Session 1: Advanced Packaging Ⅰ

Chairperson

Shinya Takyu (Toshiba Corporation)

Kenji Takahashi (Toshiba Corporation)

Session 6: Optical Transceiver Module

Chairperson

Shigeru Nakagawa (IBM)

Greg Fish (Aurrion)

Session 13: Power Integrity / Signal Integrity - Noise Suppression

Chairperson

Hideki Osaka (Hitachi, Ltd.)

Takashi Harada (NEC)

(Invited) Design, Simulation, and Process Development of 2.5D TSV Interposer for High Density Packaging

Dongkai Shangguan*, Xiaoli Ren, Kai Xue, Feng Jiang, Ye Ping, Xiaomen Wu, Heng Wu, Chongshen Song, Fengwei Dai, and Daquan Yu

(National Center for Advanced Packaging1,
Institute of Microelectronics, Chinese Academy of Sciences2)

(Invited) High-speed optical engines and optical interconnect challenges and solutions

Mitch Fields

(Avago Technologies)

(Invited) Noise Suppression by Lossy Filters in Power Distribution Network

Yoshitaka Toyota and Kengo Iokibe

(Okayama University)

(Invited) Bridging Between 3D Stacking and 3D IC Technologies

Wael Zohni, and Hiroaki Sato

(Invensas Corporation)

A 25-Gb/s x 4ch, 8 x 8 mm2 small size optical transceiver module for optical interconnection

Naoki Matsushima1, Norio Chujo1, Toshiaki Takai1, Toru Yazaki1, Daichi Kawamura2, Yasunobu Matsuoka2, Yong Lee2, Hiroki Yamashita2, Takashi Takemoto2, Hideo Arimoto2, Yoshiaki Ishigami3, Kinya Yamazaki3, and Yoshinori Sunaga3

(Yokohama Research Laboratory, Hitachi, Ltd.1,
Central Research Laboratory, Hitachi, Ltd.2,
Cable Materials Research Laboratory, Hitachi Metals, Ltd.3)

Ultra-wideband Noise Suppression of Power Supply Noise by Combining Mushroom and Planar Type EBG Structures

Keisuke Ikemiya, Mayumi Sakai, and Toshio Sudo

(Shibaura Institute of Technology)

A 77 GHz CMOS Power Amplifier Module Using Multi-layered redistribution Layer Technology

Masaru Sato, Yoshikatsu Ishizuki, Shinya Sasaki, Yoichi Kawano, Hiroshi Matsumura, Toshihide Suzuki, and Motoaki Tani

(Fujitsu Laboratories Ltd.)

Polymer waveguide-coupled 14-Gb/s x 12-channel parallel-optical modules mounted on optical PCB through Sn-Ag-Cu solder reflow

Agyl Fajar Rizky, Naoya Nishimura, Yoshinobu Nekado, Toshinori Uemura, and Hideyuki Nasu

(FITEL Photonics Laboratory, Furukawa Electric Co., Ltd.)

Power integrity behavior for various packaging environments

Masahiro Terasaki, Sho Kiyoshige, Wataru Ichimura, Ryota Kobayashi, Genki Kubo, Hiroki Otsuka, and Toshio Sudo

(Shibaura Institute of Technology)

Warpage behavior of 2.5D Si-package using Si-interposer

Koji Hara, Kei Murayama, Mitsuhiro Aizawa, and Mitsutoshi Higashi

(Shinko Electric Industries Co., LTD.)

Session 2: Advanced Packaging Ⅱ

Chairperson

Hiroshi Yamada (Toshiba Corporation)

Yoichiro Kurita (Toshiba Corporation)

Session 7: Si Photonics and Single-Mode Optics

Chairperson

Bert Offrein (IBM Research - Zurich)

Mehdi Ashgari (Kotura)

Session 14: Power Integrity / Signal Integrity - Modeling and Jitter

Chairperson

Yoshitaka Toyota (Okayama University)

Daisuke Iguchi (Fuji Xerox Co., Ltd.)

(Invited) Perspective for Advanced Micro-solder Bump Bonding

Yasumitsu Orii

(IBM Research - Tokyo)

(Invited) Heterogeneous Integration for Silicon Photonics

Greg Fish

(Aurrion)

(Invited) 2.5D Silicon Interposer PDN model for Power Aware SI analysis

Yukio Masuko

(Cadence Design Systems, Inc.)

