Advanced Program of ICSJ2021
A Hybrid Event of On-site and Virtual Meetings
| November 10, 2021 | (Wednesday) | |||||
| Hall I&II | Room III | Room IV | ||||
| Remote discussion via interactive voice | Remote discussion via chat | Remote discussion via chat | ||||
| 9:00 | Registration | |||||
| 10:10 | Opening Remark (General Chair) | |||||
| 10:25 | Award Ceremony | |||||
| 10:45-11:30 | Hall I & II Chairperson Eiji Higurashi (AIST) & Shigenori Aoki (LINTEC Corporation) |
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| IEEE EPS Special Speech I | ||||||
| 10:45 | IEEE
EPS Special Speech I: Package Design Challenges for 5G and B5G Sam Karikalan (Broadcom Inc.) |
S-02 | ||||
| 11:30-12:15 | Hall I & II Chairperson Eiji Higurashi (AIST) & Shigenori Aoki (LINTEC Corporation) |
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| 5G & Beyond 5G Special Speech I | ||||||
| 11:30 | 5G & Beyond 5G Special Speech I: AiP design for 5G:
Evolution, Recent Results, and Impact on System-level Applications Alberto Valdes-Garcia (IBM Research) |
S-04 | ||||
| 12:15 | Lunch (free time) | |||||
| 13:15-14:45 | Session 1:Advanced Packaging/Emerging Technologies | Session 2: Optical technology for High density, Mobile Fronthaul & Access | Session 3: EMC ESD | |||
| Chairperson | Chairperson | Chairperson | ||||
| Kenji Takahashi (AIST) | Hidetoshi Numata (IBM Research - Tokyo) | Kazuyuki Nakagawa (Renesas Electronics Corp.) | ||||
| Kiyokazu Yasuda (Osaka University) | Hideyuki Nawata (Nissan Chemical
Corporation) |
Yasuhiro Ikeda (Hitachi, Ltd.) | ||||
| 13:15 | (Invited) 3D Interconnect Technology for Superconducting Quantum Devices | I-04 | 25 Gbit/s LiFi with Dual Wavelength Emission, Eye-safe, Laser Based White Light Collimated and Fiber Delivered Light Sources | 57 | Estimation of Electric Field Radiated from Wire Harness based on Approximation of Common-Mode Current Distribution using Asymmetric Dipole Antenna | 45 |
| Katsuya Kikuchi | James Raring1), Changmin Lee1), Mohamed Sufyan Islim2), Sovan Das2), Adrian Sparks2), Stefan Videv2), Binith Shah1), Paul Rudy1), Harald Haas2) | Hiroki Yamada, Jianqing Wang | ||||
| (AIST) | (1)KYOCERA SLD Laser, 2)University of Strathclyde) | (Nagoya Institute of Technology) | ||||
| 13:40 | (Invited) Millimeter-Wave Antenna-in-Package Design Validation Solution in Wireless Communication Applications | I-05 | A High Capacity and Cost-Effective OFDM EML TO-CAN for RoF/IFoF transmission systems in Beyond-5G Mobile Fronthaul | 62 | Transmission Line Pulse Method with Arbitrary Characteristic Impedance for Immunity Evaluation of ESD Protection Device | 59 |
| Chen-Chao Wang | Hayato Sano, Ryota Fujihara, Fumio Shoda, Seiki Nakamura, Masashi Binkai, Nobuo Ohata | Kyousuke Tanaka, Tohlu Matsushima, Yuki Fukumoto | ||||
| (ASE Group) | (Mitsubishi Electric Corporation) | (Kyusyu Institute of Technology) | ||||
| 14:05 | Development of High-Density Organic Hybrid Substrate Using an Interconnect-Layer for Heterogeneous Integration | 4 | Densely Integrated 1060nm 2D VCSEL Array for Space-division Multiplexing Toward Co-packaging Optics Transceivers | 34 | ||
