Last update: September 25, 2023

Plenary Speakers

Seungwook Yoon (Samsung Electronics Corp.)

"Optical I/O Chiplets and Architectures for Computing Fabrics"
Mark Wade (Ayar Labs)

Abstract: Ever increasing SoC package-to-package bandwidths are creating challenging requirements for die edge bandwidth density, power consumption, and reach. Recent advances in generative AI have accelerated the need for next-generation computing interconnects. To meet the requirements, optical chiplets that leverage advanced packaging have emerged as a viable solution This presentation summarizes trends in applications, optical chiplets and requirements for computing fabrics, and forward looking roadmap projections.

"Co-Package Optics is the big next thing: What happened?"
Daniel M. Kuchta (IBM Thomas J. Watson Research Center)

"Latest Advanced Packaging Solutions for Heterogeneous Integration"
C.P. Hung (ASE Group)

Abstract: Advanced packages deliver the highest density interconnect between chips and are implemented as pivotal enabling technologies for ultrahigh performance module or system. This presentation will explore the design variation, structural difference and developing challenges of the advanced packages for new generation heterogeneous integration to applications on AI server, data center and automotive computing.


IEEE EPS Special Speakers
"Supply Chain Trends, Challenges, and Disruptions in Semiconductor Packaging"
Kitty Pearsall (Boss Precision, Inc.)

Abstract: The semiconductor packaging market is continuing to grow as the global industry recovers from Covid. The impact of the pandemic itself was readily apparent in its supply chain. As a result, the importance of the supply chain (SC) was brought to the forefront of the global semiconductor manufacturers. The significance of this is great since the semiconductor market is estimated to be $532 Billion this year and the global supply chain management market is stated as approximately 29 billion dollars with a CAGR of 10.7% (ResearchAndMarkets.com).
Emerging market applications continue to drive this growth through applications that include automotive, medical, health, wearables, mobile and telecommunications, high-performance computing, smart manufacturing, internet of things, and artificial intelligence.
It is noted that the assembly package manufacturing process that some OSATs, OEMs, and foundries had become: over-reliant on single-source suppliers; focused heavily on cost optimization; had limited/minimal SC transparency; and depended on "just-in-time" production methodology to minimize inventory. There are more challenges facing manufacturers than these. All of these make the manufacturer more vulnerable and less agile and less flexible to any type of disruption. KPMG highlighted that "95% of supply chains must quickly react to changing conditions, but only 7% are able to execute decisions in real time".
This brief presentation will provide SC trends, challenges, and potential future SC directions important to the semiconductor supply chain of OSATs, OEMs, and foundries.

Sam Karikalan (Broadcom Inc.)


Special Speakers

Harald Kuhn (Fraunhofer ENAS)

"Strategical Positioning of AIST Open R&D platform on Advanced Logic Semiconductors Technology"
Yoshihiro Hayashi (AIST / Keio University)

Abstract: Moore's law has been kept on transistor number per unit area, while the device structure has been being evolved from planar MOSFET via 2.5D FinFET to 3D GAAFET with high-k/metal replacement gate-stuck, possibly enhancing RF/analog performances. Under the NEDO's R&D project, "Post-5G information communication system infrastructure strengthening" (JPNP20017), basic researches has been kicked off, focusing on the device physics and process phyco-chemistry for these logic-semiconductor devices since 2021. The pilot-line is to be provided for the technology sharing with not only device and tool venders but also system users and universities under "Consortium for Advanced Semiconductor Manufacturing Technology (ASMA)".

"Dynamic Wireless Power Transfer Technologies for Future Electric Vehicles"
Takehiro Imura (University of Science)


Invited Speakers
"2.5D Photonic Integration for GPU Interconnects"
Benjamin Lee (NVIDIA)
"Energy-Efficient Integrated Photonics for Future Optical Interconnects and Neuromorphic Computing"
Stanley Cheung (Hewlett Packard Labs)
"Photonic System-in-Package (pSiP) by applying thin glass"
Henning Shröder (Fraunhofer IZM)
Advanced Packaging:
"Metal-polymer direct joining using small textures on metal surface"
Yusuke Kajihara (The University of Tokyo)

Takeyasu Saito (Osaka Metropolitan University)
Process and Material Technologies:

Gari Arutinov (Holst Centre)
"Atomic imaging of Al2O3/diamond interface by photoelectron"
Mami N. Fujii (Kindai University)
Power Electronics:
"350℃ operation of SiC complementary JFET logic gates"
Mitsuaki Kaneko (Kyoto University)
"The Cutting-edge Simulation and Validation Technology using Model-based Development"
Karsten Krügel (dSPACE GmbH)
SI / PI / RF / EMC:

Yasuhiro Morikawa (ULVAC, Inc.)
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