Advance Program

November 7, 2016 (Monday)
Hall I Hall II Hall III
9:00 Registration
10:00-
12:15		 Hall I & II   
Chairpersons Takaaki Ishigure (Keio University) & Hideyuki Nasu (Furukawa Electric Co., Ltd.)
Opening Remarks & Welcome Talk & Plenary Speech I, II
10:00 Opening Remarks & Welcome Talk: Yutaka Uematsu (General Chair, IEEE CPMT Symposium Japan; Hitachi Ltd. )
10:15 Plenary Speech I: Heterogeneous 2D/3D Integration and Future Cyberinfrastructure
S. J. Ben Yoo (University of California, Davis) 		 P-02
11:10 Break
11:20 Plenary Speech II: Future Industrial Ecology - Taiwan's Perspective
Tze-Chen Tu (Industrial Technology Research Institute of Taiwan, R.O.C) 		 P-03
12:15 Lunch (free time - ICSJ2016 Lunch Map)
13:15-
14:30		 Session 1: Power Electronics Special I Session 2:Thermal  I Session 3: Electrical Connection
Chairpersons Chairpersons Chairpersons
Minoru Ueshima (Senju Metal Industry Co., Ltd.) Tomoyuki Hatakeyama (Toyama Prefectural University) Masahiro Inoue (Gunma University)
Shigenori Aoki (Fujitsu Laboratories, Ltd.) Kishio Yokouchi (FUJITSU Interconnect Technologies LTD.) Taiji Sakai (Fujitsu Lab.)
13:15 (Invited) The Latest Package and Assembly Technology for SiC Power Module I-08 (Invited)
Cooling and Beyond, Bring ICT and Facility Together		 I-31 (Invited) Electro-migration behavior in flip chip interconnection using Sn-Bi solder alloy system I-23
Yoshikazu Takahashi Jie Wei Kei Murayama
(Fuji Electric Co., Ltd.) (Fujitsu Advanced Technologies Limited) (SHINKO ELECTRIC)
13:40 (Invited) The system innovation in power modules I-09 Possibility of Enhancement of Cooling Performance on Heating Surface by using Intermittent Jet Flow 47 Virtual Prototyping Methodology for Assessment of the Interaction Between Wire Bond Pad Design and Bond Process Parameters to Enhance the Robustness of Copper Wire Bond Interconnect 2
Dai Nakajima Takashi Fukue1, Hidemi Shirakawa2, Koichi Hirose1, Hayate Natsusaka1, Taiki Furusawa1 Chee Meng Chai1, Markus Fink2, Laurens Weiss2
(Mitsubishi Electric Corporation) (1. Iwate University, 2. National Institute of Technology, Toyama College) (1.Infineon Technologies Asia Pacific Pte Ltd., 2. Infineon Technologies AG)
14:05 (Invited) Power Module Trends to Enhance Energy Efficiency of EV & HEV I-11 An experimental setup of stacked thermal chips with selectable cell heaters for 3D integration design 24 Micro Wear Modeling in Copper Wire Wedge Bonding 18
Kenji Kawada Shunichi Kikuchi1, Makoto Suwada1, Yoshihisa Iwakiri2, Hiroshi Onuki2, Naoaki Nakamura2 Paul Eichwald1, Andreas Unger1, Florian Eacock1, Simon Althoff1, Walter Sextro1, Karsten Guth2, Michael Brokelmann3, Matthias Hunstig3
(Infineon Technologies Japan K.K.) (1. Fujitsu Limited, 2. Fujitsu Advanced Technologies Limited) (1. University of Paderborn, 2. Infineon Technologies AG, 3. Hesse GmbH)
14:30 Interview with the Authors (Discussion after the session) @Conference room III, Sponsor's Exhibition @Conference room IV
14:45 SER Seminar (Sponsor's Seminar) @Hall III "The Most Effective Test Methodologies for Advanced Devices"
(Hiroyuki Yamakoshi) + Sponsor's Exhibition @Conference room IV
15:15 Coffee break + Sponsor's Exhibition @Conference room IV
15:25-
17:30		 Session 4: Transceiver  and  Optical Link Session 5: Thermal II Session 6: Material
Chairpersons Chairpersons Chairpersons
Richard Pitwon (Seagate Technology LLC) Tomoyuki Hatakeyama (Toyama Prefectural University) Tetsuya Enomoto (Hitachi Chemical DuPont MicroSystems, Ltd.)