| Chia-Yu Peng, John H Lau, Cheng-Ta Ko, Paul Lee, Eagle Lin, Henry Kai-Ming Yang, Puru Bruce Lin, Tim Xia, Leo Chang, Curry Lin, Tzu Nien Lee, Jason Wong, Mike Ma, Tzyy-Jang Tseng | Liang Dong1), Xiaodong Gu2), Mikito Yoshiki1), Fumio Koyama1) | |||||
| (Unimicron) | (1)Tokyo Institute of Technology, 2)Ambition Photonics Inc.) | |||||
| 14:30 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | Interview with the Authors (Discussion after the session) | Interview with the Authors (Discussion after the session) | |||
| 14:45 | Coffee break + Sponsor's Exhibition | |||||
| 14:55-16:25 | Session 4: Photonics | Session 5: Assembly and Bonding Techniques | ||||
| Chairperson | Chairperson | |||||
| Shigenori Aoki (LINTEC Corporation) | Kei Murayama (Shinko Electric Industries Co., Ltd.) | |||||
| Junichi Inoue (Kyoto Institute of
Technology) |
Satomi Kawamoto (Namics Corporation) |
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| 14:55 | (Invited) Automated Photonics Testing at Wafer Level | I-10 | LGA pre Bump Process Elimination | 31 | ||
| Ignazio Piacentini | Jui Ang Tan1), Chong Seng Foo1), Wen Jie Chen1), Szu Han Tan1), Shu Chao Sun2), Ailsa Liang2), Dennis Lidan Lee2) | |||||
| (ficonTEC Service GmbH) | (1)Intel Products Malaysia, 2)Intel China Ltd.) | |||||
| 15:20 | (Invited) Photonics Packaging Solutions for Silicon-photonics based Short-reach Optical Interconnects | I-11 | (Invited) Technologies for Power Device Packaging by using Solid Liquid Interdiffusion Bonding - SLID | I-14 | ||
| Geert Van Steenberge | Mario Baum1), Joerg Froemel2), Christian Hofmann1), Maik Wiemer1), Karla Hiller1), Harald Kuhn1) | |||||
| (Ghent University) | (1)Fraunhofer Institute for Electronic Nanosystems ENAS, 2) Tohoku University) | |||||
| 15:45 | (Invited) Multi-Gigabit/s LiFi Networking for 6G | I-13 | Silver Sintering Technology based on Induction Heating for Chip Level Bonding | 43 | ||
| Harald Haas | Christian Hofmann1), Mario Baum1), Maulik Satwara1), Martin Kroll2), Sushant Panhale2), Patrick Rochala2), Soumya-Deep Paul1), Kiyoshi Oi3), Kei Murayama3), Maik Wiemer1), Harald Kuhn1) | |||||
| (University of Strathclyde) | (1)Fraunhofer Institute for Electronic Nano Systems ENAS, 2)Chemnitz University of Technology, 3)SHINKO Electric Industries Co., Ltd.) | |||||
| 16:10 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | Interview with the Authors (Discussion after the session) | ||||
| 16:25 | Coffee break + Sponsor's Exhibition | |||||
| 16:35-18:25 | Hall I & II Chairperson Hideyuki Nasu (Furukawa Electric Co., Ltd) & Takaaki Ishigure (Keio University) |
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| Plenary Speech I & II | ||||||
| 16:35 | Plenary Speech I: Photonic Integration for
Quantum communication, Wireline Communication, and 5/6G Martin Schell (Fraunhofer Heinrich-Hertz-Institute) |
P-01 | ||||
| 17:30 | Plenary Speech II: Optical Systems and
Technologies for Future Mobile Networks Roberto Sabella (Ericsson) |
P-03 | ||||
| 18:25 | Welcome Reception | |||||
| 20:25 | Close | |||||
| November 11, 2021 | (Thursday) | |||||
| Hall I&II | Room III | Room IV | ||||
| Remote discussion via interactive voice | Remote discussion via chat | Remote discussion via chat | ||||
