Advanced Program
Last update: September 25, 2023
Click here to download the PDF file.
| November 15, 2023 | (Wednesday) | |||||
| 4F/5F Main Hall I | 1F Room I | 1F Room II | ||||
| On-site presentation | On-site presentation | On-site presentation | ||||
| 9:00 | Registration | |||||
| 10:20 | Opening Remark (General Chair) (Hall I) | |||||
| 10:35 | Award Ceremony (Hall I) | |||||
| 10:50-12:30 | Hall I Chairperson Hideyuki Nasu (Furukawa Electric Co., Ltd.), Takaaki Ishigure (Keio University) |
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| Plenary Speech I & II | ||||||
| 10:50 | Plenary
Speech I : Silicon Photonics for Chiplet (TBD) Mark Wade (Ayar Lab) |
P-02 | ||||
| 11:40 | Plenary
Speech II : Co-Package Optics is the big next thing: What happened? Daniel M. Kuchta (IBM T. J. Watson Research Center) |
P-03 | ||||
| 12:30-12:50 | Platinum
Sponsors' Seminar (with a light meal) @Meetiing Room 1 Title : TBD (TBD) |
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| 12:55-13:15 | Platinum Sponsors' Seminar
(with a light meal) @Meetiing Room 1 Title : TBD (TBD) |
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| 13:30-15:25 | Session 1: Co-packaged Optics | Session 2: Advanced PKG I | Session 3: Process and Material Technologies I | |||
| Chairperson | Chairperson | Chairperson | ||||
| Takahiro Matsubara (KYOCERA Corporation) | Shoji Uegaki (Crane Research) | Shinya Takyu (LINTEC Corporation) | ||||
| Hidetoshi Numata (IBM Research) | Chinami Marushima (IBM Japan, Ltd.) | Kei Murayama (Shinko Electric Industries Co., Ltd.) | ||||
| 13:30 | Pigtailed-OSFP External Laser Source for Co-Packaged Optics | 24 | (Invited) (TBD) | I-07 | (Invited) Atomic imaging of Al2O3/diamond interface by photoelectron | I-05 |
| Kohei Umeta, Taketsugu Sawamura, Kyoko Nagai, Kazuhiko Kashima, Hideyuki Nasu | Takeyasu Saito | Mami N. Fujii | ||||
| Furukawa Electric Co., Ltd. | Osaka Metropolitan University | Kindai University | ||||
| 13:55 | Bandwidth Expansion of a Testing Station using a 0.3-mm-Pitch LGA Interface for a 25-Gbaud x 16-channel CPO Transceiver | 31 | Polishing of CVD Diamond for Direct Bonding using Ar and SF6-Gas Cluster Ion Beams | 58 | Influence of EMC Tg on Leakage Current in HTRB Test and Delamination in MSL Test for Power Package | 19 |
| Kazuya Nagashima, Yuta Ishige, Wataru Yoshida, Hideyuki Nasu | Junsha Wang1), Tadatomo Suga1), Hideaki Yamada2), Yoshiaki Mokuno2) | ZHIWEN LI, OU DONG, JUANJUAN HUANG, JUNRUI PENG | ||||
| Furukawa Electric Co., Ltd. | 1) Meisei University 2) AIST | Nexperia | ||||
| 14:20 | Jitter Margin Analysis of 56-Gb/s PAM4 × 8-Channel VCSEL-Based Optical Transceiver for Co-Packaged Optics | 29 | Pillar-Concave Copper-Copper Bonding for Face-to-Face Carbon Nanotube Synthesis | 63 | Reliability Performance Study of Molding Compounds on High Voltage Molded Leaded Package | 1 |
| Wataru Yoshida, Yuta Ishige, Kazuya Nagashima, Hideyuki Nasu | Hua XU, Jeffery C.C. LO, S.W. Ricky LEE | April Joy Garete, Zhiwen Li, Yee Wai Fung, Wai Man Wong | ||||
| Furukawa Electric Co., Ltd. | The Hong Kong University | Nexperia | ||||
| 14:45 | Temperature Distribution Measurement System for a Water-Cooled CPO Daughter Board | 62 | Nb-Nb direct bonded pads for superconducting devices and their failure mode | 44 | ||
| Yuta Ishige, Kazuya Nagashima, Wataru Yoshida, Takeshi Hirasawa, Hideyuki Nasu | Atsushi Kudo1), Masahisa Fujino2), Yuuki Araga2), Hiroshi Nakagawa1), Katsuya Kikuchi2), Tohru Taino1) | |||||
| Furukawa Electric Co., Ltd. | 1) Saitama University 2) AIST | |||||
| 15:10 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
| 15:25 | Coffee break + Sponsor's Exhibition | |||||