Kobi Hasharoni (LuxIO) Kishio Yokouchi (FUJITSU Interconnect Technologies LTD.) Tomonori Minegishi (Hitachi Chemical Co.,Ltd)
15:25 (Invited) Flip-Chip Interconnection EA-DFB Laser Module for 100-Gbit/s/lambda Application I-13 Study of Electrical and Thermal Conduction Mechanisms in Novel Isotropic Conductive Adhesive 67 (Invited) Photosensitive Polyimide Adhesive Sheet I-10
Shigeru Kanazawa Helge Kristiansen1, Sigurd Pettersen2, Susanne Helland3, Patricia Al-Alam4 Masao Tomikawa
(NTT Device Innovation Center) (1. Conpart AS, 2013 Skjetten, Norway, 2. NTNU Nanomechanical Lab, Department of Structural Engineering, Norwegian University of Science and Technology (NTNU), NO-7491, Trondheim, Norway, 3. Mosaic AS, 2013 Skjetten, Norway, 4. University of Champagne-Ardenne (URCA))  (Toray Industries Inc.)
15:50 (Invited) 4-channel miniature solderable optical modules with an integrated CDR circuitry for 100-Gb/s short reach applications I-03 CFD-Based Basic Investigation on Heat Transfer Characteristics of Pulsating Flow in Narrow Cooling Passages 48 Identifying the optimal deformation point in metal-coated polymer particles for conductive adhesives 64
Kazuya Nagashima Nobuaki Suzuki1, Wakana Hiratsuka1, Takashi Fukue1, Hidemi Shirakawa2, Jun Suzuki1, Koichi Hirose1 Molly Bazilchuk1,2, Huyen Nguyen3, Helge Kristiansen2,  Zhiliang Zhang1, Jianying He1
(Furukawa Electric Co., Ltd.) (1. Iwate University, 2. National Institute of Technology, Toyama College) (1. Norwegian University of Science and Technology, 2.  Conpart AS, 3. HSN – University College of Southest Norway)
16:15 28-Gb/s x 4-channel solderable optical transceiver module for QSFP28 38 A Study on Mounting Pad Shape and Thermal Resistance for Small Surface Mount Devices 68 Mechanical Property Investigation of Single Polymer Particles with Different Surfactant Additive Contain for Monodisperse Polymer Particle Synthesized 5
Hideyuki Nasu, Kazuya Nagashima, Yozo Ishikawa, Atsushi Izawa, Yoshinobu Nekado, and Tomofumi Kise Yoshinori Aruga1, Koichi Hirasawa1, Hirotoshi Aoki1, Tomoyuki Hatakeyama2, Shinji Nakagawa2, Masaru Ishizuka2 Yi-Chun Chen, Yu-Chen Kao, Kai-Chi Chen
(Furukawa Electric Co., Ltd.) (1. KOA Corporation, 2. Toyama Prefectural University) (Industrial Technology Research Institute)
16:40 A Compact 25-Gbit/s x 12-ch Active Optical Cable formed by High-density Optical Sub-assembly Techniques 15 Novel Gas Barrier Films prepared by Transfer Printing Method 22
Yasunobu Matsuoka1, Naohiro Kohmu1, Hideo Arimoto1, Toshiaki Takai1, Norio Chujo1, Masataka Sato2, Shinji Komatsuzaki2, Akira Ogura2, Kinya Yamazaki2, Yoshinori Sunaga2 Tatsuya Izumi, Wataru Iwaya, Takumi Furuya, Takahiro Ohashi, Satoshi Naganawa, Koichi Nagamoto, Takeshi Kondo 
(1 Hitachi, Ltd., 2 Hitachi Metals, Ltd.) (Lintec Corporation)
17:05 Error free 28-Gbps parallel data transmission over a long polymer optical waveguide for on-board optical interconnections 39
Anjani Pratap Singh, and Takaaki Ishigure
(Keio University)
17:30 Interview with the Authors (Discussion after the session) @Conference room III
18:30 Welcome Reception
20:30 Close
November 8, 2016 (Tuesday)
Hall I Hall II Hall III
9:00 Registration
9:15-
11:15		 Hall I & II    
Chairpersons Yasumitu Orii (NAGASE & CO., LTD.) & Kishio Yokouchi (FUJITSU Interconnect)
Heterogeneous Integration Roadmap
9:15 Heterogeneous Integration Roadmap
Bill Bottoms (ADVANCED POLYMER MONITORING TECHNOLOGIES) & Bill Chen (ASE Global)		 S-01
S-02
11:15-
12:05		 Hall I & II
Chairpersons Yutaka Uematsu (Hitachi ltd.) & Daisuke Iguchi (Fuji Xerox Co., Ltd.)