| 9:00 | Registration | |||||
| 9:15-10:00 | Hall I & II Chairperson Kazuyuki Nakagawa (Renesas Electronics Corporation) & Yutaka Uematsu (Hitachi, Ltd.) |
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| 5G & Beyond 5G Special Speech II | ||||||
| 9:15 | 5G & Beyond 5G Special Speech II: From Cooperative
Driving to Collaborative Mobility - Reducing VRU and Unconnected Vehicle
Crashes Robert Gee (Continental) |
S-03 | ||||
| 10:00-10:45 | Hall I & II Chairperson Kazuyuki Nakagawa (Renesas Electronics Corporation) & Yutaka Uematsu (Hitachi, Ltd.) |
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| 5G & Beyond 5G Special Speech III | ||||||
| 10:00 | 5G & Beyond 5G Special Speech III: 5G Evolution and
6G Takehiro Nakamura (NTT DOCOMO, INC.) |
S-05 | ||||
| 10:45 | Coffee break + Sponsor's Exhibition | |||||
| 11:00-12:30 | Session 6: Automotive Sensor Systems | Session 7: Machine Learning/ Wafer Scale Packaging | Session 8: Material Analysis Techniques | |||
| Chairperson | Chairperson | Chairperson | ||||
| Yutaka Uematsu (Hitachi,
Ltd.) |
Taiji Sakai (Fujitsu Interconnect Technologies
Ltd.) |
Shinya Takyu (LINTEC Corporation) | ||||
| Hajime Kimura (Nissan Motor Co., Ltd.) | Kiyokazu Yasuda (Osaka University) | Kei Murayama (Shinko Electric Industries Co.,
Ltd.) |
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| 11:00 | (Invited) LiDAR for Automated Driving Era | I-09 | Novel Approach for Machine Learning with Extra Low Energy and Very Light Hardware | 7 | Electrochemical Analysis of Surface Oxide Layers on Copper Surface in Microelectronics | 56 |
| Toshio Ito | Kanji Otsuka, Koichi Sato, Yutaka Akiyama, Kaoru Hashimoto, Koshi Sato | Chi-Hsuan LIN1), Wei-Chen Huang1), Yu-Cheng Ke1), Jenn-Ming Song1), Kiyokazu Yasuda2) | ||||
| (Shibaura Institute of Technology) | (Meisei University) | (1)National Chung Hsing University 2)Osaka University) | ||||
| 11:25 | Feature Detection Based on Virtual Gradient Using Sensor Fusion for Low-resolution 3D LiDAR | 44 | Precise Thixotropy Control of Bump Support Film for WLCSP | 16 | Measurement of Poisson's Ratio of Resin Materials | 42 |
| Shuncong Shen, Mai Saito, Toshio Ito | Keisuke Shinomiya, Naoya Saiki, Yosuke Sato, Tomotaka Morishita, Reina Kainuma | Hiroshi Yamaguchi, Toshiaki Enomoto, Takayuki Fujita | ||||
| (Shibaura Institute of Technology) | (LINTEC Corporation) | (Namics Corporation) | ||||
| 11:50 | Method of Diagnosing Abnormalities in Bidirectional Communication Channel by Using Adaptive Decision Feedback Equalizer | 14 | Evaluation of Wafer Bond Strength under Vacuum | 20 | ||
| Soshi Shimomura, Yasuhiro Ikeda, Yutaka Uematsu | Kai Takeuchi, Tadatomo Suga | |||||
| (Hitachi Ltd.) | (Meisei University) | |||||
| 12:15 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | Interview with the Authors (Discussion after the session) | Interview with the Authors (Discussion after the session) | |||
| 12:30 | Platinum Sponsors' Seminar (with a light meal) @Hall I & II | |||||
| 13:30-15:00 | Session 9: Bioelectronics-1 | Session 10: Automotive SI/PI/EMC | Session 11: Dielectric Materials for 5G and 3D Package | |||