| 15:40-17:35 | Session 4: Photonics Packaging | Session 5: Bioelectronics | Session 6: Technical Session | |||
| Chairperson | Chairperson | Chairperson | ||||
| Takaaki Ishigure (Keio University) | Beomjoon Kim (The University of Tokyo) | Shigenori Aoki (LINTEC Corporation) | ||||
| Hideyuki Nawata (Nissan Chemical Corporation) | Takafumi Fukushima (Tohoku University) | Takashi Hisada (IBM Research-Tokyo) | ||||
| 15:40 | (Invited) 2.5D Photonic Integration for GPU Interconnects | I-01 | FOWLP-based Flexible Hybrid Electronics (FHE) I: Photobiomodulation Device Fabrication on Hydrogel Substrate Using RDL-first Approach | 54 | TC-6 No.1 High Density Substrates & Boards |
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| Benjamin Lee | Tadaaki Hoshi, Daichi Nishiguchi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima | TC-6 (TBD) | ||||
| NVDIA Corporation | Tohoku University | |||||
| 16:05 | Development of Adapter-less Compact Multifiber Optical Connector | 20 | FOWLP-based Flexible Hybrid Electronics (FHE) II: Heterogeneous Integration Technology of Micro-LEDs on 3D-IC for Smart Skin Display | 60 | TC-6
No.2 High Density Substrates & Boards |
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| Alexander William Setiawan Putra, Kentaro Matsuda, Motohito Takezaki | Jiayi Shen, Chang Liu, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima | TC-6 (TBD) | ||||
| Hakusan Inc. | Tohoku University | |||||
| 16:30 | High Density Optical Transceiver Packaging using Glass Substrates and Through Glass Vias | 65 | Enhancement for extraction of interstitial fluid through the porous microneedles array patch made of polycaprolactone (PCL) | 34 | TC Materials and Processes (TBD) | |
| Kevin Burt, Joe Ahadian, Chris Bohn, John Coronati, Marc Epitaux, Adam Owens, Nathan Roberson, Sandra Skendzic | Yosuke Koma, Yuko Tsuruma, Shigenori Aoki, Shinya Takyu, Jongho Park, Beomjoon Kim, Rie Kinoshita | (TBD) | ||||
| Samtec Inc. | 1) LINTEC
Corporation 2) The University of Tokyo |
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| 16:55 | Unique optical connect structure with polymer waveguide fabricated by the Mosquito method | 36 | Development of a highly porous polycaprolactone (PCL) Microneedles Array Patch to improve the absorption of interstitial fluid (ISF) | 33 | TC Thermal and Mechanical (TBD) | |
| Yuji Furuta1), Fumimasa Kondo2), Anzu Ito2), Ryoto Ichinose2), Hisashi Kaneda1), Tomoharu Fujii1), Takaaki Ishigure2) | Yosuke Koma, Yuko Tsuruma, Shigenori Aoki, Shinya Takyu, Jongho Park, Beomjoon Kim, Rie Kinoshita | (TBD) | ||||
| 1) SHINKO ELECTRIC INDUSTRIES C., LTD. 2) Keio University | 1) LINTEC
Corporation 2) The University of Tokyo |
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| 17:20 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
| 17:35-18:15 | Hall I Chairperson Shinya Takyu (LINTEC Corporation) & Eiji Higurashi (Tohoku University) |
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| IEEE EPS Special Speech I | ||||||
| 17:35 | IEEE EPS Special Speech I: EPS Welcome Kitty Pearsall (Boss Precision, Inc.) |
S-02 | ||||
| 19:15 | Welcome Reception | |||||
| 21:15 | Close | |||||
| November 16, 2023 | (Thursday) | |||||
| 4F/5F Main Hall I | 1F Room I | 1F Room II | ||||
| On-site presentation | On-site presentation | On-site presentation | ||||
| 9:00 | Registration | |||||
| 9:20-10:10 | Hall I Chairperson Shoji Uegaki (Crane Research) & Kazuyuki Nakagawa (Renesas Electronics Corporation) |
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| Plenary Speech III | ||||||
| 9:20 | Plenary Speech III: Pivotal Advanced Package