(Invited) POP package for Mobile Application Processor

Zhang Tonglong

(Nantong Fujitsu Microelectronics Co.,Ltd)

(Invited) Hybrid integration technology of laser source with laser diode arrays on silicon optical waveguide platform by flip-chip bonding for silicon photonics

Takanori Shimizu1,2, Nobuaki Hatori1,2, Makoto Okano1,3, Masashige Ishizaka1,2, Yutaka Urino1,2, Tsuyoshi Yamamoto1,2, Masahiko Mori1,3, Takahiro Nakamura1,2, and Yasuhiko Arakawa1,4

(Institute for Photonics-Electronics Convergence System Technology1, Photonics Electronics Technology Research Association2, National Institute of Advanced Industrial Science and Technology3, Insititute of Industrial Science, The University of Tokyo4)

Power/Ground Wiring for High Speed Driver

Kaoru Hashimoto, Yutaka Akiyama, Chihiro Ueda, and Kanji Otsuka

(Collaborative Research Center, Meisei University)

Fine pitch PoP Introduction

Jinseong Kim, Gyuwan Han, Byoungwoo Cho, Yesul Ahn, Dongjoo Park, Juhoon Yoon, Glenn Rinne, Choonheung Lee, and Akito Yoshida

(Research and Development Center, Amkor Technology Korea Inc)

Thermal Via Technology for Silica-based Planar Lightwave Circuit

Shinichi Aozasa, Yu Kurata, Yasuaki Hashizume, Mikitaka Itoh, and Hiroyuki Fukuyama

(NTT Photonics Laboratories, NTT Corporation)

Power distribution network design method based on frequency-dependent target impedance for jitter design of memory interface

Yasuhiro Ikeda, Masahiro Toyama, Satoshi Muraoka, Yutaka Uematsu, and Hideki Osaka

(Yokohama Research Laboratory, Hitachi Ltd.)

Airfoil: A New Fine Line Fabrication Technology on Glass-cloth Prepreg without Insulating Films for PKG Substrate

Kumpei Yamada, Daisuke Fujimoto, Tetsurou Iwakura, Youichi Kaneko, and Hikari Murai

(Hitachi Chemical Co., Ltd.)

Direct coupling of cavity-resonator-integrated guided-mode resonance filter to a single-mode optical fiber

Junichi Inoue1, Koji Hatanaka1, Yuki Iwata1, Kenji Kintaka2, Kenzo Nishio1, Yasuhiro Awatsuji1, and Shogo Ura1

(Kyoto Institute of Technology1,
National Institute of Advanced Industrial Science and Technology1)

A study on self turn-on phenomenon in fast switching operation of high voltage power MOSFET.

Tsuyoshi Funaki

(Osaka University)

Session 3: 3D Technology Ⅰ

Chairperson

Ping Cheng (Shanghai Jiao Tong University)

Shoji Uegaki (ASE Group)

Session 8: Optics for Computing I

Chairperson

Mitch Fields (Avago Technologies)

Shogo Ura (Kyoto Institute of Technology)

Session 15: Micro Bump Bonding

Chairperson

Kiyokazu Yasuda (Osaka University)

Takashi Hisada (IBM)

(Invited) Cu Pillar – the Next Phase in the Evolution of the Packaging DNA

William T. Chen

(ASE Group)

(Invited) Photonics for computing applications

Bert Offrein

(IBM Research - Zurich)

(Invited) Bump & Ball Interconnect Technology Update

Akito Yoshida

(Amkor Technology Japan)

Study of mechanical properties of Cu specimen using through-silicon-vias (TSV) electrodeposition bath

Wang Huiying, Hong Wang, Ping Cheng, and Guifu Ding

(Shanghai Jiao Tong University)

Demonstration of high-bandwidth density and low-power organic optical MCM link

Masao Tokunari, Seiji Takeda, Hsiang-Han Hsu, and Shigeru Nakagawa

(IBM Research - Tokyo)

Novel Bonding Method Using Cu Bumps Coated With Flexible Ag Nanoparticle Layer Formed By Squeegee-Coating

Weixin Fu, Jun Mizuno, Shuichi Shoji, Takashi Kasahara, Akiko Okada, and Shugo Ishizuka

(Waseda University)

Cu balls and Cu-core balls for 3D packaging

Hiroyoshi Kawasaki, Takahiro Hattori, Takahiro Roppongi, Daisuke Soma, Isamu Sato, and Yuji Kawamata

(Senju Metal Industry Co., Ltd.)