| Chairperson | Chairperson | Chairperson | ||||
| Beomjoon Kim (The University of
Tokyo) |
Toshio Ito (Shibaura Institute of
Technology) |
Shinya Takyu (LINTEC Corporation) |
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| Kiyokazu Yasuda (Osaka University) | Yasuhiro Ikeda (Hitachi, Ltd.) | Eiji Higurashi (AIST) |
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| 13:30 | (Invited) Multi-modal Thin-Film-Transistor Bio-sensing Platforms for Bio-medical Investigations | I-01 | Practical Simulation Methods Considering Characteristic Variations of Wires for CISPR 25 Conducted Emission | 8 | Development of Newly Low-dielectric Organic Substrate Material for Millimeter Radar | 39 |
| Agnes Tixier-Mita | Hidetake Sugo1), Yuta Sarai1), Bibhu P. Nayak2), Harikiran Muniganti2), Dipanjan Gope2, 3), Takahiro Tsuda1) | Chie Chikara, Satoshi Yoshiura, Satoshi Kajita, Koji Fujikawa, Taishi Imazato, Tadashi Nagasawa | ||||
| (University of Tokyo) | (1)DENSO CORPORATION, 2)Simyog Technology Pvt. Ltd., 3)Indian Institute of Science) | (KYOCERA Corporation) | ||||
| 13:55 | (Invited) Biologically Inspired Ultrathin Array Cameras | I-02 | Abnormal-state-discrimination Method for In-vehicle Communication Channel with Power over Coax Circuit | 15 | Study of Atomic Layer Deposition of Hafnium Oxide as an Insulation Layer on Cu for Potential Flip Chip Integration | 10 |
| Ki-Hun Jeong | Yutaka Uematsu1), Soshi Shimomura1), Yasuhiro Ikeda1), Hidetatsu Yamamoto2), Hideyuki Sakamoto1) | Alaric Yohei Kawai, Shingo Kataza, Shuichi Shoji, Jun Mizuno | ||||
| (KAIST) | (1)Hitachi Ltd., 2)Hitachi Astemo, Ltd.) | (Waseda University) | ||||
| 14:20 | Functional Interfaces for an Openable Artificial Intestinal Tract Device as an Organ-on-a-chip | 9 | Improve Inductive Contact Failure Loss of IGBT Module Test | 25 | Characterization of Low Loss Dielectric Materials for 5G Applications | 5 |
| Shingo Ishibashi, Yuki Inoue, Shiho Shimizu, Satoshi Konishi | Keita Gunji | Tzu Nien Lee, John Lau, Cheng-Ta Ko, Tim Xia, Eagle Lin, Henry Yang, Bruce Lin, Tony Peng, Leo Chang, Jia Shiang Chen, Yi-Hsiu Fang, Li-Yueh Liao, Edward Charn, Jason Wang, Tzyy-Jang Tseng | ||||
| (Ritsumeikan University) | (Nidec-Read Corporation) | (Unimicron) | ||||
| 14:45 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | Interview with the Authors (Discussion after the session) | Interview with the Authors (Discussion after the session) | |||
| 15:00 | Coffee break + Sponsor's Exhibition | |||||
| 15:10-16:05 | Hall I & II Chairperson Beomjoon Kim (The University of Tokyo) & Shinya Takyu (LINTEC Corporation) |
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| Plenary Speech III | ||||||
| 15:10 | Plenary Speech III: Edge Devices Re-imagined with Powerful AI Devices:
Challenges & Opportunities Avi Baum (Hailo) |
P-04 | ||||
| 16:05-16:50 | Hall I & II Chairperson Beomjoon Kim (The University of Tokyo) & Shinya Takyu (LINTEC Corporation) |
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| IEEE EPS Special Speech II | ||||||
| 16:05 | IEEE EPS Special Speech II: Modelling &
Simulation: An underpinning technology for Heterogeneous Integration Chris Bailey (University of Greenwich) |