Special Session: IoT 
11:15 (Invited) Energy Harvest-Power MEMS devices for Future Sensor Network Society I-19
Beomjoon Kim
(The University of Tokyo)
11:40 (Invited) Ultra Low Power Wireless Sensor Nodes for Expanding Application of the Internet of Things I-20
Toshihiro Itoh
(The University of Tokyo, AIST)
12:05 Lunch (free time - ICSJ2016 Lunch Map)
13:00-
14:40		 Session 7: Mid-Board Optics Session 8: Bioelectronics I Session 9: 3D Package
Chairpersons Chairpersons Chairpersons
Hideyuki Nasu (Furukawa Electric Co., Ltd.) Kiyokazu Yasuda (Osaka University) Kenji Takahashi (Toshiba Co.)
Shigeru Kanazawa (NTT Device Innovation Center) Naoe Hosoda (NIMS) Shinya Takyu (LINTEC Co.)
13:00 (Invited) Integration challenges for Terabit Class Mid Board Photonic Transceivers I-12 (Invited) Biomedical Applications of Micromachines I-27 (Invited) Perspective of Edge Computing in the era of IoT I-29
Stéphane Bernabé Satoshi Konishi Yasumitsu Orii
(CEA-LETI) (Ritsumeikan University) (NAGASE & CO., LTD.)
13:25 Thermal design of 28-Gb/s x 24-channel CDR-integrated VCSEL-based transceiver module 40 (Invited) In vivo Molecular Sensing for Image-Guided Surgery I-28 (Invited) A Built-in Defective Level Monitor of Resistive Open Defects in 3D ICs with Logic Gates I-18
Toshinori Uemura, Kazuya Nagashima, Naoya Nishimura, Atsushi Izawa, Yozo Ishikawa, and Hideyuki Nasu Tetsuro Takamatsu Masaki Hashizume
(Furukawa Electric Co., Ltd.) (Kyoto Prefectural University of Medicine) (Tokushima University)
13:50 (Invited) On-Chip Optics for Data Center Interconnects. Prospects and Limitations I-06 Fabrication for Polymer Microchannels with Circular Cross-sections for bio-chip applications 42 Development of A Stacking Technology for Large-sized Chips using Non-Conductive Film 23
Kobi Hasharoni Kento Ohga1, Takaaki Ishigure2 Hidehiko Kira1, Norio Kainuma2, Naoaki Nakamura2, Takashi Kubota2, Takumi Masuyama2, Sanae Iijima2
(LuxIO) (1. Graduate School of Science and Technology, Keio University, 2. Faculty of Science and Technology, Keio University) (1. Fujitsu Ltd., 2. Fujitsu Advanced Tecnologies Ltd.)
14:15 (Invited) System embedded photonic interconnect for mega-data centre environments I-01 Development of stealth dicing tape for TSV process 13
Richard Pitwon Shigeyuki Yamashita, Naoya Saiki, Shinya Takyu
(Seagate Technology LLC) (Lintec Corporation)
14:40 Interview with the Authors (Discussion after the session) @Conference room III, Sponsor's Exhibition @Conference room IV
14:55 Coffee break + Sponsor's Exhibition @Conference room IV
15:10-
16:25		 Session 10: Polymer Waveguides Session 11: Electrical Interconnect I Session 12: Panel Level Package
Chairpersons Chairpersons Chairpersons
Takaaki Ishigure (Keio University) Masahiro Aoyagi (AIST) Jun Mizuno (Waseda University)
Stéphane Bernabé (CEA-LETI) Kazuyuki Nakagawa (Renesas Electronics Corp.) Hiroshi Yamada (Toshiba Co.)
