Advanced Program

Last update: August 5, 2022

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November 9, 2022 (Wednesday)
Hall I&II Room III Room IV
Remote discussion via interactive voice Remote discussion via chat Remote discussion via chat
9:00 Registration
10:10 Opening Remark (General Chair)
10:25 Award Ceremony
10:40-11:30 Hall I & II
Chairperson TBD
Plenary Speech I 
10:40 Plenary Speech I : Electronic-Photonic Integration
Brad Booth (Microsoft Corporation)
P-05
11:30-12:20 Hall I & II
Chairperson TBD
Plenary Speech II
11:30 Plenary Speech II : TBD
P-06
12:20 Lunch (free time)
13:20-15:15 Session 1: Co-Packaged Optics  Session 2: Advanced PKG I
Chairperson Chairperson
TBD TBD
TBD TBD
13:20 56-Gb/s PAM4 × 8-channel VCSEL-Based Optical Transceiver for Co-Packaged Optics 38 Targeted Sample Preparation and Analysis of Advanced Packaging using Correlated X-Ray Microscopy and Laser FIB 5
Ryo Otsubo, Yuta Ishige, Kazuya Nagashima, Hideyuki Nasu Vignesh Viswanathan1), Etsuo Maeda2), Chisato Yamamoto2), Takehide Oda2), Longan Jiao3)
(Furukawa Electric Co., Ltd) 1) Carl Zeiss Pte Ltd., 2) Carl Zeiss Co. Ltd.
3) Carl Zeiss (Shanghai) Co. Ltd.
13:45 Testing station using a 0.3-mm-pitch LGA interface for a 25-Gbaud x 16-channel CPO transceiver 34 PCB Embedding Technology for the Miniaturization of complex electronic Systems 21
Yuta Ishige, Kazuya Nagashima, Ryo Otsubo, Hideyuki Nasu Thomas Löher1), David Schütze2), Malte Spanier2), Andreas Ostmann1), Martin Schneider-Ramelow2)
(Furukawa Electric Co., Ltd) 1) Fraunhofer IZM
2) Technische Universität Berlin
14:10 Novel Packaging Structure Using VCSEL Array and Multi-Core Fiber for Co-Packaged Optics 36 Low Temperature Fluxless Cu Bonding with Cu Micropillar Array 9
Takatoshi Yagisawa, Makoto MIyoshi, Jumpei Miike, Tomonori Azuma, Yoshiyuki Harada, Satoshi Ide, Ken Morito Han Jiang, Liguo Zhao, Changqing Liu, Zhaoxia Zhou
(Fujitsu Optical Components Limited) (Loughborough University)
14:35 Design of CPO Daughter Board with FPGA and 25-Gbaud x 16-Channel Ultra-Compact Optical Transceivers 48 Low-temperature and rapid direct bonding through nano-Ag coating for high-temperature and high-power density electronics packaging 14
Kei Takahashi1), Kensuke Miura1), Hikaru Nakajima1), Naoki Soya1), Satoru Torimitsu1), Yuta Ishige1), Kazuya Nagashima1), Hideyuki Nasu1), Shoji Fukutomi2) Canyu Liu, Allan Liu, Zhaoxia Zhou, Changqing Liu
1) Furukawa Electric Co., Ltd
2) Furukawa Network Solutions Corporation
(Loughborough University)
15:00 Interview with the Authors (Discussion after the session) + Sponsor's Exhibition  Interview with the Authors (Discussion after the session) 
15:15 Coffee break + Sponsor's Exhibition
15:25-17:20 Session 3: Bioelectronics Session 4: Optical Waveguide technology
Chairperson Chairperson
Beomjoon Kim (The University of Tokyo) TBD
Shigenori Aoki (LINTEC Corporation) TBD
15:25 (Invited) Chemical sensors based on organic field-effect transistors for real-sample analysis I-07 Design and Fabrication of Three-dimensional Polymer Optical Waveguide-based Fan-in/out Device for Multicore Fibers 17
Tsuyoshi Minami Yuto Yamaguchi, Sho Yakabe, Takaaki Ishigure
(The University of Tokyo) (Keio University)
15:50 (Invited) Rubber-like stretchable electronics for skin-conformable wearable devices I-08 Fabrication for Y-branched Polymer Optical Waveguide Using the Imprint Method and Its Application for Mode Division Multiplexing Devices 20
Naoji Matsuhisa Shinnosuke Ono, Takaaki Ishigure
(The University of Tokyo) (Keio University)
16:15 Microfluidic technology for making strings made of cells 30 Optical polymer waveguides with precise core location by mechanical planarization of  bottom clad layer for efficient and uniform optical coupling 47
Katsuo Mogi, Hiroyuki Kimura, Naoki Takada Taro Itatani, Takeru Amano
(Tokyo Denki University) (AIST)
16:40 Studying the effect of electrodes on the electrical impedance measurement of meat 11 (Invited) TBD I-12
Dang Thanh Trung, Nguyen Phan Kien, Hoang ChuDuc Jörg Smolenski
(Hanoi University of Science & Technology) (Nanoscribe GmbH & Co. KG)
17:05 Interview with the Authors (Discussion after the session) + Sponsor's Exhibition  Interview with the Authors (Discussion after the session) 
17:20 Coffee break + Sponsor's Exhibition
17:30-18:20 Hall I & II
Chairperson Beomjoon Kim (The University of Tokyo) & Takaaki Ishigure (Keio University)
Plenary Speech III
17:30 Plenary Speech III: Microfabricated Optical Probes for Neuromodulation
Chang-Hyeon Ji (Ewha Womans University)
P-02
19:00 Welcome Reception
21:00 Close
November 10, 2022 (Thursday)
Hall I&II Room III Room IV
Remote discussion via interactive voice Remote discussion via chat Remote discussion via chat
9:00 Registration
9:20-10:10 Hall I & II
Chairperson Eiji Higurashi (Tohoku University) & Shinya Takyu(Lintec corporation)
Plenary Speech IV
9:20 Plenary Speech IV:Semiconductor Packaging - The Future is Now!
