techniques and cooperative perception | 31 | Sidewall Chipping Investigation & Challenges on 100um Thin Low-K Wafer with DAF | 4 | ||
| Robert Gee | hongbin xia | |||||
| (Continental Automotive Systems, Inc.) | (Nexperia) | |||||
| 14:55 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | Interview with the Authors (Discussion after the session) | ||||
| 15:10 | Coffee break + Sponsor's Exhibition | |||||
| 15:20-16:10 | Hall I & II Masayoshi Yamamoto (Nagoya University) & Yutaka Uematsu (Hitachi, Ltd.) |
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| Plenary Speech VI | ||||||
| 15:20 | Plenary Speech VI: Dynamic Wireless Power
Transfer to accelerate carbon neutrality ～Latest Trends in Japan and the world～ Kaori Takahashi (Mitsubishi Research Institute, Inc.) |
P-04 | ||||
| 16:10-17:05 | Hall I & II Chairperson Shinya Takyu (LINTEC Corporation) & Eiji Higurashi (Tohoku University) |
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| IEEE EPS Special Speech I & II | ||||||
| 16:10 | IEEE EPS Special Speech I: TBD Kitty Pearsall (Boss Precision, Inc.) |
S-03 | ||||
| 16:25 | IEEE EPS Special Speech II: TBD Chris Bailey (University of Greenwich) |
S-02 | ||||
| 17:05-18:00 | Early Career Researcher's (ECR) Session - On-demand viewing available | |||||
| On-site/ on-demand poster presentation | ||||||
| Micro-displacement sensing technique using Fabry-Pérot interferometer with a relay optical fiber | 7 | Study on electrical characterization of hexagonal-BN | 10 | Polymer Tapered Pillar Grown from SMF Core for Silicon-photonics Chip Coupling | 24 | |
| Yuya Mori, Takeru Fukahori, Ryo Nagase | Riki Yamanishi1), Soshi Motoda1), Satoko Shinkai1), Satoshi matsumoto1), Masataka Hasegawa2) | Taiga Kurisawa1), Yoshiki Kamiura1), Chiemi Fujikawa1), Osamu Mikami2) | ||||
| (Chiba Institute of Technology) | 1) Graduate School of Kyushu Institute of Technology 2)National Institute of Advanced Industrial Science and technology | 1) Tokai
University 2) Universiti Teknologie Malaysia |
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| Polymer Microlens with Pillar as Spot Size Expander Applicable to Silicon Photonics | 25 | Driver's Sleepiness Estimation Using Millimeter Wave Radar and Camera | 26 | Self-localization with Omnidirectional Camera using Colored Point Cloud | 28 | |
| Yoshiki Kamiura1), Taiga Kurisawa1), Chiemi Fujikawa1), Osamu Mikami2) | Katsuki Kubo, Toshio Ito | Shell Yamauchi, Toshio Ito | ||||
| 1)
Tokai University 2) Universiti Teknologie Malaysia |
(Shibaura Institute of Technology) | (Shibaura Institute of Technology) | ||||
| Fabrication for low-loss polymer optical waveguide with vertically 90° bent core | 32 | Investigation of fabrication conditions for Y-branched polymer optical waveguides using the Mosquito method | 35 | Research on Implementing of Human Ethics in Automated Driving Using Driver's Choice Behavior | 40 | |
| Daiki Suemori, Maho Ishi, Naohiro Kohm, Takaaiki Ishigure | Kentaro Sekitani, Ryosuke Hatai, Takaaki Ishigure | Kaito Kusakari, Toshio Ito | ||||
| (Keio University) | (Keio University) | (Shibaura Institute of Technology) | ||||
| Detectability of Open Defects at Interconnects between Dies in 3D Stacked ICs with Relaxation Oscillators | 44 | |||||
| Masao Ohmatsu1), Fumiya Sako1), Yuki Ikiri1), Hiroyuki Yotsuyanagi1), Shyue-Kung Lu2), Masaki Hashizume1) | ||||||
| 1)
Tokushima University 2) National Taiwan University |
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| 18:10 | Close | |||||
| November 11, 2022 | (Friday) | |||||
| Hall I&II | Room III | Room IV | ||||
| Remote discussion via interactive voice | Remote discussion via chat | Remote discussion via chat | ||||
| 9:00 | Registration | |||||
| 9:20 | ECR Award Ceremony | |||||
| 9:30-10:10 | Hall I & II Chairperson Shinya Takyu (LINTEC Corporation) & Eiji Higurashi (Tohoku University) |
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| IEEE EPS Special Speech III | ||||||
| 9:30 | IEEE EPS Special Speech III: 2.5D/3D EMI/EMC Recent
Developments in 5G and B5G Sam Karikalan (Broadcom Inc.) |
S-01 | ||||
| 10:10-10:50 | Hall I & II Chairperson TBD |
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| Special Speech | ||||||
| 10:10 | Heterogeneous Integration Special Speech :
Heterogeneous Integration Enabling High Performance AI Hardware Dr. Takashi Hisada (IBM Research-Tokyo) |
S-04 | ||||
| 10:50 | Coffee break + Sponsor's Exhibition | |||||
| 11:00-12:55 | Session 9: Novel materials | Session 10: Bioelectronics | Session 11: High-Speed Electrical Interconnect | |||
| Chairperson | Chairperson | Chairperson | ||||
| Kei Murayama(SHINKO ELECTRIC INDUSTRIES CO., LTD.) | Yoshio Nogami (Nogami Inter Connect Co.Ltd.) | Yoichiro Kurita (Tokyo Institute of Technology) | ||||
| Satomi Kawamoto (Namics Corporation) | Beomjoon Kim (The University of Tokyo) | Ryo Sakamaki (AIST) | ||||