15:10 (Invited) Advanced Electro-Optical Circuit Boards: Benefits and Applications I-15 (Invited) Towards a common integration platform for photonics and electronics I-25 (Invited) Advanced Packaging Technologies supporting new semiconductor application I-21
Tobias Lamprecht Guillermo Carpintero del Barrio Mitsuru Ooida
(VARIO-OPTICS, AG) (University Carlos III of Madrid, Spain) (J-Devices Corporation)
15:35 (Invited) Graded Index Polymer Waveguide for High-Bandwidth Optical Circuit I-05 Investigation of an Advanced Concurrent 44/60-GHz Dual-Band Phased Array for Communications and Sensing 49 (Invited) Warpage simulation and experiments for panel level fan out package I-24
Ryota Kinoshita J. Lee, C. Huynh, D. Lee, J. Bae, and C. Nguyen Tingyu Lin
(Sumitomo Bakelite Co., Ltd.) (Texas A&M University, USA) (National Center for Advanced Packaging (NCAP China))
16:00 (Invited) Assembly and performance of silicone polymer waveguides for on card interconnect applications I-02 Implementation of Passive Functions on 0.18 micrometers CMOS at Ka-Band 58 Potential and Challenges of Fan-out Panel Level Packaging 21
Tom Marrapode Noriza Othman1, Mohd Khairul Mohd Salleh1, Gaëtan Prigent2 Tanja Braun1, Karl-Friedrich Becker1, Ruben Kahle2, Stefan Raatz1, Steve Voges2, Rolf Aschenbrenner1, Klaus-Dieter Lang2
(Molex Incorporated) (1. Faculty of Electrical Engineering Universiti Teknologi MARA, Malaysia, 2. INPT-ENSEEIHT Toulouse, France) (1. Fraunhofer IZM, 2. TU Berlin)
16:25 Interview with the Authors (Discussion after the session) @Conference room III, Sponsor's Exhibition @Conference room IV
16:40 Coffee break + Sponsor's Exhibition @Conference room IV
17:00-
18:30		 Early Career Researcher's (ECR) session
(Open Forum with Beer) @Hall III only
Testability of Resistive Open Defects by Electrical Interconnect Tests of 3D ICs without Boundary Scan Flip Flops 20 A Power Supply Circuit for Interconnect Tests Based on Injected Charge Volume of 3D ICs 25 Analysis of malfunction due to conducted disturbance to power supply pin of operational amplifier 26
Fara Ashikin Binti Ali1,2, Masaki Hashizume1, Yuki Ikiri1, Hiroyuki Yotsuyanagi1, Shyue-Kung Lu3 Kohei Ohtani1, Masaki Hashizume1, Daisuke Suga1, Hiroyuki Yotsuyanagi1 and Shyue-Kung Lu2 Katsumasa Fujiki, Tohlu Matsushima, Takashi Hisakado and Osami Wada
(1. Tokushima University, Japan, 2. Universiti Teknikal Malaysia Melaka, Malaysia, 3. National Taiwan University of Science and Technology, Taiwan (R.O.C)) (1. Tokushima Univ. Japan, 2. National Taiwan University of Science and Technology, Taiwan(R.O.C.)) (Kyoto University, Japan)
Densely aligned single-mode polymer parallel optical waveguide compatible with Si photonics chips for off-chip interconnects 37 Multimode polymer optical waveguide with over-crossing structures enabling high-density on-board integration 43 Fabrication for Low-Loss Polymer Optical Waveguide with Graded-Index Perfect Circular Core Using the Mosquito Method 44
Kazuki Yasuhara1, Feng Yu2, Takaaki Ishigure1 Akira Yamauchi, Yoichi Taira, and Takaaki Ishigure Yuki Saito, Koji Fukagata, Takaaki Ishigure
(1. Keio University, Japan, 2. Huawei technologies Japan K.K, Japan) (Keio University, Japan) (Keio University, Japan)