Madhavan Swaminathan (Georgia Institute of Technology)
P-01
10:10-11:00 Hall I & II
Chairperson TBD
Plenary Speech V
10:10 Plenary Speech V: Heterogenous Package Integration for Consumer and Automotive Sensor
Adrian Arcedera (Amkor Technology, Inc.)
P-03
11:00 Coffee break + Sponsor's Exhibition
11:10-12:40 Session 5: Advanced PKG II Session 6: Silicon Photonics Transceivers & Laser Sources 
Chairperson Chairperson
TBD TBD
TBD TBD
11:10 Surface Activated Bonding of ALD Al2O3 films 41 (Invited) Packaging technologies for high-bandwidth silicon photonic datacom transceivers I-10
Junsha Wang1), Ryo Takigawa2), Tadatomo Suga1) Hiren Thacker
1) Meisei Univerisity, 2) Kyushu University (Cisco Systems, Inc.)
11:35 Control of Adsorbed Water on Wafers for Surface Activated Bonding 46 8-channel CWDM TOSA for CPO External Laser Sources 19
Kai Takeuchi1), Junsha Wang1), Akira Yamauchi2), Tadatomo Suga1) Taketsugu Sawamura1), Kazuhiko Kashima1), Kyoko Nagai1), Nitidet Thudsalingkarnsakul2), Rattanaporn Suksomboon2), Sanguan Anantathanasarn2), Hideyuki Nasu1)   
1) Meisei University, 2) Bondtec. Co. Ltd. 1) Furukawa Electric Co., Ltd
2) Furukawa FITEL (Thailand) Co.,Ltd, 
12:00 Study on DFN Package Interfacial Delamination Between Lead Frame and Epoxy Mold Compound 2 Low-loss, polarization-independent spot-size converter manufacturable with a 0.18 μm CMOS process 22
Siying Wu, ShwuMiin Tan, Jianlu Xue, Zhigang Li Reona Motoji, Hirotaka Uemura, Naoki Matsui, Dan Maeda, Tomoya Sugita
(Nexperia China Ltd.) (Kyocera Corporation)
12:25 Interview with the Authors (Discussion after the session) + Sponsor's Exhibition  Interview with the Authors (Discussion after the session) 
12:40 Platinum Sponsors' Seminar (with a light meal) @Hall I & II
13:40-15:10 Session 7: Automotive Session 8: Emerging process
Chairperson Chairperson
Yutaka Uematsu (Hitachi, Ltd.)
Shinya Takyu (LINTEC Corporation)
Masayoshi Yamamoto (Nagoya University) Naoko Araki (Daicel Corporation)
13:40 (Invited) Trends in reverb chamber Testing I-01 (Invited) TBD I-02
Garth D'Abreu Tsutomu Matsumoto
(ETS-Lindgren) (Yokohama National University)
14:05 Electromagnetic Noise Evaluation of Transceiver IC and Communication Modules in CAN-FD Communication 33 Direct write electrospinning on insulating surfaces 15
Shohei Nishida, Yuki Fukumoto, Tohlu Matsushima Céline Mandon, Laura Bourdon, Saloua Saghir, Selma Bounabi, Julia Brando, Vincent Salles
(Kyushu Institute of Technology) (Université Claude Bernard Lyon 1)
14:30 Improving traffic participant safety using connected active safety techniques and cooperative perception 31 Sidewall Chipping Investigation & Challenges on 100um Thin Low-K Wafer with DAF 4
Robert Gee hongbin xia
(Continental Automotive Systems, Inc.) (Nexperia)
14:55 Interview with the Authors (Discussion after the session) + Sponsor's Exhibition  Interview with the Authors (Discussion after the session) 
15:10 Coffee break + Sponsor's Exhibition
15:20-16:10 Hall I & II
Masayoshi Yamamoto (Nagoya University) & Yutaka Uematsu (Hitachi, Ltd.)
