| November 20, 2017 | (Monday) | |||||||||
| Hall I | Hall II | Hall III | ||||||||
| 9:00 | Registration | |||||||||
| 10:00- 11:55 |
Session 1: Advanced Package 1 | Session 2: Optoelectronics 1 | Session 3: RF 1 | |||||||
| Chairperson | Chairperson | Chairperson | ||||||||
| Shinya Takyu (Lintec Corporation) | Scott Bickham (Corning Research and Development Corporation) | Masahiro Aoyagi (AIST) | ||||||||
| Hiroshi Yamada (Toshiba Corporation) | Yi Sun (OFS FITEL, LLC) | Kazuyuki Nakagawa (Renesas Electronics Corp.) | ||||||||
| 10:00 | Electromigration Mechanism on Interconnected Cu Pillar in Flip Chip Package | 51 | Single TO-Can GPON ONU Bi-directional Optical Sub-assembly with Si-Micromechanics | 49 | A 5-12 GHz Double-Balanced Power Mixer with Differential Transmission-Line Transformer in 0.18 µm CMOS | 6 | ||||
| Toshihiko Akiba,Takuo Funaya ,Hideaki Tsuchiya Kazuyuki Nakagawa, and Kenji Sakata | Mao-Chieh Hsu1, Leos Halmo1, and Joerg-R. Kropp2 | Hwann-Kaeo Chiou, Yu-Jen Chen, Hsu-Liang Yen, and Hwann-Kaeo Chiou | ||||||||
| (Renesas Electronics Corporation) | (1. Ezconn Corporation, 2. InBeCon GmbH) | (National Central University) | ||||||||
| 10:25 | Demonstration of High Electromigration Resistance of Enhanced Sub-2 Micron-Scale Cu Redistribution Layer for Advanced Fine-Pitch Packaging | 20 | An Ultra-Compact 25Gbit/s x 4ch Active Optical Cable with Gapped Ground Electrode Structure | 30 | On the Development of a Dual-Band 0.18-um BiCMOS Transmit/Receive Switch for Microwave and Millimeter-Wave Array Transceivers | 7 | ||||
| Hiroshi Kudo and Satoru Kuramochi | Naohiro Kohmu, Toshiaki Takai, Norio Chujo, and Hideo Arimoto | Cam Nguyen, D. Lee, C. Huynh, and C. Nguyen | ||||||||
| (DNP Co., Ltd.) | (Hitachi, Ltd.) | (Texas A&M University) | ||||||||
| 10:50 | The Influence of Intermetallic Compounds on High Speed Shear Testing with a Specific Interest in Electroless Palladium and Autocatalytic Gold | 16 | (Invited) Key design elements of a High Density Mid Board Optical Interconnect | I-05 | A Switchable Tunable Dual-Band Filter Using Varator Diodes for Tuning and Switching | 17 | ||||
| Rick Nichols, Gustavo Ramos, Robin Taylor, Petra Schreier, and Sandra Heinemann | Kevin Burt | ChiYang Chang, Chi-Yang Chang, Po-Jung Chou, and Chiao-Yi Hu | ||||||||
| (Atotech Deutschland GmbH) | (Samtec Incorporated) | (National Chiao Tung University) | ||||||||
| 11:15 | (Invited) 28-Gb/s x 24-channel On-Board Optical Transceiver Operated under an Air-Cooling Environment | I-16 | High Reliable Doherty Power Amplifier Module for LTE Small Cell Base Station | 27 | ||||||
| Hideyuki Nasu, Kazuya Nagashima, Toshinori Uemura, Atsushi Izawa, and Yozo Ishikawa | Yu-Cheng Hsu1, Jian-Yu Li2, and Lin-Kun Wu1 | |||||||||
| (Furukawa Electric Co., Ltd.) | (1. National Chiao Tung University, 2. Yuan Ze University) | |||||||||
| 11:40 | Interview with the Authors (Discussion after the session) | |||||||||
| 11:55 | Lunch (free time) & Platinum Sponsor's Seminar | |||||||||
| 12:50- 14:45 |
Session 4: Advanced Package 2 | Session 5: Optoelectronics 2 | Session 6: RF 2 | |||||||
| Chairperson | Chairperson | Chairperson | ||||||||
| Osamu Suzuki (Namics Corporation） | Kevin Burt (Samtec Incorporated) | Kazuyuki Nakagawa (Renesas Electronics Corp.) | ||||||||
| Masahiro Inoue (Gunma University) | Naohiro Kohmu (Hitachi, Ltd.) | Masahiro Aoyagi (AIST) | ||||||||
| 12:50 | (Invited) Neuromorphic Device for Edge Computing | I-09 | Spot Size Converting Fiber with a 4-µm Mode Field Diameter for Low-Loss Coupling to Silicon Photonic Circuits | 21 | Millimeter-Wave Antenna in Package on Low-Cost Organic Substrate for Flip Chip Chip Scale (FCCSP) package | 39 | ||||