Index profile design of graded-index core tapered polymer waveguide for low loss light coupling 46 Formation of Pitch Conversion Structure in Multimode Polymer Optical Waveguide with High Coupling Efficiency 50 Electrical Signal Transmission around Human Body Standing on the Electrode Located on the Floor Surface for Human Body Communication 51
Hoshihiko Toda, and Takaaki Ishigure Hikaru Masuda1, Norio Chujo2 and Takaaki Ishigure1 Yusuke Fujita1, Fukuro Koshiji1, and Kohji Koshiji2
(Keio University, Japan) (1.Keio University, Japan, 2. Hitachi, Ltd., Japan) (1 Tokyo Polytechnic University, Japan, 2 Tokyo University of Science, Japan)
Transmission Characteritics of Short-Range Wireless Communication Using Magnetically-Coupled Spiral Coils 52 Proposal of the Cross Type of Unbalanced Dipole Antenna with the Bent Type of Semicircular and Trapezoidal Radiating Elements 53 A broadband Loop Antenna for Ultra-Wideband Radio 54
Ryoya Yamaguchi1, Fukuro Koshiji1, and Kohji Koshiji2 Tomohiro Yamada1, Fukuro Koshiji1, and Kohji Koshiji2 Yudai Nagatsu1, Fukuro Koshiji1, and Kohji Koshiji2
(1 Tokyo Polytechnic University, Japan, 2 Tokyo University of Science, Japan) (1 Tokyo Polytechnic University, Japan, 2 Tokyo University of Science, Japan) (1 Tokyo Polytechnic University, Japan, 2 Tokyo University of Science, Japan)
The Warpage and Thermal Simulation Study for Embedded Die Technology 55 Spot Size Converter Using Mask-Transfer Self-Written Waveguide Method for Optical Interconnection 57 Al/Au multilayers with different diffusion barrier layers for application as wafer-bonded UV reflectors 61
Tang-Yuan Chen, Bo-Syun Chen, Penny Yang, Jin-Yuan Lai and MengKai Shih Nurul Atiqah Baharudin1, Sumiaty Ambran1, Osamu Mikami1, Chiemi Fujikawa2, Akinori Suzuki2, Shonosuke Taguchi2, Osamu Mitomi2 Yutaka Kunimune, Eiji Higurashi, and Tadatomo Suga
(Advanced Semiconductor Engineering Group) (1. Universiti Teknologi Malaysia, 2. Tokai University) (The University of Tokyo, Japan)
Three-Dimensional Iterative Electrical-Thermal Co-Simulation (3-D IETC) Method for Power/Thermal Integrity Analysis 63
Yasuhiro Nakatani, Tadatoshi Sekine, Hideki Asai
(Shizuoka University, Japan)
19:00-
21:00		 Committee Reception
November 9, 2016 (Wednesday)
Hall I Hall II Hall III
9:00 Registration
9:10-
10:05		 Hall I & II    
Chairpersons TBD
Plenary Speech III
9:10 Plenary Speech III: IoT strategy and case studies
Hideaki Doki (Intel Corporation) 		 P-01
10:05-
10:35		 Hall I & II    
Chairpersons Yasumitu Orii (NAGASE & CO., LTD.) & Shinya Takyu (LINTEC Co.)
CPMT Special Talk 
10:05 CPMT Special Talk I: Essence of Packaging Technologies for the Era of Internet of Things
S.W. Ricky Lee (HKUST) 		 S-03
10:35 Early Career Researcher Session Award
10:40 Break + Sponsor's Exhibition @Conference room IV
11:00-
12:15		 Session 13: Waveguide Technologies Session 14: MEMS/LED Session 15: Wafer Level Package
Chairpersons Chairpersons Chairpersons
Thomas Schmalzigaug (HUBER+SUHNER AG) Tomonori Minegishi (Hitachi Chemical Co.,Ltd) Kaoru Hashimoto (Meisei University)
Tobias Lamprecht (VARIO-OPTICS, AG) Shinya Takyu (LINTEC Co.) Hiroshi Yamada (Toshiba Co.)
