Speakers

Last update: November 4, 2022

Plenary Speakers
"Semiconductor Packaging - The Future is Now!"
Madhavan Swaminathan (Georgia Institute of Technology)

Abstract:
The recent buzz in the semiconductor industry is all about advanced packaging, a heterogeneous platform that enables the integration and miniaturization of systems. In fact, semiconductor packaging is taking center stage to continue Moore's law.
After providing a brief introduction into the reasons why heterogeneous integration using semiconductor packaging is a means to continue Moore's law, I will present on some of our recent advances and contributions in System on Package (SoP) technologies, a concept that we have been pioneering for almost three decades, that has relevance to emerging applications in Artificial Intelligence, Wireless Communications, Automotive, and Harsh Environments.

"Microfabricated Optical Probes for Neuromodulation"
Chang-Hyeon Ji (Ewha Womans University)

Abstract:
Since the advent of optogenetics technology, where genetically modified neurons are stimulated with light with a specific wavelength, various neural probes with monolithically integrated electrodes and light delivery functionalities have been developed using microelectromechanical systems (MEMS) technology. In this talk, various light delivery strategies for optogenetics will be analyzed, and an LED and polymer waveguide coupled silicon optrode array and wireless neuromodulation system will be introduced.

"Heterogenous Package Integration for Consumer and Automotive Sensor"
Adrian Arcedera (Amkor Technology, Inc.)

Abstract:
Microelectromechanical systems (MEMS) technology and sensors enable a wide range of applications from the Internet of Things (IoT), 5G wireless technology, artificial intelligence (AI) to autonomous driving. While other basic building blocks like microcontrollers, connectivity and others have all benefited from using standard integrated circuit (IC) packaging platforms, a broad diversity of package types and form factors for almost every application and end market has been created for MEMS and sensors.
The evolution from a discrete single MEMS/sensor towards sensor fusion has created new opportunities and applications. Standard MEMS and sensor platforms have helped market proliferation by providing customizability on the inside and a standard form factor on the outside package. This ensures maximum compatibility during packaging assembly, final test and surface mount assembly processes without sacrificing device performance.
As the market continues to grow, and applications continue to become more complex, the need for heterogeneous integration (HI) becomes an essential part of the new standard MEMS and sensor package platforms. This webinar will explore the different solutions available from an outsourced assembly and test (OSAT) supplier and their advantages for MEMS and sensor products.

"Dynamic Wireless Power Transfer to accelerate carbon neutrality ~Latest Trends in Japan and the world~"
Kaori Takahashi (Mitsubishi Research Institute, Inc.)

Abstract:
Electromobility is in vogue, and the deployment of electric vehicles into a real life is a central measure for automobile decarbonization. However, only a limited number of consumers are willing to become EV owners due to its' costly batteries or a range anxiety of a single charging. Currently, governmental subsidies are essential for EV proliferation.
Dynamic Wireless Power Transfer (DWPT) is one of the most promising technologies to solve this issue. It works by feeding power from the road surface to electric vehicles in motion. A variety of pilot tests and R&D projects on DWPT have been conducted in many places, mainly in Europe and the United States. A large-scale demonstration pilot using this system will also start in Japan. DWPT has great potential to push the widespread adoption of EVs.
In this talk, I will introduce domestic and international trends in DWPT, the technology that is practicable enough to realize and promote electric vehicles.

"Electronic-Photonic Integration"
Brad Booth (Technology evangelist (Formerly Microsoft))

Abstract:
The incredible pace of network and computer bandwidth growth requires the next generation of data centers to find ways to conserve power while satisfying the increased bandwidth demand. This lead the industry to start work on specifications for tighter electronic and photonic integration with technologies such as co-packaged optics. This presentation will look at what are some of the driving factors to consider tighter electronic-photonic integration and the challenges that the industry will need to overcome to enable scaling at the growth of bandwidth demand.

 


IEEE EPS Special Speakers
"Material Needs for meeting Next Generation Advanced Packaging Challenges"
Sam Karikalan (Broadcom Inc.)

