Plenary and invited Speakers

Last update: October 31, 2017

Plenary Speakers
"A New Era in Advanced Packaging: FO-WLP Emerges!"
Jan Vardaman (TechSearch International, Inc.)

The semiconductor industry is entering a new era where packaging is increasingly done at the wafer level, with wafer fabrication equipment and processes. One of the hot topics is fan-out wafer level packaging (FO-WLP). This is a disruptive technology that does not require the use of a substrate, and in many processes there is no bump. By 2019, volumes for fan-out wafer level packages (FO-WLPs) will be driven by application processors, switches, power management integrated circuits (PMICs), audio CODEC, connectivity modules, and radar modules for automotive electronics. The use of FO-WLP for application processors instead of the traditional flip chip on laminate substrates found in package-on-package (PoP) is a game changer. The shift is not only driven by form factor, but also electrical and thermal performance considerations. By 2019, volumes for fan-out wafer level packages (FO-WLPs) will be driven by application processors, switches, power management integrated circuits (PMICs), audio CODEC, connectivity modules, and radar modules for automotive electronics. Drivers for the adoption of FO-WLP in different applications are presented. The presentation discusses which formats most likely to emerge as volume packages and why. Included is a discussion on the trade-offs and various formats for embedded die, FO-WLP, and FC-CSP.

"Packaging of Photonic Integrated Circuits – Technology, Design Rules and Scale-Up to Manufacturing"
Peter O’Brien (Tyndall National Institute)

There has been much investment in research programmes to advance Photonic Integrated Circuit (PIC) technologies, resulting in the rapid growth of highly innovative PIC-based solutions for a wide range of applications and markets. However, much of this activity has focused on the PIC chip, and an assembly and packaging bottleneck now exists which blocks users from commercializing full system solutions. Furthermore, as PICs tend to be complex and highly integrated chips in small form-factors, the assembly and packaging challenges are considerable, requiring a diverse range of advanced capabilities.
In my talk, I will present an overview of assembly and packaging technologies for a range of PIC devices, including Silicon, InP and SiN materials. I will also present how packaging design rules are important to ensure cost-effective packaging solutions are available to users. Finally, I will present details of the new European Pilot Packaging Line (PIXAPP), which is developing a range of standardized optical and electrical packaging technologies, with the objective of addressing scale-up to large volume packaging.

"Short Reach Optical Interconnects"
Stephen E. Ralph (Georgia Institute of Technology)

This talk will review the component, coding and packaging challenges that must be met to deploy power efficient ultrahigh capacity VCSEL-based multimode fiber links. These optical interconnects are the primary data transport infrastructure of datacenters and high performance computing. Indeed, the bandwidth distance advantage of optical links leads to shorter and shorter interconnect distances and an increase in available deployments if cost and power efficiency goals can be achieved.
The anticipated data rates require high-speed photonics, electronics and most importantly advanced circuits that enable proper signal processing strategies. Multimode VCSELs together with multimode fiber require special attention to relative intensity noise and mode partition noise.
Cost and density goal require heterogeneous packaging strategies and chip scale integration. Photonic packaging methods that are compatible with standard microelectronic high throughput assembly techniques are preferred. A holistic approach that spans packaging, signal processing and high speed components will be shown to be necessary.


CPMT Special Speakers

William Chen (ASE Global)

Bill Bottoms (Advanced Polymer Monitoring Technologies)
"Packaging of UV Light-Emitting Diodes for Non-Lighting Applications"
S.W. Ricky Lee (Hong Kong University of Science & Technology)

Light-emitting diodes (LED) have become the 4th generation light source since the turn of the century. In the past decade, people witnessed more and more applications of general lighting applications using LEDs. There is no doubt that solid-state lighting has become commodity in the comercial markets. Many people are wondering about what next waves of LED R&D should be focused on. Based on the speaker’s observation, there are three emerging areas worth noting, namely, UV-LED, visible light communications (VLC), and micro-LED display. All of these are for non-lighitng applications. This presentation will briefly touch on these emerging areas and then focus on UV-LED. The intention is to bring the on-going technology trend to the awareness of active researchers on LED so that they can put their resources and efforts on the hot spot. In addition to the fundamentals of UV-LED and relevant concerns in packaging, certain applications will be introduced to demonstrate the features of UV-LED which are different from conventional general lighting.