No-Polish Elastic Optical Multifiber Connector for Optical Interconnection

Tsuyoshi Aoki1, Hidenobu Muranaka1, Shigenori Aoki1, Katsuki Suematsu2, Mitsuhiro Iwaya2 and Masato Shiino2

(Fujitsu Laboratories Ltd.1, Furukawa Electric Co., Ltd.2)

Influence of Diffusion on Solid-state Bonding for Micro-bumps at Low Temperatures

Ying-Hui Wang1 and Tadatomo Suga2

(The Institute of Innovation in International Engineering Education, School of Engineering, The University of Tokyo1
Department of Precision Engineering, School of Engineering, The University of Tokyo2)

Stress evolution of electroplating Cu in TSV with different leveller addition

Xue Feng

(Shanghai Jiao Tong University)

Optical Multi-channel Connector for Rigid Waveguide and Fiber Connection

Kazumi Nakazuru1, Masatoshi Tsunoda1, Naoki Takahashi1, Satoshi Asai2, and Takahiro Matsubara2

(KYOCERA Connector Products Corporation1,
KYOCERA Corporation2)

Creep characteristics of Sn-58Bi, In-3Ag and SAC305 solders measured with fine diameter specimens

Takashi Hisada1, Ikuo Shohji2, Yasuharu Yamada1, and Kazushige Toriyama3

(Integrated Supply Chain Japan, IBM Tokyo Laboratory, IBM Japan, Ltd. 1
Faculty of Science and Technology, Gunma University2
IBM Research - Tokyo, IBM Tokyo Laboratory, IBM Japan, Ltd.3)

(Invited) Recent progress in through silicon vias (TSVs): Cu filling, microstructure characterization and mechanical properties

Ping Cheng1，Hong Wang1，Guifu Ding1，Huiyin Wang1，Zhaoyu Wang1，Ming Li1, and Jiangyan Sun2

(Shanghai Jiao Tong University1, Shanghai Sinyang Semiconductor Materials Co., Ltd2)

(Invited) Waveguide gratings for in-line wavelength-selective modulators in high-density optical interconnects

Shougo Ura1 and Kenji Kintaka2

(Kyoto Institute of Technology1, National Institute of Advanced Industrial Science and Technology2)

VUV-Assisted Low Temperature Bonding For Organic/Inorganic Hybrid Integration at Atmospheric Pressure

Akitsu Shigetou1, Mano Ajayan1, and Jun Mizuno2

(National Institute for Matrials Science1, Waseda University2)

Development of a Chip Prober for Pre-Bond Testing of a 3D-IC

Naoya Watanabe1, Motohiro Suzuki1, Michiyuki Eto2, Kenji Kawano2, and Masahiro Aoyagi1

(Nanoelectronics Research Institute, National Institute of Advanced Industrial Science and Technology1,
STK TECHNOLOGY CO., LTD.2)

Self-Written Waveguide Technology with Light-curable Resin Enabling Easy Optical Interconnection

Yukinobu Soeda, Tadayuki Enomoto, and Osamu Mikami

(School of Engineering, Tokai University)

Direct Bonding of PEN at Room Temperature by Means of Surface Activated Bonding method using Nano-adhesion Layer

Takeshi Matsumae, Masahisa Fujino, and Tadatomo Suga

(The Department of Precision Engineering, The School of Engineering, The University of Tokyo)

An numerical model for Bottom-up copper electrodeposition of TSV with additives

Wei LUO, Xue FENG, Liming Gao, and Ming LI

(Shanghai Jiao Tong University)

Highly efficient connectivity between VCSEL and multimode optical waveguide

Hiroki Ishikawa, Ryota Kinoshita, and Takaaki Ishigure

(Graduate School of Science and Technology, Keio University)

Thermal reliability of Ag alloy wire bonds

Rui Guo, Cheng Yin, Dali Mao, Ming Li, Zhong Lv, and Hope Chiu

(Shanghai Jiao Tong University)

Growth models of copper filling in TSV(through silicon via) at different current density

Zhaoyu Wang, Hong Wang, Ping Cheng, Guifu Ding, and Xiaolin Zhao

(Shanghai Jiao Tong University)

Organic-inorganic hybrid material for on-board optical interconnection and it’s applications in optical coupling

Hideyuki Nawata

(Nissan Chemical Industries, LTD.
Advanced Materials & Planning Department)

Effects of microstructural evolution on transport properties of
electrically conductive adhesives with Ag loading

Masahiro Inoue

(Gunma University)

Session 5: High-speed Interconnect

Chairperson

Hideki Osaka (Hitachi ltd.)