Plenary Speech VI
15:20 Plenary Speech VI: Dynamic Wireless Power Transfer to accelerate carbon neutrality ~Latest Trends in Japan and the world~
Kaori Takahashi (Mitsubishi Research Institute, Inc.)
P-04
16:05-17:10 Hall I & II
Chairperson Shinya Takyu (LINTEC Corporation)
IEEE EPS Special Speech I & II
16:05 IEEE EPS Special Speech I: TBD
Chris Bailey (University of Greenwich)
S-02
16:55 IEEE EPS Special Speech II: TBD
Kitty Pearsall (Boss Precision, Inc.)
S-03
17:10-18:00 Early Career Researcher's (ECR) Session - On-demand viewing available
On-site/ on-demand poster presentation
Micro-displacement sensing technique using Fabry-Pérot interferometer with a relay optical fiber 7 Study on electrical characterization of hexagonal-BN 10 Polymer Tapered Pillar Grown from SMF Core for Silicon-photonics Chip Coupling 24
Yuya Mori, Takeru Fukahori, Ryo Nagase Riki Yamanishi1), Soshi Motoda1), Satoko Shinkai1), Satoshi matsumoto1), Masataka Hasegawa2) Taiga Kurisawa1), Yoshiki Kamiura1), Chiemi Fujikawa1), Osamu Mikami2)
(Chiba Institute of Technology) 1) Graduate School of Kyushu Institute of Technology                                                          2)National Institute of Advanced Industrial Science and technology 1) Tokai University
2) Universiti Teknologie Malaysia
Polymer Microlens with Pillar as Spot Size Expander Applicable to Silicon Photonics 25 Driver's Sleepiness Estimation Using Millimeter Wave Radar and Camera 26 Self-localization with Omnidirectional Camera using Colored Point Cloud 28
Yoshiki Kamiura1), Taiga Kurisawa1), Chiemi Fujikawa1), Osamu Mikami2) Katsuki Kubo, Toshio Ito Shell Yamauchi, Toshio Ito
1) Tokai University
2) Universiti Teknologie Malaysia
(Shibaura Institute of Technology) (Shibaura Institute of Technology)
Fabrication for low-loss polymer optical waveguide with vertically 90° bent core 32 Investigation of fabrication conditions for Y-branched polymer optical waveguides using the Mosquito method 35 Research on Implementing of Human Ethics in Automated Driving Using Driver's Choice Behavior 40
Daiki Suemori, Maho Ishi, Naohiro Kohm, Takaaiki Ishigure Kentaro Sekitani, Ryosuke Hatai, Takaaki Ishigure Kaito Kusakari, Toshio Ito
(Keio University) (Keio University) (Shibaura Institute of Technology)
Detectability of Open Defects at Interconnects between Dies in 3D Stacked ICs with Relaxation Oscillators 44
Masao Ohmatsu1), Fumiya Sako1), Yuki Ikiri1), Hiroyuki Yotsuyanagi1), Shyue-Kung Lu2), Masaki Hashizume1)
1) Tokushima University
2) National Taiwan University
18:10 Close
November 11, 2022 (Friday)
Hall I&II Room III Room IV
Remote discussion via interactive voice Remote discussion via chat Remote discussion via chat
9:00 Registration
9:20 ECR Award Ceremony
9:30-10:10 Hall I & II
Chairperson Shinya Takyu (LINTEC Corporation)
IEEE EPS Special Speech III
9:30 IEEE EPS Special Speech III: 2.5D/3D EMI/EMC Recent Developments in 5G and B5G
Sam Karikalan (Broadcom Inc.)