S-01 | ||||
| 16:50 | Coffee break + Sponsor's Exhibition | |||||
| 17:00-18:30 | Early Career Researcher's (ECR) Session - On-demand viewing available | |||||
| On-site/ on-demand poster presentation | ||||||
| Tapered Pillar on Single-mode Fiber Facet Fabricated using UV Curable Resin for High Efficiency Coupling to Silicon Photonics Chip | 11 | Demonstration of Flexible Polyimide Fibers for Dense Optical Packaging | 18 | Mode-confined ultra thin silicon/polymer hybrid electro-optic modulator | 41 | |
| Taiga Kurisawa, Yoshiki Kamiura, Chiemi Fujikawa, Osamu Mikami | Yuki Okada1), Taro Itatani2), Yoshinobu Okano1), Takeru Amano2), Satoshi Suda2) | Jiawei Mao, Hiromu Sato, Alisa Bannaron, Shiyoshi Yokoyama | ||||
| (Tokai University) | (1)Tokyo City University, 2)AIST) | (Kyushu University) | ||||
| Application of Polymer Microlens with Pillar for High Efficiency Coupling between Single Mode Fiber and SiPh Chip | 12 | Narrow-bandpass Filter using Orthogonally Propagating Guided-mode Resonance with Doubly Periodic Grating | 23 | Interpolation Method for Sparse Point Cloud at Long Distance Using Sensor Fusion with LiDAR and Camera | 48 | |
| Yoshiki Kamiura, Taiga Kurisawa, Chiemi Fujikawa, Osamu Mikami | Zhiyu Yang1), Ryo Asai1), Junichi Inoue1), Kenji Kintaka2), Shogo Ura1) | Mai Saito, Shuncong Shen, Toshio Ito | ||||
| (Tokai University) | (1)Kyoto Institute of Technology, 2)AIST) | (Shibaura Institute of Technology) | ||||
| Connection Characteristics of Hollow-Core Fiber Connector | 13 | |||||
| Toshiki Maejima1), Hideki Kamitsuna2), Ryuta Matsuda1), Ryo Nagase1) | ||||||
| (1)Chiba Institute of Technology, 2)YOKOWO CO., LTD.) | ||||||
| On-demand poster presentation only | ||||||
| 3D Metal Printed Deformed Elliptical Cavity Bandpass Filter with an Additional Plate | 35 | 3D Metal Printed Corrugated Waveguide Antenna Array With High Gain and Enhanced Bandwidth | 32 | Modification of Polyurethane-based Binder for Stabilizing Electrical Conductivity of Silver-filled Stretchable Printed Wires During Cyclic Tensions | 52 | |
| Povilas Vaitukaitis, Kenneth Nai, Jiayu Rao, Jiasheng Hong | Jiayu Rao1), Kenneth Nai2), Povilas Vaitukitis1), Jiasheng Hong1) | Kaito Oodzutumi, Hikaru Watanabe, Rena Ohshima, Masahiro Inoue | ||||
| (Heriot-Watt University) | (1)Heriot-Watt University, 2)Renishaw PLC) | (Gunma University) | ||||
| Development of the h-BN Mmanufacturing Process for 3D-LSI | 17 | Modeling of Polarization Rotation Based All Optical Logic Switch Using Ring Resonator | 47 | Electrical Conductivity of Air-curable Electrically Conductive Adhesive Containing Copper Fillers Using Mixed Surfactants | 54 | |
| Masashi Yokoi, Satoko Shinkai, Satoshi Matsumoto | Gaurav Kumar Bharti, Ramesh Kumar Sonkar | Yukari Matsunami, Daisuke Otajima, Kenta Kawarai, Yuki Saito, Masahiro Inoue | ||||
| (Kyushu Institute of Technology) | (Indian Institute of Technology) | (Gunma University) | ||||
| 18:30 | Close | |||||
| November 12, 2021 | (Friday) | |||||
| Hall I&II | Room III | Room IV | ||||
| Remote discussion via interactive voice | Remote discussion via chat | Remote discussion via chat | ||||