11:00 (Invited) Multi-Core Optical Fibers Realizing High-Density/-Capacity Transmissions I-04 LiNbO3 Die-Attach with Au-Ge Eutectic Solders 7 (Invited) FOWLP Update I-22
Tetsuya Hayashi Ali Roshanghias, Gudrun Bruckner, Alfred Binder Shuzo Akejima
(Sumitomo Electric Industries, Ltd.) (CTR Carinthian Tech Research) (Toshiba Corporation)
11:25 Characterization of CRIGF integrated on DBR substrate 59 Printing and Application of Flexible and Solderable Electrodes for LED Sheets 17 Novel 200 degC Curable Positive Tone Poly(Benzoxazole) Materials 8
Kenichi Yanagida1, Kazuki Mori1, Masahiro Nakata1, Kenji Kintaka2, and Shogo Ura1 Yuichi Sakai1, Ken-ichi Honda2, Orie Shinohara2, Hiroshi Kizawa2, Keiichi Hirose2 Daisaku Matsukawa1, Tadamitsu Nakamura1, Masato Nishimura2, Tetsuya Enomoto1, Noriyuki Yamazaki1, Masayuki Ohe1, Takeharu Motobe1
(1 Kyoto Institute of Technology, 2 National Institute of Advanced Industrial Science and Technology) (1. Toyama Industrial Technology Center, 2. Tateyama Kagaku Industry Co.) (1. Hitachi Chemical DuPont MicroSystems,Ltd., 2. Hitachi Chemical Co.,Ltd.)
11:50 Integrated optic device for narrow-band reflection and guided-wave launching 60 Stretchable Insulating Material for IoT Devices 45 Reliability of 200 degC Curable Photodefinable PBO for Redistribution Layer in Wafer Level Package 10
Atsushi Tsuji1, Junichi Inoue1, Kenji Kintaka2, Kenzo Nishio1, and Shogo Ura1 Tomoaki Shibata, Shunsuke Otake, Satoshi Uehara, Kazuyoshi Tendo, Tomonori Minegishi Masato Nishimura1, Daisaku Matsukawa2, Noritaka Matsuie 2, Noriyuki Yamazaki2, Tetsuya Enomoto2, Masayuki Ohe2
(1 Kyoto Institute of Technology, 2 National Institute of Advanced Industrial Science and Technology) (Hitachi Chemical Co., Ltd.) (1. Hitachi Chemical Co.,Ltd., 2. Hitachi Chemical DuPont MicroSystems, Ltd.)
12:15 Interview with the Authors (Discussion after the session) @Conference room III, Sponsor's Exhibition @Conference room IV
12:30 Lunch (free time - ICSJ2016 Lunch Map)
13:30-
14:45		 Session 16: Power Electronics Special II Session 17: Electrical Interconnect II Session 18: Advanced Package
Chairpersons Chairpersons Chairpersons
Yoshinari Ikeda (Fuji Electric Co., Ltd.) Kazuyuki Nakagawa (Renesas Electronics Corp.) Kei Murayama (SHINKO ELECTRIC)
Kenji Kawada (Infineon Technologies Japan K.K.) Keitaro Yamagishi (Mitsubishi Electric Corporation) Taiji Sakai (Fujitsu Lab.)
13:30 (Invited) HT Lead-free and Sinter Materials and process for WBG Power Semiconductors I-07 Co-design Importance for over 20Gbps I/O Interface 3 (Invited) Glass Interposer Technology Advances for High Density Packaging I-26
Minoru Ueshima Fumiaki Fujii, Daisuke Ogawa, Kaoru Hashimoto, Yutaka Akiyama and Kanji Otsuka Satoru Kuramochi
(Senju Metal Industry Co., Ltd.) (Meisei University, Japan) (Dai Nippon Printing Co., Ltd.)