Co-Design for Heterogeneous Integration C.P. Hung (ASE Group) |
P-04 | ||||
| 10:10-11:00 | Hall I Chairperson Yoichiro Kurita (Tokyo Institute of Technology) & TBD |
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| Plenary Speech IV | ||||||
| 10:10 | Plenary Speech IV: (TBD) Seungwook Yoon (Samsung Electronics Corp.) |
P-01 | ||||
| 11:00 | Coffee break + Sponsor's Exhibition | |||||
| 11:10-12:40 | Session 7: Advanced PKG II | Session 8: Automotive I | Session 9: VCSEL-Based Optical Interconnects | |||
| Chairperson | Chairperson | Chairperson | ||||
| Kiyokazu Yasuda (Osaka University) | Hajime Kimura (Nissan Motor Co., Ltd.) |
Hideyuki Nasu (Furukawa Electric Co.,
Ltd.) |
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| Kenji Takahashi (AIST) | Yutaka Uematsu (Hitachi Ltd.) | Junichi Inoue (Kyoto Institute of
Technology) |
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| 11:10 | (Invited) Metal-polymer direct joining using small textures on metal surface | I-06 | Packaging of SiC Power Module with a Low-Permittivity Material to Reduce Capacitive Coupling | 30 | (Invited) TBD | I-09 |
| Yusuke Kajihara | Sihoon Choi1), Jiyoon Choi1), Jong-Won Shin2), Jun Imoka1), Masayoshi Yamamoto1) | Michael Tan | ||||
| Tokyo University | 1) Nagoya University 2) Chung-Ang University | Lumentum | ||||
| 11:35 | Multi Die Stacked Structure fabricated by WoW Bonding | 52 | A Review of the Packaging Scheme of a Traction Inverter: Layout, Capacitor, Current Sensing and Power Module | 39 | Crosstalk Reduction in Ultra-High-Density High-Speed Optical Receiver | 48 |
| Haruo Shimamoto1), Yuuki Araga1), Masahisa Fujino1), Naoya Watanabe1), Kenji Takahashi1), Tsuyoshi Kawagoe2), Ichirou Honma2), Katsuya Kikuchi1), Takatoshi Masuda2) | Thiyu Warnakulasooriya, Sihoon Choi, Arihiro Kamiya, Jun Imaoka, Masayoshi Yamamoto | Takatoshi Yagisawa, Tomonori Azuma, Makoto Miyoshi, Jumpei Miike, Yoshiyuki Harada, Satoshi Ide | ||||
| 1) AIST 2) UltraMemory Inc. |
Nagoya University | Fujitsu Optical Components Limited | ||||
| 12:00 | Packaging of a 25-tiles device on large dimension AlN ceramic substrate keeping low dead areas and tight planarity | 59 | Abnormal Position Identification Technique for Communication Channel using Adaptive DFE | 7 | Polymer Optical Waveguide Coupler with Vertically Bent Cores | 9 |
| Sarah Renault | Soshi Shimomura, Yutaka Uematsu | Nagi Itaru, Takaaki Ishigure | ||||
| CEA-Leti | Hitachi Ltd. | Keio University | ||||
| 12:25 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
| 12:40-14:10 | Lunch | |||||
| 14:10-15:40 | Session 10: Automotive II | Session 11: Millimeter Wave applications | Session 12: Advanced PKG III | |||
| Chairperson | Chairperson | Chairperson | ||||
| Yutaka Uematsu (Hitachi Ltd.) | Kazuyuki Nakagawa (Renesas Electronics
Corporation) |
Kenji Takahashi (AIST) |
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| Hajime Kimura (Nissan Motor Co., Ltd.) | Yoichiro Kurita (Tokyo Institute of Technology) | Taiji Sakai (FICT LIMITED) |
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| 14:10 | (Invited) The Cutting-edge Simulation and Validation Technology using Model-based Development | I-02 | Design and Optimization of Test Socket for Millimeter-Wave Steerable Beam Measurement Technology | 16 | Understanding Design Rules of Wafer Level Chip Scale Packaging Addressing Thermo-Mechanical Challenges | 2 |
| Karsten Krügel | Yu-Chang Hsieh, Hong-Sheng Huang, Wen-Chun Hsiao, Sheng-Chi Hsieh, Chen-Chao Wang | Yiyi Ma, Jing-En Luan | ||||
| dSPACE GmbH | ASE Inc. | STMicroelectronics | ||||
