November 9, 2015 | (Monday) | ||||||
Room A (Science Hall) | Room B (AV Room) | Room C (Innovation Room) | |||||
8:30 | Registration | ||||||
9:30- 11:45 |
Room A (Science
Hall) Chairpersons Takaaki Ishigure (Keio University) & Hideyuki Nasu (Furukawa Electric Co., Ltd.) |
||||||
9:30 | Opening Remarks & Welcome Talk: Shigeru Nakagawa (General Chair, IEEE CPMT Symposium Japan; IBM Research - Tokyo) | ||||||
9:45 | Plenary Speech 1: Glass for the Connected World ... Displays,
Semiconductors and Communications Waguih Ishak (Corning Incorporated) |
||||||
10:40 | Break | ||||||
10:50 | Plenary Speech 2: Multimode Polymer Waveguides
for Very High Speed On-Board Optical Interconnects Richard Penty (University of Cambridge) |
||||||
11:45 | Lunch (free time) | ||||||
13:00- 15:00 |
Session 1: On-board Optics | Session 2: Materials for Advanced Packaging Processes and Flexible Devices | Session 3: Fan-Out Package | ||||
Chairpersons | Chairpersons | Chairpersons | |||||
Hidetoshi Numata (IBM Research-Tokyo) | Tomonori Minegishi (Hitachi Chemical Co., Ltd.) | Masahiro Inoue (Gunma University) | |||||
Jonas Weiss (IBM Research - Zurich) | Samson Melamed (AIST) | Taiji Sakai (Fujitsu Laboratories Ltd.) | |||||
13:00 | (Invited) Compact Pluggable 300Gbit/s On-Board-Transceiver For High Density Optical Data Transmission | I-28 | Improvement in Dissolution Contrast of Positive-Tone Photo-Definable Poly (Benzoxazole) Materials | 10 | (Invited) The Potential of FOWLP. Can Cover 2.5D? | I-07 | |
Ulrich Keil | Daisaku Matsukawa1, Tetsuya Enomoto1, Noritaka Matsuie2, and Masayuki Ohe2 | Shuzo Akejima | |||||
(FCI Deutschland GmbH) | (1. Hitachi Chemical Co.,Ltd, 2. Hitachi Chemical Dupont Microsystems,Ltd) | (Toshiba Corporation) | |||||
13:25 | A High-Density 300-Gbit/s Parallel Optical Interconnect Module with Efficient Optical Sub-Assembly | 13 | Application of Embedding Insulation Sheet (EBIS) for FO-WLP | 23 | (Invited) The Panel Level Assembly Technology Which is Changing Semiconductor Package | I-18 | |
Yasunobu Matsuoka1, Yong Lee1, Toshiaki Takai1, Norio Chujo1, Naoki Matsushima1, Masataka Sato2, Shinji Komatsuzaki2, Akira Ogura2, Kinya Yamazaki2, and Yoshinori Sunaga2 | Masaya Toba | Akio Katsumata | |||||
(1. Hitachi, Ltd., 2. Hitachi Metals, Ltd.) | (Hitachi Chemical Co.,Ltd) | (J-Devices Corporation) | |||||
13:50 | A High-Density 300-Gbit/s Parallel Optical Interconnect Module with Efficient Thermal Dissipation Characteristics | 45 | New Non Conductive Film for High Productivity Process | 43 | Evaluation of Fan-Out Wafer Level Package Using 200 °C Curable Positive-Tone Photodefinable Polybenzoxazoles | 9 | |
Toshiaki Takai1, Norio Chujo1, Naoki Matsushima1, Yasunobu Matsuoka1, Yong Lee1, Hideo Arimoto1, Masataka Sato2, Shinji Komatsuzaki2, Akira Ogura2, and Kinya Yamazaki2 | Masao Tomikawa, Kazuyuki Matsumura, Yohei Sakabe, and Yoichi Shinba | Masato Nishimura1, Masaya Toba1, Noritaka Matsuie2, Takeharu Motobe2, and Masayuki Ohe2 | |||||
(1. Hitachi, Ltd., 2. Hitachi Metals, Ltd.) | (Toray Industries, Inc) | (1. Hitachi Chemical Co., Ltd., 2. Hitachi Chemical DuPont MicroSystems, Ltd.) | |||||
