Plenary and invited Speakers

Last update: March 11, 2019

Plenary Speakers
"Novel crystalline and amorphous semiconductors"
Hideo Hosono (Tokyo Institute of Technology)
Abstract:

Peter O'Brien (Tyndall National Institute)
Abstract:
"2D-materials spread heat at nanoscales"
Sebastian Volz (LIMMS/CNRS-IIS (France))

Abstract:
Thermal transport becomes less efficient as structures scale down since phonon-boundary scattering becomes predominant, therefore thermal management becomes more challenging in micro-electronic or optical devices. Here we aim at revealing the predominance of Surface Phonon-Polaritons (SPhPs) in thin film heat conduction. SPhPs are evanescent electromagnetic waves coupled to optical phonons and propagating along the interfaces of polar dielectrics. Through theoretical demonstration, SPhP propagation length reaches ten micrometers and SPhP spectral range reduces to the one of Surface Phonon-Polariton resonance in semi-infinite systems. Consequently, SPhPs contribution to heat flux along a surface is usually found negligible.
We have shown that thin film geometries allow for drastic changes in the surface evanescent electromagnetic field in terms of spectrum broadening and of propagation length. In thin silica films with thicknesses smaller than 1 micron, propagation length can reach centimeters and more, and evanescent waves exist in the full spectral range. Our calculations predict that those two modifications yield guided radiative heat fluxes higher than the one carried by phonons.
Moreover, thermal conductivity contributed by SPhPs can be further enhanced by increasing temperature. Nevertheless no experimental result directly proves neither the existence of a SPhP heat channel nor the enhancement of thermal conductivity in thin film due to those carriers. We experimentally measure effective in-plane thermal conductivity of amorphous SiN thin films and show that it can indeed be significantly increased by surface SPhPs when the film thickness scales down.

 


EPS Special Speakers

Chris Bailey (University of Greenwich)
Abstract:

Beth Keser (Intel Corporation)
Abstract:

 


Invited Speakers
"PLP - From Idea to Industrialization"
Tanja Braun (Fraunhofer IZM)
"Trends in enhanced integrated photonics for hyperscale data centre and 5G environments"
Richard Pitwon (Resolute Photonics Ltd.)
"Single-mode glass waveguide substrate for PIC packaging"
Lars Brusberg (Corning Research & Development Corporation)
"Market & Industrial Trends of Optical Interconnect"
Bernard HL Lee (SENKO Advanced Components (HK) Ltd)
"Holistic transformation to enable the mass manufacturing of Tb/s transceivers"
Tolga Tekin (Fraunhofer IZM)
"Hybrid photonic integration and 3D nano-printing: Combining silicon photonics with organic materials"
Christian Koos (Karlsruhe Institute of Technology)
"Unleashing the potential of α-Ga2O3"
Takuto Igawa (FLOSFIA Inc.)
"Temporal and Spatial Modification of Thermal Radiation"
Chih-Ming Wang (National Dong Hwa University)
"Mapping of metal/semiconductor and semiconductor/semiconductor interfaces using scanning internal photoemission microscopy"
Kenji Shiojima (University of Fukui)
"Thermally stable and transparent polyketone resin"
Hiroshi Matsutani (Hitachi Chemical Co., Ltd.)
"Physical Layer Simulation Technology for Automotive Ethernet"
Takehiro Kawauchi (Sumitomo Electric Industries, LTD.)

 


 

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