Keitaro Yamagishi (Mitsubishi Electric Corp.)

Session 10: Optical Communication and Lighting Technology

Chairperson

Osamu Mikami (Tokai University)

Takaaki Ishigure (Keio University)

Session 17: Materials for Packaging

Chairperson

Masahiro Inoue (Gunma University)

Akitsu Shigetou (NIMS)

(Invited) High-speed transmission copper cable for 25Gbit/s/lane

Takahiro Sugiyama1, Hideki Nonen1, Izumi Fukasaku1, Takashi Kumakura2, and Hiroshi Ishikawa1

(Cable Materials Laboraory, Cable Materials Company, Hitachi Metals, Ltd.1, Electric Wire & Cable Division, Cable Materials Company, Hitachi Metals, Ltd.2)

(Invited) High-speed KTN optical beam deflector for swept-source optical coherence tomography

Yuzo Sasaki1, Yuichi Okabe1, Masahiro Ueno1, Takashi Sakamoto1, Seiji Toyoda1, Junya Kobayashi1, Shogo Yagi2, and Kazunori Naganuma2

(NTT Photonics Laboratories, NTT Corporation1,
NTT Advanced Technology Corporation2)

Metal-filled anodized aluminum oxide
A potential substrate material for a high density interconnection in 3D packaging

Yoshinori Hotta and Kousuke Yamashita

(Fujifilm Corporation)

The effect of surface roughness on high frequency transmission line

Toshiki Iwai, Daisuke Mizutani, and Motoaki Tani

(Fujitsu Laboratories Ltd.)

Modal power distributions in short reach optical communication　using step-index-type multimode optical fibers

Manabu Kagami, Akari Kawasaki, and Masatoshi Yonemura

(Toyota Central R&D Labs., Inc.)

Improvement of chemical resistance of positive-tone photosensitive polyimide coatings in the electroless plating process

Osamu Baba, Satoshi Kamemoto, Yuki Masuda, Tomoyuki Yuba, and Masao Tomikawa

(Electronic & Imaging Materials Research Laboratory, Toray Industries, Inc. Shiga Plant)

A Cost Effective TO-CAN Packaged 10 Gbps EML Module Employing Inductance Compensation Technique

Mizuki Shirao, Nobuo Ohata, Kenichi Uto, and Hiroshi Aruga

(Information Technology R&D Center, Mitsubishi Electric Corporation)

Serially-Grafted Electrooptic Polymer Waveguide Fabricated by Thermal Imprint Lithography

Okihiro Sugihara and Toshikuni Kaino

(Institute of Multidisciplinary Research for Advanced Materials, Tohoku University)

Preparation of Solder Plated Patterns on Paper and Applying to RFID Tags

Yuichi Sakai1, Tomoaki Futakuchi1, Ken-ichi Honda2, Keiichi Hirose2, and Akihiro Inoda2

(Toyama Industrial Technology Center1
Tateyama Kagaku Industry Co., Ltd2)

High Bandwidth Application with Wide I/O Memory on 2.5DIC Silicon Interposer

Chen-Chao Wang, Hung-Hsiang Cheng, Feng-Ming Chung, Po-Chih Pan, Chi-Tsung Chiu, and Chih-Pin Hung

(Electrical Laboratory, Advanced Semiconductor Engineering Inc)

A damage-free sapphire substrate removal process to realize highly manufacturable wafer-level white LED package

Miyuki Shimojuku, Akihiro Kojima, Miyoko Shimada, Hideyuki Tomizawa, Yosuke Akimoto, Hideto Furuyama, Yoshiaki Sugizaki, and Hideki Shibata

(Center for Semiconductor Research & Development, Toshiba Corporation Semiconductor & Storage Products Company)

Newly ultra low CTE materials leading to reduction of the warpage for thinner PKG applications

Tomohiko Kotake, Hikari Murai, Shin Takanezawa, Masato Miyatake, Masaaki Takekoshi, and Masahisa Ose

(Hitachi Chemical Co.,Ltd.)

Session 11 Component and Circuits

Chairperson

Hideyuki Ohashi (Mitsubishi Electric Corp.)

Yutaka Uematsu (Hitachi ltd.)