| 9:00 | Registration | |||||
| 9:05 | ECR Award Ceremony | |||||
| 9:15-10:10 | Hall I & II Chair person Shinya Takyu (LINTEC Corporation) & Taiji Sakai (Fujitsu Interconnect Technologies Ltd.) |
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| Plenary Speech IV | ||||||
| 9:15 | Plenary Speech IV: Chiplet Design and Heterogeneous Integration
Packaging John H. Lau (Unimicron) |
P-02 | ||||
| 10:10 | Coffee break + Sponsor's Exhibition | |||||
| 10:25-12:20 | Session 12: Wide-gap Semiconductor Power Devices and their Heat Dissipation Methods | Session 13: Optical Interconnect in Data Center | ||||
| Chairperson | Chairperson | |||||
| Masafumi Yokoyama (SCIOCS) | Shigenori Aoki (LINTEC Corporation) |
|||||
| Kentaro Kaneko (Kyoto Univ.) | Hideyuki Nasu (Furukawa Electric Co.,
Ltd) |
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| 10:25 | (Invited) Development of High Thermal Conductive Ceramics and High Thermal Conductive Resins Using Fibrous Aluminum Nitride Filler | I-08 | Optical Interconnect Ecosystems and Challenges in Co-Packaged Optics | 2 | ||
| Toru Ujihara | Tiger Ninomiya1), Bernard HL Lee2), Stan Lee3), Gavin Hsu3), Richard Pitwon4) | |||||
| (Nagoya University) | (1)Senko Advanced Components, Inc., 2)Senko Advanced Components (HK), Ltd., 3)Senko Advanced Components (Shenzhen), Ltd., 4)Resolute Photonics, Ltd.) | |||||
| 10:50 | Evaluation of Half-Bridge Power Module with POL-kW | 38 | System Transmission over Multicore Fiber for Datacom Optical Interconnect Applications | 36 | ||
| Shingo Hayashibe1), Kei Murayama1), Koji Bando1), Hitoshi Ito1), Hirotsugu Suzuki2), Takanori Sugita2) | Yi Sun, Robert Lingle Jr., Bob Holland, Roman Shubochkin, Kumar Bansal, David DiGiovanni | |||||
| (1)SHINKO ELECTRIC INDUSTRIES CO., LTD., 2)Headspring Inc.) | (OFS Fitel LLC) | |||||
| 11:15 | Study on Deep Traps in α-Ga2O3 on m-plane Sapphire by Photocapacitance Method and Deep Level Optical Spectroscopy | 6 | Reliability and Bend Loss of Optical Fibers in Tight Bend Applications | 26 | ||
| Hitoshi Takane1), Kentaro Kaneko1), Takashi Shinohe2), Shizuo Fujita1) | Scott Bickham, G. Scott Glaesemann, Yin Shu, Garth Scannell | |||||
| (1)Kyoto University, 2)FLOSFIA INC.) | (Corning Research and Development Corporation) | |||||
| 11:40 | (Invited) Creating Low Thermal Resistance Interfaces In Wide Bandgap Semiconductors Through Bonding | I-12 | High-efficiency Optical Coupling between VCSEL and 90-degree-bent Graded-Index Core Polymer Waveguide with Numeral Aperture Optimization | 24 | ||
| Samuel Graham | Naohiro Kohmu1), Maho Ishii2), Takaaki Ishigure2) | |||||
| (Georgia Institute of Technology (Currently University of Maryland)) | (1)Hitachi, Ltd., 2)Keio University) | |||||
| 12:05 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | Interview with the Authors (Discussion after the session) | ||||
| 12:20 | Lunch (free time) | |||||
| 13:20-14:50 | Session 14: New Process and Materials | Session 15: Bioelectronics-2 | ||||
| Chairperson | Chairperson | |||||
| Kei Murayama (Shinko Electric
Industries Co., Ltd.) |
Shigenori Aoki (LINTEC Corporation) |
|||||
| Shinya Takyu (LINTEC
Corporation) |