13:55 (Invited) Development of Sn-Cu Solder having High Power Cycling Reliability Based on Degradation Mode I-17 Transmission Design Technique for 25Gbps Re-timer 6 Moisture Induced Interface Delamination for EMI Shielding Package 29
Takaaki Miyazaki Fumio Yuuki, Kenji Kogo, Takayasu Norimatsu, Naohiro Kohmu Yangming Liu1, Zhongli Ji1, Peng Chen2, Xu Wang1, Ning Ye2, Chin-Tien Chiu1
(Hitachi, Ltd.) (Hitachi, Ltd.) (1. SanDisk Semiconductor (Shanghai) Co., Ltd., 2. SanDisk)
14:20 (Invited) Simulation-Based EMC Design for Automotive Components I-16 Stepped-Impedance Common-Mode Filter in
Differential Lines		 31
Hiroki Funato A. Ege Engin
(Hitachi, Ltd.) (San Diego State University, USA)
14:45 Interview with the Authors (Discussion after the session) @Conference room III, Sponsor's Exhibition @Conference room IV
15:00 Coffee break + Sponsor's Exhibition @Conference room IV
15:10-
16:50		 Session 19: Optical Coupling Session 20: Electrical Interconnect III Session 21: Power Device
Chairpersons Chairpersons Chairpersons
Tom Marrapode (Molex Incorporated) Hideyuki Ohashi (Mitsubishi Electric Corporation) Eiji Higurashi (Tokyo University)
Ryota Kinoshita  (Sumitomo Bakelite Co., Ltd.) Kazuyuki Nakagawa (Renesas Electronics Corp.) Shinya Takyu (LINTEC Co.)
15:10 (Invited) Solutions and Challenges of Optical Board-Edge Connectivity I-14 High Efficiency Power Electronic Module with Embedded Die 66 Development of Cu-Ag Composite Pastes for Power IC Attachment 32
Thomas Schmalzigaug H. C. Kuo1, P. Chen1, C. T. Chiu1, C. C. Wang1, Kay S. Essig2 Jenn-Ming Song, Ching-Huan Hsiao
(HUBER+SUHNER AG) (1, Advanced Semiconductor Engineering, Inc., 2. ASE Group) (National Chung Hsing University)
15:35 Tapered Polymer Waveguides with Graded-Index Core for Low-Loss Optical VIA 41 High Frequency Performance Characterization of Super-fine Inkjet Printed Silver Traces 69 Validated Simulation of the Ultrasonic Wire Bonding Process 16
Kenji Katori and Takaaki Ishigure Ying Ying Lim1,2, Yee Mey Goh2, Masahiro Aoyagi1, Changqing Liu2 Andreas Unger1, Reinhard Schemmel1, Tobias Meyer1, Florian Eacock1, Paul Eichwald1, Simon Althoff1, Walter Sextro1, Michael Brökelmann2, Matthias Hunstig2, Karsten Guth3
(Keio University) (1. Advanced Industrial Science and Technology, Japan, 2. Loughborough University, United Kingdom) (1. University of Paderborn, 2. Hesse GmbH, 3. Infineon Technologies)
16:00 Evaluation of Optical Coupling Characteristics for Optoelectronic Hybrid LSI Package 56 Optimal Design of Vialess Open-stub EBG structure for Power-bus Noise Reduction 30 Production and Characterization of High-Temperature Substrates through Selective Laser Melting (SLM) for Power Electronics 34
A. Noriki1, T. Amano1, M. Mori1, Y. Sakakibara1, K. Kurata2, A. Ukita2, M. Kurihara2, K. Takemura2 Kohtaro Okimoto1, Kengo Iokibe1, Yoshitaka Toyota1, Koichi Kondo2, Shigeyoshi Yoshida2, Toshiyuki Kaneko3 Aarief Syed-Khaja, Philip Patino Perez and Joerg Franke
(1. National Institute of Advanced Industrial Science and Technology, 2. Photonics Electronics Technology Research Association) (1. Okayama University, 2. NEC TOKIN Corporation, 3. KYOCERA Corporation) (Friedrich-Alexander-Universität Erlangen-Nürnberg)
16:25 Ultra-dense, Low-loss, Universal Optical Coupling Solution for Optical Chip Scale Package 14 Compact power electronic modules realized by PCB embedding technology 9
Qing Zhao, Xiaolu Song, Ruiqiang Ji, Zhen Dong, Yanbo Li, Lei Gao, Mingran Quan, Ling Hao,
Shengmeng Fu, and Li Zeng		 Thomas Löher1, Stefan Karaszkiewicz2, Lars Böttcher2, Andreas Ostmann2
(Huawei Technologies Co., Ltd.) (1. Technische Universität Berlin, 2. Fraunhofer IZM)
16:50 Interview with the Authors (Discussion after the session) @Conference room III
17:05 Close