Session 18: Reliability 1

Chairperson

Kenji Hirohata (Toshiba corporation)

Masaki Hashizume (Tokushima university)

A Broadband Antenna with Fan-Shaped and Trapezoidal Elements on Printed Circuit Board for Ultra-Wideband Radio

Fukuro KOSHIJI1, Kazuya HIRAGURI1, and Kohji KOSHIJI2

(Kokushikan University1, Tokyo University of Science2)

A Finite Element Analysis of Board Level Drop Reliability Test and Analysis of Stress Buffer Effect of Polyimide

Mitsuru Fujita1, Nobuhiro Anzai1, Kazutoshi Sakamaki2, and Yoshiharu Kariya3

(Asahi Kasei E-materials Corporation1, Graduate school of Shibaura institute of technology2, Materials science and Engineering department, Shibaura institute of technology3)

Electromagnetic Field Analysis of a Broadband Antenna Built for Third-Generation Mobile and UWB Communications Considering the Effects of Dielectric Housing

Yusuke AKIYAMA1, Fukuro KOSHIJI1, and Kohji KOSHIJI2

(Kokushikan University1, Tokyo University of Science2)

Built-in IDDT Appearance Time Sensor for Detecting Open Faults in 3D IC

Shohei Suenaga1, Masaki Hashizume1, Hiroyuki Yotsuyanagi1, Tetsuo Tada2, and Shyue-Kung Lu3

(The Univ. of Tokushima1, Tokushima Bunri University2, National Taiwan University of Science and Technology3)

Development of Novel Touch Panel and Its System Packaging

Yoichi Sato1, Yutaka Akiyama1, Kaoru Hashimoto1, Koichi Meguro2, and Kanji Otsuka1

(Collaborative Research Center, Meisei University1,
JJtech Co., Ltd.2)

Reduction Method of Number of Electromagnetic Simulation Times for Estimating Output Voltage at Hard Open TSV in 3D IC

Ei Haraguchi1, Masaki Hashizume1, Katsuya Manabe1, Hiroyuki Yotsuyanagi1, Tetsuo Tada2, Shyue-Kung Lu3, and Zvi Roth4

(The Univ. of Tokushima1, Tokushima Bunri University2, National Taiwan Univ. of Science and Technology3, Florida Atlantic University4)

Session 12: Cooling/Thermal

Chairperson

Kishio Yokouchi (Fijitus Interconnect Technologies Ltd.)

Tomoyuki Hatakeyama (Toama Prefectual University)

Session 19: Reliability 2

Chairperson

Masaki Hashizume (Tokushima university)

Kenji Hirohata (Toshiba corporation)

Applied Voltage Dependence of Hotspot Location and Temperature in Power Si MOSFET

Risako Kibushi, Tomoyuki Hatakeyama, Shinji Nakagawa, and Masaru Ishizuka

(Toyama Prefectural University)

Failure analysis of electric circuit board by high resolution magnetic field microscopy

Yuki Mima1, Noriaki Oyabu2, Takeshi Inao3, Noriaki Kimura4, and Kenjiro Kimura1

(Kobe University1, Kyoto University2, Murata Manufacturing Company, Ltd3, Integral Geometry Instruments4)

Optimal Laser Condition for Laser Soldering in
Cream and Ring Solder

Risako Kibushi, Tomoyuki Hatakeyama, Dai Imai, Shinji Nakagawa, and Masaru Ishizuka

(Toyama Prefectural University)

Nondestructive Observation of Fatigue Crack Propagation Process in Some Solder Joints by Synchrotron Radiation X-ray Micro-tomography

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, and Takao Mori

(Toyama Industrial Technology Center)

Effects of Obstruction in front of a Piezoelectric Micro Blower on Performance Characteristics

Takashi Fukue1, Koichi Hirose1, Yoshiki Matsuura1, and Hirotoshi Terao2

(Iwate University1, ALPS Electronic Co., Ltd2)

Nondestructive defect analysis case example using combination of Lock-in IR Thermography and high resolution X-ray CT technology

Naoki Seimiya

(Marubun Corporation)

Low Profile Cooling Solutions for Advanced Packaging Based on Ultra-Thin Heat Pipe and Piezo Fan

Randeep Singh, Mohammed Ahamed Shahed, Ahmed Jalilvand, Masahiro Matsuda, Yoji Kawahara, Kazuhiko Goto, Yuji Saito, and Masataka Mochizuki

(R&D Department, Thermal Technology Division, Fujikura Ltd)

Development of High-speed X-ray CT Inspection System Using X-ray Line Sensor

Daisuke Suzuki1, Kenji Noguchi1, Takayuki Murakoshi1, and Atsushi Teramoto2

(Nagoya electric works Co., Ltd1, Fujita Health University2)