Beomjoon Kim (The University of Tokyo) | |||||
| 13:20 | (Invited) Advanced Packaging Materials for 5G Applications | I-07 | Gold Coated Optical Microneedles Lens Array for Photothermal Therapy | 28 | ||
| Dongshun Bai | Kotaro Shobayashi, Xiaobin Wu, Jongho Park, Beomjoon Kim | |||||
| (Brewer Science, Inc.) | (The University of Tokyo) | |||||
| 13:45 | (Invited) LCP Technology in 5G era- MetroCirc | I-06 | A Rapid COVID-19 Diagnostic Device Integrating Porous Microneedles and the Paper-based Immunoassay Biosensor | 30 | ||
| Takashi Noma | Leilei Bao, Jongho Park, Soonjin Shim, Misako Yoneda, Chieko Kai, Beomjoon Kim | |||||
| (Murata Manufacturing Co., Ltd.) | (The University of Tokyo) | |||||
| 14:10 | Control of Electrical Behavior of Stretchable Films Printed Using Electrically Conductive Pastes During Cyclic Tensions | 60 | ||||
| Masahiro Inoue, Hikaru Watanabe, Kaito Oodzutsumi | ||||||
| (Gunma University) | ||||||
| 14:35 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | Interview with the Authors (Discussion after the session) | ||||
| 14:50 | Coffee break + Sponsor's Exhibition | |||||
| 15:00-16:55 | Session 16: Signal Integrity | Session 17: Novel Polymer Technology for Advanced Optical Components | ||||
| Chairperson | Chairperson | |||||
| Kazuyuki Nakagawa (Renesas Electronics Corp.) | Takaaki Ishigure (Keio University) |
|||||
| Yasuhiro Ikeda (Hitachi, Ltd.) | Hideyuki Nawata (Nissan Chemical
Corporation) |
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| 15:00 | (Invited) Improvements in Measurement Accuracy of On-wafer Measurements from Millimeter-wave to Terahertz Frequencies | I-03 | Design and Fabrication of Y-branched Polymer Waveguide based Optical Coupler | 19 | ||
| Ryo Sakamaki | Ryosuke Hatai, Hiroki Hama, Takaaki Ishigure | |||||
| (AIST) | (Keio University) | |||||
| 15:25 | Effect of Surface Treatment of Transmission Line on Frequency Characteristics | 29 | Development of 3-Dimensional Single-mode Core Over-Crossing Polymer Optical Waveguides Using the Mosquito Method | 21 | ||
| Jumpei Miike, Akira Kon, Makoto Miyoshi, Takatoshi Yagisawa | Md Omar Faruk Rasel1), Takaaki Ishigure2) | |||||
| (Fujitsu Optical Components Limited) | (1)Khulna University, 2)Keio University) | |||||
| 15:50 | The Electrical Analysis on Ultra High Density IO Fan-Out Design | 33 | Fabrication of the Electro-optic Polymer Modulator for O-band Intra-datacenter Communications | 37 | ||
| Po-I Wu, Chen-Chao Wang, Chih-Yi Huang, Hung-Chun Kuo, Ming-Fong Jhong | Alisa Bannaron, Hiromu Sato, Shiyoshi Yokoyama | |||||
| (Advanced Semiconductor Engineering, Inc.) | (Kyushu University) | |||||
| 16:15 | Noise Reduction Termination for RFI Induced Channel Resonance using Common-mode Choke and Differential Signal Balancer | 50 | O-band Silicon-polymer Hybrid EO Modulator | 40 | ||
| Masaaki Kameya, Eishi Gofuku, Kazuyuki Nakamura | Hiromu Sato, Alisa Bannaron, Shiyoshi Yokoyama | |||||
| (Kyushu Institute of Technology) | (Kyushu University) | |||||
| 16:40 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | Interview with the Authors (Discussion after the session) | ||||
| 16:55 | Close | |||||