| 14:35 | High Density Automotive Module with Fan-Out Package | 40 | Ceramic-packaged Multichip Front-end Module for 5G Millimeter Wave Communication applications | 12 | A DfT Technique for Electrical Interconnect Testing of Circuit Boards with 3D Stacked SRAM ICs | 15 |
| Wataru Shiroi, Shuuichi Kariyazaki, Yuji Kayashima, Takafumi Betsui, Shiro Machida, Kazuyuki Nakagawa, Toshihiko Akiba | Bo Zhou, Zheng Pan, Yong Cheng | Yuki Ikiri1), Hiroyuki Yotsuyanagi1), Fara ASHIKIN Binti Ali2), Shyue-Kung Lu3), Masaki Hashizume4) | ||||
| Renesas Electronics Corporation | Nanjing University of Posts and Telecommunications | 1)
Tokushima University 2) Universiti Teknikal Malaysia 3) National Taiwan Univ. 4) The Open Univ. of Japan |
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| 15:00 | Board-Level Drop Reliability Analysis for Fine-Pitch BGA Packages in Automotive Applications | 28 | A Study on the Inductance and Thermal Regression and Optimization for Automatic Layout Design of Power Modules | 62 | ||
| Wei-Hong Lai | Victor Parque, Aiki Nakamura, Tomoyuki Miyashita | |||||
| ASE Inc. | Department of Modern Mechanical Engineering, Waseda University | |||||
| 15:25 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
| 15:40 | Coffee break + Sponsor's Exhibition | |||||
| 15:50-16:30 | Hall I Masayoshi Yamamoto (Nagoya University) & Yutaka Uematsu (Hitachi, Ltd.) |
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| Special Speech I | ||||||
| 15:50 | Special Speech I: Special Speech I: Dynamic
Wireless Power Transfer Technologies for Future Electric Vehicles Takehiro Imura (Tokyo University of Science) |
S-05 | ||||
| 16:30-17:10 | Hall I Chairperson Shinya Takyu (LINTEC Corporation) & Eiji Higurashi (Tohoku University) |
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| IEEE EPS Special Speech II | ||||||
| 16:30 | IEEE EPS Special Speech II: TBD Sam Karikalan (Broadcom Inc.) |
S-01 | ||||
| 17:10 | Coffee break + Sponsor's Exhibition | |||||
| 17:20-18:20 | Early Career Researcher's (ECR) Session | |||||
| On-site poster presentation | ||||||
| A D-Band Waveguide-feed Patch Array on GaAs IPD Process | 4 | Fabrication of Polymer Optical Waveguide Based Splitter by the Mosquito Method and Investigation of Its Signal Splitting Ratio | 11 | Structural Investigation of Rare-Earth Metal Polymer Composite Doped Optical Amplifiers for Higher Gain | 14 | |
| Ta-Yeh Lin, Shuw-Guann Lin, Yin-Cheng Chang, Chaoping Hsieh, Tsenchieh Chiu, Da-Chiang Chang | Kosei Azuma, Takaaki Ishigure | Kohei Ono, Takaaki Ishigure | ||||
| National Central University | Keio University | Keio University | ||||
| Polymer Spot Size Expander on Laser Diode Chip for Fiber Coupling | 26 | Study on Power Transmission System for a Dynamic Charging System Shared Between Light-Duty and Heavy-Duty Vehicles | 32 | Reserch on strain sensor using bending loss of optical fiber | 43 | |
| Atsuki Sawada1), Yoshiki Kamiura2), Chiemi Fujikawa1), Osamu Mikami3) | Kouki Onimaru, Kraisorn Throngnumchai | Takaya Waki, Masaki Fujii, Ryo Nagase | ||||
| 1)
Tokai University 2) Kyushu University 3) Universiti Teknologi Malaysia |
Kanagawa Institute of Technology Graduate School | Chiba Institute of Technology | ||||
| Template stripping of Au from polyimide film for smoothing of bonding surface | 47 | Suppression of surface roughening of Ag films by capping layer for Ag/Ag surface activated bonding | 49 | |||
| Shogo Koseki1), Mika Ogino1), Kai Takeuchi1), Le Hac Huong Thu2), Takashi Matsumae2), Hideki Takagi2), Yuichi Kurashima2), Tomoaki Tokuhisa3), Toshikazu Shimizu3), Eiji Higurashi1) | Yuanhao Cai1) Kai Takeuchi1) Miyuki Uomoto2) Takehito Shimatsu2), Eiji Higurashi1) | |||||
| 1)
Tohoku University 2) AIST 3) Kanto Chemical Co., Inc. |