Abstract:
Next Generation advanced packages for HPC and Photonics applications require materials that meet much more stringent electrical performance requirements at higher frequencies, reliably superior thermal performance for handling extreme power densities and excellent mechanical performance to ensure reasonable warpage and stress for ever growing body sizes of the packages. This talk will discuss the material properties that influence such performance metrics and the need for the industry to invent and invest in more exhaustive material characterization as well.


"Materials and Modelling Challenges for High Reliability Packaging"
Chris Bailey (University of Greenwich)

Abstract:
Advanced packaging and heterogeneous integration are posing a number of challenges for modelling tools and accurate materials data. The adoption of compound semiconductors and wide band gap devices provide many benefits: higher switching and higher temperature capabilities. This presentation will provide an overview of how physics-based modelling and machine learning is providing guidance to designers in terms of optimising packaging materials selection for subsequent reliability. Examples that will be discussed include flip-chip assembly of focal plane arrays consisting of a compound semiconductor die mounted onto a silicon-based read-out chip for the fine pitch devices using indium solders. Also the challenges for micro-BGA assembly of semiconductor die and the impact of underfills and conformal coating on subsequent reliability. Details from the heterogeneous integration roadmap will also be highlighted.

"EPS Welcome"
Kitty Pearsall (Boss Precision, Inc.)

 


Special Speakers
"Heterogeneous Integration Enabling High Performance AI Hardware"
Takashi Hisada (IBM Research - Tokyo)

Abstract:
Demands of AI compute is rapidly increasing in all areas of industry, but scaling of AI compute is significantly limited by high power consumption of the current AI computing systems. Extremely higher energy-efficient system is needed to meet the future demands of AI compute. There are various proposals of energy-efficient AI engines such as reduced precision digital AI core and analog AI core utilizing in-memory computing. In order to maintain scaling of total system's performance, innovations are required not only in AI chips but also in packaging, so-called Heterogeneous Integration, which enables higher bandwidth between chips. In this talk, various high density chip-to-chip interconnect technologies such as Si bridge, organic interposer, and 3D chip stack will be introduced.

 


Invited Speakers
Photonics:
"Packaging technologies for high-bandwidth silicon photonic datacom transceivers"
Hiren Thacker (Cisco Systems, Inc.)
"Novel solder-reflow resistant thermoplastic polyetherimides for co-packaged optical applications"
Gabrie Hoogland (SABIC)
"Optical coupling structures printed with Two-Photon-Polymerization"
Jörg Smolenski (Nanoscribe GmbH & Co. KG)
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Process and Material Technologies:
"Artifact Metrics-Based Supply Chain Integrity: New Trends in Object Authentication and Tracking"
Tsutomu Matsumoto (Yokohama National University)
"Development of oxide glass-ceramic derived all-solid-state Na battery"
Tsuyoshi Honma (Nagaoka University of Technology)
"Advanced Insulation Materials for Next IC Package"
Shiro Tatsumi (Ajinomoto Co., Inc.)
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SI/PI/RF/EMC:
"AI-Accelerator Proof of Concept by a Multi-IP Chip Project"
Shin-ichi O'uchi (AIST)
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Bioelectronics and Healthcare:
"Chemical sensors based on organic field-effect transistors for real-sample analysis"
Tsuyoshi Minami (The University of Tokyo)
"Rubber-like stretchable electronics for skin-conformable wearable devices"
Naoji Matsuhisa (The University of Tokyo)
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Power Electronics:
"Material Solutions for High-reliability and High-temperature Power Electronics"
Aarief Syed-Khaja (Heraeus Deutschland GmbH / Heraeus Electronics)
"Application of SiC power devices to ultra-high voltage equipment"
Takashi Nakamura (NexFi Technology Inc. / Osaka University)
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Automotive:
"Trends in reverb chamber Testing"
Garth D'Abreu (ETS-Lindgren)
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