14:15 | (Invited) Progress towards Low Cost 1 Tb/s Optical Engines | I-23 | All in One PE Substrate: Highly Conducting Plastic Substrate with Surface Flatness and Gas Barrier Properties | 24 | Development of Bump Support Film (BSF) for expanding the size of WLCSP | 44 | |
Michael Tan | Wataru Morita, Tsutomu Hara, Tsuyoshi Muto, and Takeshi Kondo | Masanori Yamagishi1, Rey Alvarado2, Shinya Takyu1, Naoya Saiki1, and Akinori Sato1 | |||||
(HP Labs) | (Lintec Corporation Research Center) | (1. Lintec Corporation, 2. Qualcomm Technologies, Inc.) | |||||
14:40 | Interview with the Authors (Discussion after the session) | ||||||
15:00 | Coffee break | ||||||
15:15- 17:40 |
Session 4: Polymer Waveguides | Session 5: Thermal management | |||||
Chairpersons | Chairpersons | ||||||
Koichi Takemura (PETRA) | Kishio Yokouchi (Fujitsu Interconnect Technologies Ltd.) | ||||||
Henning Shröder (Fraunhofer IZM) | Tomoyuki Hatakeyama (Toyama Prefectual University) | ||||||
15:15 | (Invited) Development of High Layer Count PCBs with Embedded Waveguides for High Speed Applications | I-03 | Basic Study on Cooling Performance of Pulsating Airflow around Components Mounted in High-Density Packaging Electronic Equipment (Effects of Shapes of Components on Cooling Performance) | 42 | |||
Marika Immonen | Takashi Fukue1, Koichi Hirose1, and Hidemi Shirakawa2 | ||||||
(TTM Technologies Inc.) | (1. Iwate University, 2. National Institute of Technology, Toyama College) | ||||||
15:40 | Fabrication for Densely Aligned Multilayer GI Circular Core Polymer Optical Waveguides | 19 | Systemic Optimization of On-chip Thermoelectric Cooling | 22 | |||
Kyuta Suzuki and Takaaki Ishigure | Thanunathan Rangarajan, Tanay Karnik, Rahul Khanna, Kelly Lofgreen, Shammanna Datta, Davis Darvish, and Kaushik Vaidyanathan | ||||||
(Keio University) | (Intel Corporation) | ||||||
16:05 | Fabrication of Graded Index Profile in Self-Written Waveguide by UV Exposure Method | 30 | Highly Precise Technique of A Thermal Experiment and the Thermal Analysis in the Electronic Control Unit | 27 | |||
Ryo Hirakawa and Kenichi Yamashita | Takuya Shinoda1, Tomoyuki Hatakeyama2, and Masaru Ishizuka2 | ||||||
(Kyoto Institute of Technology) | (1. Denso Corporation, 2. Toyama Prefectural University) | ||||||
16:30 | Interchannel Pitch Conversion (250 to 125 µm) in Multimode Polymer Optical Waveguide for High-Density Optical Wiring | 20 | Influence of Thermo-Mechanical Stress on the Microstructure of Sintered Silver Joints for Microelectronics | 26 | |||
Hikaru Masuda and Takaaki Ishigure | Thomas Geoffroy1, Jean-Christophe Riou1, Eric Bailly1, Yves Bienvenu2, and Gilles Tarrisse1 | ||||||
(Keio University) | (1. Safran Electronics (Sagem), 2. Mines Paristech) | ||||||
16:55 | (Invited) Manufacturing and Performance of Silicone Polymer Waveguides for Optical Interconnects | I-05 | Sensitivity of the Thermal Profile of Bump-Bonded 3D Systems to Inter-die Bonding Layer Properties | 50 | |||
Ken Weidner | Samson Melamed, Katsuya Kikuchi, and Masahiro Aoyagi | ||||||
(Dow Corning Corporation ) | (National Institute of Advanced Industrial Science and Technology (AIST)) | ||||||
17:20 | Interview with the Authors (Discussion after the session) | ||||||
18:30 | Welcome Reception | ||||||
20:30 | Close | ||||||
November 10, 2015 | (Tuesday) | ||||||
