Best Paper Award
"PDN Characteristics of 3D-SiP with a Wide-bus Structure under 4k-IO Operations"
Atsushi Sakai, Shigeru Yamada, Takashi Kariya, Shiro Uchiyama, Hiroaki
(Association of Super-Advanced Electronics Technologies)
Haruya Fujita, Hiroki Takatani, Yosuke Tanaka, Yoshiaki Oizono, Yoshitaka
Nabeshima, and Toshio Sudo
(Shibaura Institute of Technology)
"3D integration techniques using stacked PCBs and small dipole antenna for wireless sensor nodes"
Shoichi Oshima, Kenichi Matsunaga, Hiroki Morimura and Mitsuru Harada
(NTT Microsystem Integration Laboratories)
"Wide Bus Chip-to-Chip Interconnection Technology Using Fine Pitch Bump Joint Array for 3D LSI Chip Stacking"
Masahiro Aoyagi, Fumito Imura, Shunsuke Nemoto, Naoya Watanabe, Fumiki
Kato, Kstsuya Kikuchi, Hiroshi Nakagawa
(National Institute of Advanced Industrial Science and Technology)
Michiya Hagimoto, Hiroyuki Uchida, and Yukoh Matsumoto
(TOPS Systems Corporation)
"Room Temperature Microjoining of qVGA Class Area-Bump Array Using Cone Bump"
(Graduate School of Information Science and Electrical Engineering, Kyushu University)
"In-situ Observation of Whisker Nucleation in Air with AFM"
(Yokohama National University)
"Investigation of Thermal Management Method for Coil and Capacitor in Automobile ECU"
(Yokohama Research Lab., Hitachi, Ltd.)
"Compact multi-fiber receptacle interface for on-board optical interconnection"
(NTT Photonics Laboratories, NTT Corporation)
Last updated: 2013/ 1/16