S-01
10:10-10:50 Hall I & II
Chairperson TBD
Special Speech
10:10 TBD S-04
10:50 Coffee break + Sponsor's Exhibition 
11:00-12:55 Session 9: Novel materials     Session 10: Bioelectronics Session 11: High-Speed Electrical Interconnect
Chairperson Chairperson Chairperson
Kei Murayama(SHINKO ELECTRIC INDUSTRIES CO., LTD.) Yoshio Nogami (Nogami Inter Connect Co.Ltd.) Yoichiro Kurita (Tokyo Institute of Technology)
Satomi Kawamoto (Namics Corporation)  Beomjoon Kim (The University of Tokyo) Ryo Sakamaki (AIST)
11:00 (Invited) Development of oxide glass-ceramic derived all-solid-state Na battery I-03 Development of a simple glucose sensor patch using low melting-point polymer's porous microneedles for pre-diabetic
patients
12 (Invited) AI-Accelerator Proof of Concept by a Multi-IP Chip Project and Its Extension by Chiplets I-09
Tsuyoshi Honma Yosuke Koma, Yuko Tsuruma, Jongho Park, Shigenori Aoki, Shinya Takyu, Beomjoon Kim Shin-ichi O'uchi
(Nagaoka University of Technology) (LINTEC Corporation Tokyo) (AIST)
11:25 (Invited) Advanced Insulation Materials for Next IC Package I-04 Fabrication for circular cross-sectional microchannels and their application for on-off valves 18 A Study on Alternative Substrate for FCBGA 6
Shiro Tatsumi Kaori Uehara, Yutaka Hori, Takaaki Ishigure Li-Chieh Hung1), PO-I Wu1), Hung-Chun Kuo1), Ming-Fong Jhong1), Chen-Chao Wang1), Si Min Wang2)
(Ajinomoto Co., Inc.) (Keio University) 1) ASE
2) Fengjia Chia University
11:50 Solder Joint solder gap elimination in Flipchip Leadless Package 1 An Oxytocin sensor based on an organic field-effect transisitor functionalized with a molecularly imprinted polymer 42 A housing design to optimize heat dissipation and reduced noise for LTE card module in communication terminal 8
Lay Yeap Lim1), Chia Yeong Loo1), Werner Reiss2) Qi Zhou, Tsuyoshi Minami Atsushi Nakamura, Takashi Yajima, Hideki Osaka
1) Infineon Technologies Sdn Bhd
2) Infineon Technologies AG
(The University of Tokyo) Ultimate Technologies Incorporated
12:15 New die bonding material with PSQ as a main agent having high heat dissipation for LED device application 3 Porosity control of polylactic acid porous microneedles using microfluidic technology 45 Introducing Sum of Squares Partial Fractions: Application in Passive Modeling of Interconnects in Heterogeneous Integration 37
Yoshiki Furukawa, Manabu Miyawaki, Susumu Miura, Hironori Shizuhata, Naoya Saiki Boyu Qin, Jongho Park, Heyi Jing, Leilei Bao, Beomjoon Kim Francisco Coronado, Arif Engin
(Lintec corporation) (The University of Tokyo) (San Diego State University)
12:40 Interview with the Authors (Discussion after the session) + Sponsor's Exhibition  Interview with the Authors (Discussion after the session)  Interview with the Authors (Discussion after the session) 
12:55 Lunch (free time)
13:55-15:50 Session 12: Power Electronics Session 13: Integrated  Photonics technology
Chairperson Chairperson
TBD TBD
TBD TBD
13:55 (Invited) Application of SiC power devices to ultra-high voltage equipment I-06 (Invited) JEDEC compatible high temperature thermoplastic to benefit mass scalability and design freedom for production of optical elements I-11
Takashi Nakamura Florian Jung
(NexFi Technology Inc., Osaka University) (SHPP Germany GmbH)
14:20 Evaluation of electrical and thermal properties of POL-kW by simulation and actual measurement 39 International standards to enable the exploitation of emerging integrated photonic technologies for future hyperscale data centres 43
Youichi Nishihara, Shingo Hayashibe, Bando Koji Richard Pitwon1), Bernard Lee2)
(SHINKO ELECTRIC INDUSTRIES CO., LTD.) 1) Resolute Photonics
2) Senko Advanced Components
14:45 A LOAD VARIABLE NOISE-SOURCE EQUIVALENT CIRCUIT MODEL FOR DC-DC CONVERTER BASED ON CUBIC SPLINE INTERPOLATION METHOD 16 Demonstration of small-aperture cavity-resonator-integrated guided-mode resonance mirror with grating apodization for vertical-external-cavity surface-mounted laser 23
Shuqi Zhang, Kengo Iokibe, Yoshitaka Toyota Akari Watanabe, Keisuke Ozawa, Shunsuke Teranishi, Junichi Inoue, Kenji Kintaka, Shogo Ura
(Okayama University) (Kyoto Institute of Technology)
15:10 (Invited) JEDEC compatible high temperature thermoplastic to benefit mass scalability and design freedom for production of optical elements I-05 Time of flight three-dimensional imaging camera using compressive sampling technique with sparse frequency intensity modulation light source 13
Aarief Syed-Khaja Quang Duc Pham1), Yoshio Hayasaki2)
(Heraeus Germany GmbH & Co. KG) 1) Vietnam National University
2) Utsunomiya University
15:35 Interview with the Authors (Discussion after the session) + Sponsor's Exhibition  Interview with the Authors (Discussion after the session) 
15:50 Close
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