Room A (Science Hall) | Room B (AV Room) | Room C (Innovation Room) | |||||
8:30 | Registration | ||||||
9:00- 10:00 |
Room A (Science
Hall) Chairpersons Shoji Uegaki (ASE Group) & Hiroshi Yamada (Toshiba Corporation) |
||||||
9:00 | CPMT
Special Talk: S.W. Ricky Lee (Hong Kong University of Science and Technology) William Chen (ASE Group) |
||||||
10:00- 12:00 |
Room A (Science
Hall) Chairperson Kiyokazu Yasuda (Osaka University) |
||||||
10:00 | Plenary
3: Future Society enabled by Trillion Sensors Susumu Kaminaga (SPP Technologies Co., Ltd.) |
||||||
10:55 | Break | ||||||
11:05 | Plenary
4: Biomimetics: Innovative Engineering based on Biodiversity Masatsugu Shimomura (Chitose Institute of Science and Technology) |
||||||
12:00 | Lunch (free time) | ||||||
13:00- 15:00 |
Session 6: Optical Link | Session 7: Bioelectronics I | Session 8: 3D Package | ||||
Chairpersons | Chairpersons | Chairpersons | |||||
Akinori Hayakawa (Fujitsu Limited) | Naoe Hosoda (National Institute for Materials Science) | Kenji Takahashi (Toshiba Corporation) | |||||
Drew Guckenburger (Molex Incorporated) | Kiyokazu Yasuda (Osaka University) | Shinya Takyu (Lintec Corporation) | |||||
13:00 | (Invited) High Speed Optical Interconnects with PAM4 Modulation for Short-Reach and Metro Applications | I-11 | (Invited) Highly Functional Ultrashort Pulse Fiber Laser Sources and Application for Optical Coherence Tomography | I-08 | (Invited)Brain Inspired Device in the era of Cognitive Computing | I-25 | |
Man Jiangwei | Norihiko Nishizawa | Yasumitsu Orii | |||||
(Huawei Technologies Co, Ltd.) | (Nagoya University) | (IBM Research - Tokyo) | |||||
13:25 | Fully Engineered QSFP AOC Using Solderable 4-Channel Optical Transceiver Module | 12 | (Invited) Label Free Bioimaging Using Nonlinear Coherent Raman Microscopy | I-20 | Thermal Characterization and Modeling of BEOL for 3D Integration | 29 | |
Hideyuki Nasu, Yozo Ishikawa, Naoya Nishimura, Masao Shinoda, Atsushi Izawa, Kazuya Nagashima, Yoshinobu Nekado, and Tomofumi Kise | Mamoru
Hashimoto |
Shunichi Kikuchi1, Makoto Suwada1, Hiroshi Onuki2, Yoshihisa Iwakiri2, and Naoaki Nakamura2 | |||||
(Furukawa Electric Co., Ltd.) | (Osaka University) | (1. Fujitsu Limited, 2. Fujitsu Advanced Technologies Limited) | |||||
13:50 | A Novel Lens System for High-Speed Light Peak Optical Link | 39 | (Invited) Raman Microscopy: Chemical and Analytical Imaging of Biomolecules | I-13 | Material Technology for 2.5D/3D TSV Package | 14 | |
H. S. Khoo, F. Chiang, S. Chen, C.-F. Shen, H. Shang, and J. Hou | Katsumasa Fujita | Kazuyuki Mitsukura1, Tatsuya Makino1, Keiichi Hatakeyama2, Kenneth June Rebibis3, Andy Miller3, and Eric Beyne3 | |||||
(FOCI Fiber Optic Communications, Inc.) | (Osaka University) | (1. Tsukuba Research Laboratory, Hitachi Chemical Co., Ltd., 2. Packaging Solution Center, Hitachi Chemical Co., Ltd., 3. 3D System Integration Program, Interuniversity Micro Electronics Center (IMEC)) | |||||
14:15 | CDR-Integrated Sn-Ag-Cu-Solder-Reflow-Capable Miniature 28-Gb/s x 4-Channel Module | 21 | Raman Spectroscopic Detection of Bio-Active Small Molecules Using Alkyne-Tag | 32 | Improving Self-Alignment Effect of Cu Balls by Organic and Inorganic Surface Coating | 6 | |
