Plenary and invited Speakers

Last update: July 18, 2017

Plenary Speakers

Jan Vardaman (TechSearch International, Inc.)
"Packaging of Photonic Integrated Circuits – Technology, Design Rules and Scale-Up to Manufacturing"
Peter O’Brien (Tyndall National Institute)

There has been much investment in research programmes to advance Photonic Integrated Circuit (PIC) technologies, resulting in the rapid growth of highly innovative PIC-based solutions for a wide range of applications and markets. However, much of this activity has focused on the PIC chip, and an assembly and packaging bottleneck now exists which blocks users from commercializing full system solutions. Furthermore, as PICs tend to be complex and highly integrated chips in small form-factors, the assembly and packaging challenges are considerable, requiring a diverse range of advanced capabilities.
In my talk, I will present an overview of assembly and packaging technologies for a range of PIC devices, including Silicon, InP and SiN materials. I will also present how packaging design rules are important to ensure cost-effective packaging solutions are available to users. Finally, I will present details of the new European Pilot Packaging Line (PIXAPP), which is developing a range of standardized optical and electrical packaging technologies, with the objective of addressing scale-up to large volume packaging.

"Short Reach Optical Interconnects"
Stephen E. Ralph (Georgia Institute of Technology)

This talk will review the component, coding and packaging challenges that must be met to deploy power efficient ultrahigh capacity VCSEL-based multimode fiber links. These optical interconnects are the primary data transport infrastructure of datacenters and high performance computing. Indeed, the bandwidth distance advantage of optical links leads to shorter and shorter interconnect distances and an increase in available deployments if cost and power efficiency goals can be achieved.
The anticipated data rates require high-speed photonics, electronics and most importantly advanced circuits that enable proper signal processing strategies. Multimode VCSELs together with multimode fiber require special attention to relative intensity noise and mode partition noise.
Cost and density goal require heterogeneous packaging strategies and chip scale integration. Photonic packaging methods that are compatible with standard microelectronic high throughput assembly techniques are preferred. A holistic approach that spans packaging, signal processing and high speed components will be shown to be necessary.


CPMT Special Speakers

William Chen (ASE Global)

Bill Bottoms (Advanced Polymer Monitoring Technologies)

S.W. Ricky Lee (Hong Kong University of Science & Technology)


Special Speakers
"Fan-out WLP versus Flip Chip, PoP, and SiP: When is it cost effective?"
Amy P. Lujan (SavanSys Solutions LLC)

Fan-out wafer level packaging has been an area of focus in the electronics packaging industry for multiple years now. Fan-out packages are being used in application processors, microcontrollers, data centers, and automotive applications—just to name a few areas—and the number of applications is growing. Understanding the cost of fan-out wafer level packages is important when considering this technology for new applications, but that is only half of the equation. In addition to understanding what a fan-out package will cost, designers and technology suppliers must also understand the cost of the package a fan-out solution is replacing.
Fan-out wafer level packaging comes in many forms, and different styles of fan-out are suited to compete with different incumbent solutions. This presentation will describe cost comparisons of fan-out wafer level packaging versus three current technologies: single flip chip BGA packages, flip chip package-on-package designs that utilize through-mold-vias, and laminate-based system-in-packages. Different styles of fan-out, such as die-first, die-last, face-up and face-down, will be evaluated as appropriate for each comparison.

Shuzo Akejima (Toshiba Corporation)


Invited Speakers
"Low-loss Multi-fiber to Waveguide Connector for On-Board Applications"
Blanca Ruiz (Reichle & De-Massati AG)
"Recent Advances for High Speed Short Reach Optical Fiber Interconnects for Datacom Links"
"Polymer based Photonic Integration for Sensors, Communication, and Active Optical PCB"
Martin Schell (Fraunhofer Heinrich-Hertz-Institut)
"Optical Fibers for High Density Interconnects"
Scott Bickham (Corning Research and Development Corporation)
"Key design elements of a High Density Mid Board Optical Interconnect"
Kevin Burt (Samtec Incorporated)
Advanced Packaging:

Yasumitsu Orii (NAGASE & CO., LTD.)
"Higher Reliability for Low-temperature Curable Positive-Tone Photosensitive Dielectric Materials"
Yu Shoji (Toray Industries, Inc.)
"Integrated dry process for panel level package as novel technology of desmear, seed and lithography"
Shinichi Endo (Ushio Inc.)
"Development of Processor package structure using embedded Thin Film Capacitor Package substrate"
Masateru Koide (Fujitsu Advanced Technologies Ltd.)
Power Electronics & Automotive:

Hiroshi Yamaguchi (National Institute of Advanced Industrial Science and Technology (AIST))

Kentaro Kaneko (Kyoto University, FLOSFIA Inc.)

Yoshikazu Takahashi (Fuji Electric Co., Ltd.)

Masayoshi Yamamoto (Nagoya University)
"Industrialization of Microwave Chemical Process"
Iwao Yoshino (Microwave Chemical Co., Ltd.)


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