| 11:00 | (Invited) Development of oxide glass-ceramic derived all-solid-state Na battery | I-03 | Development of a simple glucose sensor patch using low
melting-point polymer's porous microneedles for pre-diabetic patients |
12 | (Invited) AI-Accelerator Proof of Concept by a Multi-IP Chip Project | I-09 |
| Tsuyoshi Honma | Yosuke Koma, Yuko Tsuruma, Jongho Park, Shigenori Aoki, Shinya Takyu, Beomjoon Kim | Shin-ichi O'uchi | ||||
| (Nagaoka University of Technology) | (LINTEC Corporation Tokyo) | (AIST) | ||||
| 11:25 | (Invited) Advanced Insulation Materials for Next IC Package | I-04 | Fabrication for circular cross-sectional microchannels and their application for on-off valves | 18 | A Study on Alternative Substrate for FCBGA | 6 |
| Shiro Tatsumi | Kaori Uehara, Yutaka Hori, Takaaki Ishigure | Li-Chieh Hung1), PO-I Wu1), Hung-Chun Kuo1), Ming-Fong Jhong1), Chen-Chao Wang1), Si Min Wang2) | ||||
| (Ajinomoto Co., Inc.) | (Keio University) | 1)
ASE 2) Fengjia Chia University |
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| 11:50 | Solder Joint solder gap elimination in Flipchip Leadless Package | 1 | An Oxytocin sensor based on an organic field-effect transisitor functionalized with a molecularly imprinted polymer | 42 | A housing design to optimize heat dissipation and reduced noise for LTE card module in communication terminal | 8 |
| Lay Yeap Lim1), Chia Yeong Loo1), Werner Reiss2) | Qi Zhou, Tsuyoshi Minami | Atsushi Nakamura, Takashi Yajima, Hideki Osaka | ||||
| 1) Infineon Technologies Sdn Bhd 2) Infineon Technologies AG |
(The University of Tokyo) | Ultimate Technologies Incorporated | ||||
| 12:15 | New die bonding material with PSQ as a main agent having high heat dissipation for LED device application | 3 | Porosity control of polylactic acid porous microneedles using microfluidic technology | 45 | Introducing Sum of Squares Partial Fractions: Application in Passive Modeling of Interconnects in Heterogeneous Integration | 37 |
| Yoshiki Furukawa, Manabu Miyawaki, Susumu Miura, Hironori Shizuhata, Naoya Saiki | Boyu Qin, Jongho Park, Heyi Jing, Leilei Bao, Beomjoon Kim | Francisco Coronado, Arif Engin | ||||
| (Lintec corporation) | (The University of Tokyo) | (San Diego State University) | ||||
| 12:40 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | Interview with the Authors (Discussion after the session) | Interview with the Authors (Discussion after the session) | |||
| 12:55 | Lunch (free time) | |||||
| 13:55-15:50 | Session 12: Power Electronics | Session 13: Integrated Photonics technology | ||||
| Chairperson | Chairperson | |||||
| TBD | TBD | |||||
| TBD | TBD | |||||
| 13:55 | (Invited) Application of SiC power devices to ultra-high voltage equipment | I-06 | (Invited) JEDEC compatible high temperature thermoplastic to benefit mass scalability and design freedom for production of optical elements | I-11 | ||
| Takashi Nakamura | Florian Jung | |||||
| (NexFi Technology Inc., Osaka University) | (SHPP Germany GmbH) | |||||
| 14:20 | Evaluation of electrical and thermal properties of POL-kW by simulation and actual measurement | 39 | International standards to enable the exploitation of emerging integrated photonic technologies for future hyperscale data centres | 43 | ||
| Youichi Nishihara, Shingo Hayashibe, Bando Koji | Richard Pitwon1), Bernard Lee2) | |||||
| (SHINKO ELECTRIC INDUSTRIES CO., LTD.) | 1)
Resolute Photonics 2) Senko Advanced Components |
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| 14:45 | A LOAD VARIABLE NOISE-SOURCE EQUIVALENT CIRCUIT MODEL FOR DC-DC CONVERTER BASED ON CUBIC SPLINE INTERPOLATION METHOD | 16 | Demonstration of small-aperture cavity-resonator-integrated guided-mode resonance mirror with grating apodization for vertical-external-cavity surface-mounted laser | 23 | ||
| Shuqi Zhang, Kengo Iokibe, Yoshitaka Toyota | Akari Watanabe1), Keisuke Ozawa1), Shunsuke Teranishi1), Aika Taniguchi1), Junichi Inoue1), Kenji Kintaka2), Shogo Ura1) | |||||
| (Okayama University) | 1) Kyoto
Institute of Technology 2) National Institute of Advanced Industrial Science and Technology |
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| 15:10 | (Invited) Material Solutions for High-reliability and High-temperature Power Electronics | I-05 | Time of flight three-dimensional imaging camera using compressive sampling technique with sparse frequency intensity modulation light source | 13 | ||
| Aarief Syed-Khaja | Quang Duc Pham1), Yoshio Hayasaki2) | |||||
| (Heraeus Germany GmbH & Co. KG) | 1)
Vietnam National University 2) Utsunomiya University |
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| 15:35 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | Interview with the Authors (Discussion after the session) | ||||
| 15:50 | Close | |||||