Kazuya Nagashima, Tomofumi Kise, Yozo Ishikawa, and Hideyuki Nasu | Jun Ando1,2,3, Almar
Palonpon1, Hiroyuki Yamakoshi3, Kosuke Dodo2,3, Satoshi Kawata1, Mikiko Sodeoka2,3, and Katsumasa Fujita1,2 |
Hiroyoshi Kawasaki1, Tomoaki NISHINO1, Takahiro Roppongi1, Daisuke SOMA1, Isamu SATO1, Yuji KAWAMATA1, Hirohiko HIRAO2, and Jun TASAKA2 | |||||
(Furukawa Electric Co., Ltd.) | (1. Department of Applied
Physics, Osaka University, 2. AMED-CREST, Japan Agency for Medical Research and Development, 3. Synthetic Organic Chemistry Laboratory, RIKEN) |
(1. Senju Metal Industry Co., Ltd, 2. Shikoku Chemicals Corporation) | |||||
14:40 | Interview with the Authors (Discussion after the session) | ||||||
15:00 | Coffee break | ||||||
15:15- 17:40 |
Session 9: Waveguide Technologies | Session 10: Bioelectronics II | Session 11: Advanced Package Technologies | ||||
Chairpersons | Chairpersons | Chairpersons | |||||
Ken Weidner (Dow Corning Corporation) | Shigenori Aoki (Fujitsu Laboratories, Ltd.) | Masahiro Aoyagi (AIST) | |||||
Marika Immonen (TTM Technologies Inc.) | Hiroshi Yamada (Toshiba) | Akio Katsumata (J-Devices Corporation) | |||||
15:15 | (Invited) Thin Glass Based Electro-Optical Circuit Board (EOCB): Waveguide Process, PCB Technology, and Coupling Interfaces | I-01 | (Invited) Functionality Emergence of Single Molecule Electronics | I-15 | (Invited) Electrical Interconnect Test Method of 3D ICs without Boundary Scan Flip Flops | I-22 | |
Henning Schröder | Takuji Ogawa | Masaki Hashizume | |||||
(Fraunhofer IZM) | (Osaka University) | (Tokushima University) | |||||
15:40 | Low-Loss Light Coupling Design for a Multimode Polymer Optical Waveguide via 45-degree Mirrors | 18 | (Invited) In Vitro Bio-Circuit Sensing Based on Cell-Semiconductor Interaction | I-09 | (Invited) 3DIC/TSV Process Developments by Printing Technologies | I-32 | |
Yoshie Morimoto and Takaaki Ishigure | Toshiya Sakata | Hiroaki Ikeda | |||||
(Keio University) | (The University of Tokyo) | (Napra Co.,Ltd. ) | |||||
16:05 | Simple Channel Reconnection Using Polynorbornene Based GI Waveguide for Optical Interconnection | 40 | (Invited) Surface Modification of Medical Devices : Biocompatible Artificial Surface | I-12 | Package Structure Interaction Induced Molding Issues in MCM Packages | 37 | |
Akihiro Horimoto, Katsuma Kitazoe, and Ryota Kinoshita | Kazuhiro Tanahashi | Megan Chang and Bob Lee | |||||
(Sumitomo Bakelite Co., Ltd.) | (Toray Industries Inc.) | (Texas Instruments Taiwan Limited) | |||||
16:30 | Organic-Inorganic Hybrid Material, "SUNCONNECT®" for Optical Interconnects | 41 | (Invited) New Biopolyimdies Possibly Applicable to Heat-Resistant and Transparent Insulator | I-21 | Parametric Optimization of Connector Press Fit Pin Deformation for High Volume Reliability | 46 | |
Hideyuki Nawata1, Takehiro Nagasawa1, Sayoko Tadokoro1, Kei YasuiI1, Daniel A. Sahade1, Sho Yoshida2, Yuki Saito2, Kazuki Yasuhara2, and Takaaki Ishigure2 | Tatsuo Kaneko | Mudasir Ahmad, Weidong Xie, and Qiang Wang | |||||
(1. Nissan Chemical Industries, LTD., 2. Keio University) | (JAIST) | (Cisco Systems Inc.) | |||||