1) Tohoku University 2) FRIS, Tohoku University |
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| 18:20 | Close | |||||
| November 17, 2023 | (Friday) | |||||
| 4F/5F Main Hall I | 1F Room I | 1F Room II | ||||
| On-site presentation | On-site presentation | On-site presentation | ||||
| 9:00 | Registration | |||||
| 9:20 | ECR Award Ceremony | |||||
| 9:30-10:10 | Hall I Chairperson Kenji Takahashi (AIST) & TBD |
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| Special Speech II | ||||||
| 9:30 | Special Speech II: (TBD) Yoshihiro Hayashi (AIST/Keio University) |
S-04 | ||||
| 10:10-10:50 | Hall I Chairperson Eiji Higurashi (Tohoku University) & Kei Murayama(Shinko Electric Industries Co., Ltd.) |
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| Special Speech III | ||||||
| 10:10 | Special Speech III: Challenges for hetero
integration: process technology, test and reliability Rer. nat. Harald Kuhn (Fraunhofer ENAS) |
S-03 | ||||
| 10:50 | Coffee break + Sponsor's Exhibition | |||||
| 11:00-12:55 | Session 13: Process and Material Technologies II | Session 14: High-Speed Electrical Interconnect | Session 15: Polymer Waveguide Technology | |||
| Chairperson | Chairperson | Chairperson | ||||
| Satomi Kawamoto (Namics Corporation) | Kazuyuki Nakagawa (Renesas Electronics Corporation) | Hideyuki Nawata (Nissan Chemical Corporation) | ||||
| Shinya Takyu (LINTEC Corporation) | Yoichiro Kurita (Tokyo Institute of Technology) | Junichi Inoue (Kyoto Institute of Technology) | ||||
| 11:00 | (Invited) Laser-assisted high-throughput integration of microLEDs | I-04 | (Invited) A Novel Chiplet Integration Architecture Employing Pillar-Suspended Bridge with Polymer Fine-Via Interconnect | I-11 | Demonstration of high-power stability of polymer optical waveguides using external laser source (ELS) for co-packaged optics | 6 |
| Sergio Roso | Yasuhiro Morikawa | Satoshi Suda, Takayuki Kurosu, Akihiro Noriki, Fumi Nakamura, Takeru Amano | ||||
| Holst Centre | ULVAC | National Institute of Advanced Industrial Science and Technology | ||||
| 11:25 | Inductive sintering module for improved multi die attach in the field of power packaging | 41 | Simulation method of 32Gbps Signal Transmission Considering Xtalk Impact using Probability Density Function | 35 | Low Loss Design and Fabrication for Tapered Waveguide Based Spot Size Converter | 45 |
| Christian Hofmann1), Patrick Rochala2), Martin Kroll2), Sushant Panhale2), Mario Baum1), Harald Kuhn1), Kiyoshi Oi3),Masaki Sanada3), Kei Murayama3) | Masahiro Yao, Norio Chujo | Fumimasa Kondo1), Yuji Furuta2), Hisashi Kaneda2), Tomoharu Fujii2), Takaaki Ishigure1) | ||||
| 1) Fraunhofer Institute for Electronic Nano Systems ENAS,
Chemnitz University of Technology 2) Institute for Machine Tools and Production Processes (IWP), Professorship for Forming and Joining 3) SHINKO Electric Industries Co., Ltd. |
Hitachi, Ltd. | 1) Keio University 2) SHINKO ELECTRIC INDUSTRIES CO., LTD. | ||||
| 11:50 | Printable Sheet Sensor System with Organic Circuit for Structural Health Monitoring | 21 | A 3.6–4.5 GHz Doherty RF Power Amplifier Using 0.25-um GaN/SiC HEMT and GaAs IPD technology | 18 | Temperature dependence of coupling loss between SMF and polymer optical waveguides with various refractive index profiles | 22 |
| Mihoko AKIYAMA1,2), Teppei ARAKI1,2), Takafumi UEMURA2), Shusuke YOSHIMOTO2), Naoko NAMBA2), Yuko KASAI2), Hiroshi OHTA2), Toshikazu NEZU2), Shichi TSURUTA1,2), Tsuyoshi SEKITANI1,2) | Hsin-Chieh Lin, Hsin-Chieh Lin, Te-Hua Fan, Hwann-Kaeo Chiou, Da-Chiang Chang | Ryota Kinoshita1), Takaaki Ishigure2) | ||||
