The candidates of the Young Award are under 35 years old.
Best Paper Award
"A 25-Gb/s x 4ch, 8 x 8 mm2 small size optical transceiver module for optical interconnection"
Naoki Matsushima, Norio Chujo, Toshiaki Takai, Toru Yazaki
(Yokohama Research Laboratory, Hitachi, Ltd)
Daichi Kawamura,Yasunobu Matsuoka, Yong Lee, Hiroki Yamashita, Takashi Takemoto, Hideo Arimoto
(Central Research Laboratory, Hitachi, Ltd)
Yoshiaki Ishigami, Kinya Yamazaki, Yoshinori Sunaga
(Cable Materials Research Laboratory, Hitachi Metals)
"Development of a Chip Prober for Pre-Bond Testing of a 3D-IC"
Naoya Watanabe, Motohiro Suzuki, Masahiro Aoyagi
(Nanoelectronics Research Institute, National Institute of Advanced Industrial Science and Technology)
Michiyuki Eto, Kenji Kawano
(STK TECHNOLOGY CO., LT)
Young Award
"Power distribution network design method based on frequency-dependent target impedance for jitter design of memory interface"
Yasuhiro Ikeda, Masahiro Toyama, Satoshi Muraoka, Yutaka Uematsu, and Hideki Osaka
(Yokohama Research Laboratory, Hitachi Ltd.)
"An numerical model for Bottom-up copper electrodeposition of TSV with additives"
Wei LUO, Xue FENG, Liming Gao, and Ming LI
(Shanghai Jiao Tong University)
"Novel Bonding Method Using Cu Bumps Coated With Flexible Ag Nanoparticle Layer Formed By Squeegee-Coating"
Weixin Fu, Jun Mizuno, Shuichi Shoji, Takashi Kasahara, Akiko Okada, and Shugo Ishizuka
(Waseda University)
"A Cost Effective TO-CAN Packaged 10 Gbps EML Module Employing Inductance Compensation Technique"
Mizuki Shirao, Nobuo Ohata, Kenichi Uto, and Hiroshi Aruga
(Information Technology R&D Center, Mitsubishi Electric Corporation)