16:55 | Low loss Polymer Waveguide Components for Silicon Photonic Packaging | 38 | (Invited) Mobile Biosensors with Printable Electrodes | I-17 | Influential Parameters in the Development of Transient Liquid Phase Soldering (TLPS) as a New Interconnect System for High Power Lighting Applications | 36 | |
Hidetoshi Numata1, Yoichi Taira1, Tymon Barwicz2 | Eiichi Tamiya | Aarief Syed-Khaja and Joerg Franke | |||||
(1. IBM Research - Tokyo, 2. IBM T.J.Watson Research Center) | (Osaka University) | (Friedrich-Alexander-Universität Erlangen-Nürnberg) | |||||
17:20 | Interview with the Authors (Discussion after the session) | ||||||
17:40 | Close | ||||||
November 11, 2015 | (Wednesday) | ||||||
Room A (Science Hall) | Room B (AV Room) | Room C (Innovation Room) | |||||
8:30 | Registration | ||||||
9:00- 10:40 |
Special Session: 3D Printing | ||||||
Room A (Science
Hall) Chairpersons Yutaka Uematsu (Hitachi ltd.) & Daisuke Iguchi (Fuji Xerox Co., Ltd.) |
|||||||
9:00 | (Invited) Characteristics and Advantages of Additive Manufacturing (3D Printing) Technique Using Electron Beam Instead of Laser Beam | I-19 | |||||
Akihiko Chiba | |||||||
(Tohoku University) | |||||||
9:25 | Advanced Substrate and Packaging Concepts for Compact System Integration with Additive Manufacturing Technologies for High Temperature Applications | 35 | |||||
Aarief Syed-Khaja, Daniel Schwarz, and Joerg Franke | |||||||
(Friedrich-Alexander-Universität Erlangen-Nürnberg) | |||||||
9:50 | (Invited) From Rapid Prototyping to Production | I-26 | |||||
Nikolai Zaepernick | |||||||
(EOS GmbH Electro Optical Systems) | |||||||
10:15 | (Invited) Laser sintering of high-temperature engineering plastics | I-33 | |||||
Toshiki Niino | |||||||
(The University of Tokyo) | |||||||
10:40 | Break | ||||||
10:50- 12:25 |
Session 12: Optical Connectivity | Session 13: Bioelectronics III | Session 14: Electrical Interconnect I | ||||
Chairpersons | Chairpersons | Chairpersons | |||||
Takaaki Ishigure (Keio University) | Kiyokazu Yasuda (Osaka University) | Hideki Oosaka (Hitach,Ltd.) | |||||
Man Jiangwei (Huawei Technologies Co, Ltd.) | Yoshio Nogami (Toray Engineering Co.,Ltd.) | Hideyuki Ohashi (Mitsubishi Electric corp.) | |||||
10:50 | (Invited) High-Density Multi-Lane Connectivity for Optical Interconnect | I-06 | (Invited) Ecological Color Devices by Biomimetic Nanostructures | I-14 | Measurement of Transmission Line in GHz Region | 28 | |
Mitsuhiro Iwaya | Akira Saito | Daisuke Ogawa, Yutaka Akiyama, Chihiro Ueda, Kaoru Hashimoto, and Kanji Otsuka | |||||
(Furukawa Electric Co., Ltd.) | (Osaka University) | (Meisei University) | |||||
11:15 | 10 Tb/s Scale Optical Interconnection System Using High-Density Optical Wiring | 7 | (Invited) Biomimetic Multifunctional Wrinkle Suraface | I-29 | Electrical Performance Analysis of Fine Line on High Density Package Substrate | 31 | |
Norio Chujo, Naoki Matsushima, Akiko Mizushima, Toshiaki Takai, Kouichi Fukumiya, Itoe Akutsu | Hiroshi Endo | Ming-Fong Jhong, Hung-Hsiang Cheng, and Chen-Chao Wang | |||||
(Hitachi, Ltd.) | (Toyama Prefectural University) | (ASE Group) | |||||
11:40 | Assembly Optimization for Low Power Optical MCM Link | 34 | Biomimetic Reversible Interconnection | I-35 | Improvement of Power Integrity with Die-Attached STO Thin Film Capacitors | 48 | |