| 1) Graduate School of Engineering, Osaka University, Suita,
Osaka, Japan 2) SANKEN (Institute of Scientific and Industrial Research), Osaka University, Japan |
1)
National Central University 2) Taiwan Semiconductor Research Institute |
1) Sumitomo Bakelite Co., Ltd. 2) Keio University | ||||
| 12:15 | Warpage Observation of Liquid Compression Mold Underfill on Strip Substrate | 42 | Crosstalk Mitigation for High Speed SerDes Applications on FCBGA Package | 25 | Tactile Pressure Sensor Based on Flexible Polymer Optical Waveguides Fabricated by the Mosquito Method | 17 |
| Takayuki Oe, Yuto Shigeno, Yukihiro Ikeda, Kyota Aoyama, Tsuyoshi Kamimura | Li-Chieh Hung, Hung-Chun Kuo, Ming-Fong Jhong, Chen-Chao Wang | YUANTIAN YIN, Takaaki Ishigure | ||||
| NAMICS CORPORATION | ASE Inc. | Keio University | ||||
| 12:40 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
| 12:55 | Lunch (free time) | |||||
| 14:25-16:45 | Session 16: Power Electronics | Session 17: Integrated Photonics | Session 18: Process and Material Technologies III | |||
| Chairperson | Chairperson | Chairperson | ||||
| Kentaro Kaneko (Ritsumeikan University) | Takahiro Matsubara (KYOCERA Corporation) | Naoko Araki (DAICEL CORPORATION) | ||||
| Hiroki Imabayashi (Fukui University) | Hidetoshi Numata (IBM Research) | Satomi Kawamoto (Namics Corporation) | ||||
| 14:25 | (Invited) 350℃ operation of SiC complementary JFET logic gates | I-03 | (Invited) Energy-Efficient Integrated Photonics for Future Optical Interconnects and Neuromorphic Computing | I-08 | Development of Anti-ESD back grinding tape | 10 |
| Mitsuaki Kaneko | Stanley Cheung | Shinya Takaoka, Issei Adachi | ||||
| Kyoto University | Hewlett Packard Labs | Lintec Corporation | ||||
| 14:50 | The effect of the power module structure (cupper clip thickness) on reliability under power cycling test | 23 | Retroreflection Using Bloch Surface Wave Resonance for External Laser Mirror | 53 | Development of high heat-resistant multilayer barrier electrodes suitable for multiple reflow processes | 18 |
| Ryoichi Kato, Yoshinari Ikeda, Takafumi Yamada, Kohei Yamauchi, Hiromichi Gohara, Tatsuhiko Asai, Hirohisa Oyama | Keisuke Ozawa, Aika Taniguchi, Yuya Yamanishi, Junichi Inoue, Shogo Ura | KAZUTAKA MAEDA, DAISUKE TOYOTA, SUGURU MISAWA | ||||
| Fuji electric Co., Ltd. | Kyoto Institute of Technology | KYOCERA Corporation | ||||
| 15:15 | Study of Nitride Crack Reduction for Electronic Power Devices | 3 | Polymer Optical Waveguide Type 3-D MUX device for Mode Division Multiplexing Links | 46 | RAC Process characterization in SMT PCBA | 27 |
| Nick Chenchao Zhong, Haibo Fan, Nivasan Yogeswaran, Mark Gajda | Ryoto Ichinose, Takaaki Ishigure | Jui Ang Tan, Chee Chuan Tan, Alvin Kok Wah Leong, Viiren Subramaniam, Khian Chee Chua | ||||
| 1) Nexperia Hong Kong 2) Nexperia UK | Keio University | Intel Sdn Bhd | ||||
| 15:40 | Schottky barrier diode composed of Ge-doped α-Ga2O3 grown by mist-CVD method | 55 | (Invited) Photonic System-in-Package (pSiP) by applying thin glass | I-10 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |
| Takeru Wakamatsu, Yuki Isobe, Hitoshi Takane, Kentaro Kaneko, Katsuhisa Tanaka | Henning Shroder | |||||
| 1) Kyoto University 2) Ritsumeikan University | Fraunhofer IZM | |||||
| 16:05 | Prototyping and Evaluation of SiC Half Bridge Circuit using Power Device Embedded Module Process Towards Future Three Dimensional Packaging. | 38 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||
| Kazuhito NAKAMURA, Koichi SHIGEMATSU, Jun IMAOKA, Masayoshi YAMAMOTO | ||||||
| Nagoya University | ||||||
| 16:30 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
| 16:45 | Close | |||||