Best Paper Award

"Polymeric Multi/Demultiplexers using light-induced self-written waveguides for cost-effective optical interconnection"

Tatsuya Yamashita, Akari Kawasaki, Manabu Kagami
( Toyota Central R&D Labs., Inc.)

Takashi Yasuda, Hideki Goto
( TOYOTA Motor Corporation)

"A wafer-level system integration technology for flexible pseudo-SOC incorporates MEMS-CMOS heterogeneous devices"

Hiroshi Yamada, Yutaka Onozuka, Atsuko Iida, Kazuhiko Itaya, Hideyuki Funaki
(Corporate R&D Center, Toshiba Corporation)

Kazuhiro Takahashi, Hiroshi Toshiyoshi
(Institute of Industrial Science, the University of Tokyo)

Young Paper Award

"Guard-Ring Effect for Through Silicon Via (TSV) Coupling Reduction"

Jonghyun Cho, Kihyun Yoon, Jun So Pak, Joohee Kim, Joungho Kim
(Terahertz Interconnection and Package Laboratory, KAIST, Daejeon, Korea)

Junho Lee, Hyungdong Lee , Kunwoo Park
(Advanced Design Team, Hynix Semiconductor Inc.)

"Room-temperature Si-Si and Si-SiN wafer bonding"

Ryuichi Kondou, Chenxi Wang, Tadatomo Suga
(School of Engineering, The University of Tokyo)

"Assembly-Stress-Mechanism in Pad Areas of Flip Chip Package on High-k/Metal gate Transistors"

Yukitoshi Ota, Fumito Itoh, Kazuhiro Ishikawa, Kiyomi Hagihara, Takeshi Matsumoto,
Teppei Iwase, Yutaka Itoh, Hiroshige Hirano
(Panasonic Corporation)