Masao Tokunari, Hsiang-Han Hsu, Koji Masuda, and Shigeru Nakagawa | Naoe Hosoda | Masamitsu Yoshizawa2, Seisei Oyamada2, Atsunori Hattori1, Toru Nakura3, Masahiro Kano3, and Kunihiro Asada3 | |||||
(IBM Research - Tokyo) | (National Institute for Materials Science) | (1. Noda Screen Co., Ltd., 2. Noda Techno Co., Ltd., 3. The University of Tokyo) | |||||
12:05 | Interview with the Authors (Discussion after the session) | ||||||
12:25 | Lunch (free time) | ||||||
13:25- 15:50 |
Session 15: Si-Photonics | Session 16: Bioelectronics IV | Session 17: Electrical Interconnect II | ||||
Chairpersons | Chairpersons | Chairpersons | |||||
Hideyuki Nasu (Furukawa Electric Co., Ltd.) | Hiroshi Yamada (Toshiba) | Keitaro Yamagishi (Mitsubishi Electric corp.) | |||||
Urich Keil (FCI Deutschland GmbH) | Yoshio Nogami (Toray Engineering Co.,Ltd.) | Hideki Oosaka (Hitach,Ltd.) | |||||
13:25 | (Invited) Next Generation Transceivers for Datacom Applications | I-02 | Power, Signal Integrity for 25Gbps, 40dB Compensation Signal Conditioner for Backplane Architecture | 17 | |||
Drew Guckenberger | Kenji Kogo1, Norio Nakajima2, Fumio Yuki1, Naohiro Kohmu1, Takayasu Norimatsu1, Takashi Kawamoto1, and Takashi Muto2 | ||||||
(Molex Incorporated) | (1. Research & Development Group, Hitachi Ltd., 2. Information & Telecommunication Systems Company, Hitachi Ltd.) | ||||||
13:50 | Experimental Study on Reflection Phase Rotation of Cavity-Resonator-Integrated Guided-Mode Resonance Filter | 11 | (Invited) Evolution of Automated Blood Pressure Monitor for Laypeople's Easy Use | I-30 | Impedance Matching Method for Jitter Reduction of 28Gbps Retimer | 15 | |
Junichi Inoue1, Hiroki Okuda1, Kenji Kintaka2, Kenzo Nishio1, and Shogo Ura1 | Osamu Shirasaki | Fumio Yuuki1, Kenji Kogo1, Takayasu Norimatsu1, Naohiro Kohmu1, Takashi Kawamoto1, Norio Nakajima2, and Takashi Mutou2 | |||||
(1. Kyoto Institute of Technology, 2. National Institute of Advanced Industrial Science and Technology) | (Omron Healthcare Co., Ltd.) | (1. Research & Development Group, Hitachi Ltd., 2. Information & Telecommunication Systems Company, Hitachi Ltd.) | |||||
14:15 | (Invited) Chip-Scale Packaging of the Hybrid-Integrated Si Photonic Transceiver "Optical I/O Core" | I-04 | (Invited) Wearable Sensing Devices for Unobtrusive Biomedical Monitoring | I-16 | Integrated Module Structure of Fan-Out Wafer Level Package for Terahertz Antenna | 49 | |
Koichi Takemura | Kouji Fujii | Daijiro Ishibashi, Shinya Sasaki, Yoshikatsu Ishizuki, Shinya Iijima, Yoshihiro Nakata, Yoichi Kawano, Toshihide Suzuki, Motoaki Tani, and Taisuke Iwai | |||||
(PETRA) | (Nippon Telegraph and Telephone Corporation) | (Fujitsu Laboratories, Ltd.) | |||||
14:40 | (Invited) High-Dense Integrated 25-Gbps Silicon Photonic Transmitter and Receiver for On-Package Optical Interconnect | I-10 | (Invited) Wireless Body Area Network Using Magnetically-Coupled Wearable Coils | I-31 | |||
Akinori Hayakawa | Fukuro Koshiji | ||||||
(PETRA) | (Tokyo Polytechnic University) | ||||||
15:05 | (Invited) Optics and Silicon Photonics Packaging for Next Generation Datacenters | I-27 | |||||
Jonas Weiss | |||||||
(IBM Research - Zurich) | |||||||
15:30 | Interview with the Authors (Discussion after the session) | ||||||
15:50 | Close |