Special Speakers
"Fan-out WLP versus Flip Chip, PoP, and SiP: When is it cost effective?"
Amy P. Lujan (SavanSys Solutions LLC)

Fan-out wafer level packaging has been an area of focus in the electronics packaging industry for multiple years now. Fan-out packages are being used in application processors, microcontrollers, data centers, and automotive applications—just to name a few areas—and the number of applications is growing. Understanding the cost of fan-out wafer level packages is important when considering this technology for new applications, but that is only half of the equation. In addition to understanding what a fan-out package will cost, designers and technology suppliers must also understand the cost of the package a fan-out solution is replacing.
Fan-out wafer level packaging comes in many forms, and different styles of fan-out are suited to compete with different incumbent solutions. This presentation will describe cost comparisons of fan-out wafer level packaging versus three current technologies: single flip chip BGA packages, flip chip package-on-package designs that utilize through-mold-vias, and laminate-based system-in-packages. Different styles of fan-out, such as die-first, die-last, face-up and face-down, will be evaluated as appropriate for each comparison.

"New industries come out through FOWLP in the future"
Shuzo Akejima (Rising Technologies Co.,Ltd)

FOWLP is the epoch-making technology in the packaging history which does not use any Substrate, Wire bonding nor Flip chip. However, it is still occupied by a kind of monopoly business and would not expand to the industry changing level. This presentation will try to show the original suggestions which enhance and create the new business to the industry level through FOWLP technologies.
1. Need value added to FOWLP from 2D to simplified 3D. Each original business segment, substrate makers, OSATs, Bumping or WLP even LCD makers could participate the function of the new FOWLP and share the business without any giant investment.
2. Original advantage of FOWLP is free from Bonding or Flip chip pads for Chip designers. Which means they can shrink the chip, and obtain more chips in one wafer. High density of function dedicate wafer need some new assembly process and material. Conventional Dicing or Die attach should need new innovations.
3. IoT and AI module especially “Inference Engine of Edge Side” will become very compact. Most of them would be less than 10mm □ multichip module. FOWLP deployed on modified Minimal FAB, which cost is almost same as assembly manufacturing line, can expand the quick turnaround business like 3D printer of “Inference Engine”. Small volume various kind samples with low cost and quick turnaround would be prevailed.
The speaker is really anticipating and have a passion that this new epoch-making technology will activate the semiconductor packaging industry again. And continuously every year proof the concept of his original opinions.


Invited Speakers
"Low-loss Multi-fiber to Waveguide Connector for On-Board Applications"
Blanca Ruiz (Reichle & De-Massati AG)
"Recent Advances for High Speed Short Reach Optical Fiber Interconnects for Datacom Links"
"Polymer based Photonic Integration for Sensors, Communication, and Active Optical PCB"
Martin Schell (Fraunhofer Heinrich-Hertz-Institut)
"Optical Fibers for High Density Interconnects"
Scott Bickham (Corning Research and Development Corporation)
"Key design elements of a High Density Mid Board Optical Interconnect"
Kevin Burt (Samtec Incorporated)
"28-Gb/s x 24-channel On-Board Optical Transceiver Operated under an Air-Cooling Environment"
Hideyuki Nasu (Furukawa Electric Co., Ltd.)
Advanced Packaging:
"Neuromorphic Device for Edge Computing"
Yasumitsu Orii (NAGASE & CO., LTD.)
"Higher Reliability for Low-temperature Curable Positive-Tone Photosensitive Dielectric Materials"
Yu Shoji (Toray Industries, Inc.)
"Integrated dry process for panel level package as novel technology of desmear, seed and lithography"
Shinichi Endo (Ushio Inc.)
"Development of Processor package structure using embedded Thin Film Capacitor Package substrate"
Masateru Koide (Fujitsu Advanced Technologies Ltd.)
Power Electronics & Automotive:
"Advanced Power Semiconductors and Development of High performance Power Module"
Hiroshi Yamaguchi (National Institute of Advanced Industrial Science and Technology (AIST))
"Power device applications of Ga2O3 for SBDs and bipolar devices"
Kentaro Kaneko (Kyoto University, FLOSFIA Inc.)
"Recent Progress of Power Semiconductor Devices and Their Futures"
Noriyuki Iwamuro (University of Tsukuba)
"An Mathematical Analysis of False Turn-On Phenomenon of GaN HEMT"
Masayoshi Yamamoto (Nagoya University)
"Industrialization of Microwave Chemical Process"
Iwao Yoshino (Microwave Chemical Co., Ltd.)
"The "NanoSuit" for the observation of living and wet organisms in an electronmicroscope"
Takahiko Hariyama (Hamamatsu University School of Medicine)
"Latest Development and Application of Heat Pipes for Electronics and Automotive"
Masataka Mochizuki (The Heat Pipes)


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