| Yasumitsu Orii | Takuya Oda, Keisuke Hirakawa, Kentaro Ichii, and Kazuhiko Aikawa | Cheng Yu Ho, Cheng-Yu Ho, Ming-Fong Jhong, Po-Chih Pan, Chen-Chao Wang, and Chun-Yen Ting | ||||||||
| (NAGASE & CO., LTD.) | (Fujikura Ltd.) | (Advanced Semiconductor Engineering, Inc.) | ||||||||
| 13:15 | Micro-bump challenges and reliability improvements in stack-die packages | 18 | Ultra-Broadband, Polarization-Insensitive SMF-28 Fiber Edge Couplers for Silicon Photonics | 59 | 3D Packaging based 4-Channel LTCC Receiver Module | 47 | ||||
| Yi-Ting (Henry) Chen and Raghu Chaware | Bradley Snyder, Guy Lepage, Sadhishkumar Balakrishnan, Peter De Heyn, Peter Verheyen, Philippe Absil, and Joris Van Campenhout | Bo Zho, Qipeng Wang,Yue Lu,Qiang Ma,Pu Ge, and Chonghu Cheng | ||||||||
| (Xilinx Inc.) | (imec) | (Nanjing University of Posts and Telecommunications) | ||||||||
| 13:40 | Development of Extremely Thin Profile Flip Chip CSP using Laser Assisted Bonding Technology | 28 | (Invited) Optical Fibers for High Density Interconnects | I-04 | Miniaturized Wideband Bandpass Filter in IPD Technology with Passive Equalizer to Improve the Flatness of Insertion Loss Response | 9 | ||||
| ChoongHoe Kim, YangGyoo Jung, MinHo Kim, TaeHo Yoon, YunSeok Song, DongJoo Park, SeokHo Na, DaeByoung Kang, and KwangMo Lim | Scott Bickham | Yo-Shen Lin, Chia-Ching Huang, Wei-Ting Fang, and Yo-Shen Lin | ||||||||
| (Amkor Technology Korea, Inc.) | (Corning Research and Development Corporation) | (National Central University) | ||||||||
| 14:05 | (Invited) Recent Advances for High Speed Short Reach Optical Interconnects for Datacom Links | I-02 | Compact LTCC Filter with Vertically End-Coupled Resonators | 46 | ||||||
| Yi Sun | Bo Zhou,Yue Lu,Qiang Ma,Qipeng Wang, and Chonghu Cheng | |||||||||
| (OFS FITEL, LLC) | (Nanjing University of Posts and Telecommunications) | |||||||||
| 14:30 | Interview with the Authors (Discussion after the session) |
Gold Sponsor's Seminar@Hall III
"Enabling faster design and implementation decisions using virtual prototyping" Yoko Fujita (ZUKEN INC.) |
||||||||
| 14:45 | Coffee break + Sponsor's Exhibition @Conference room IV | |||||||||
| 15:00- 16:10 |
Hall I & II Chairperson Hideyuki Nasu (Furukawa Electric Co., Ltd.) & Takaaki Ishigure (Keio University) |
|||||||||
| Opening & Plenary Speech I | ||||||||||
| 15:00 | Opening Remarks & Welcome Talk Shinya Takyu (General Chair, IEEE CPMT Symposium Japan; Lintec Corporation) |
|||||||||
| 15:15 | Plenary Speech I: Short Reach Optical
Interconnects Stephen E. Ralph (Georgia Institute of Technology) |
P-03 | ||||||||
| 16:10- 17:40 |
Hall I & II Chairperson Yasumitsu Orii(NAGASE & CO., LTD.) & Shigenori Aoki (Fujitsu Laboratories, Ltd.) |
|||||||||
| CPMT Special Talk | ||||||||||
| 16:10 | Heterogeneous Integration Roadmap: (Title
TBD) Bill Chen (ASE Global) |
S-01 | ||||||||
| 16:55 | Heterogeneous Integration Roadmap: (Title
TBD) Bill Bottoms (ADVANCED POLYMER MONITORING TECHNOLOGIES) |
S-02 | ||||||||
| 18:30 | Welcome Reception | |||||||||
| 20:30 | Close | |||||||||
| November 21, 2017 | (Tuesday) | |||||||||
| Hall I | Hall II | Hall III | ||||||||
| 9:00 | Registration | |||||||||
| 9:15- 10:45 |
Session 7: Fan-out Package | Session 8: Thermal 1 | Session 9: Bioelectronics | |||||||
| Chairperson | Chairperson | Chairperson | ||||||||
| Yoichiro Sato (Asahi Glass Co. Ltd.) | Tomoyuki Hatakeyama (Toyama Prefectural Univ.) | Yoshio Nogami (Toray Engineering Co. Ltd.) | ||||||||
| Masao Tomikawa (Toray Industries Inc.) | TBD | TBD | ||||||||
| 9:15 | (Invited) Integrated dry process for panel level package as novel technology of desmear, seed and lithography | I-13 | (Invited) Latest Development and Application of Heat Pipes for Electronics and Automotive | I-18 | (Invited) Industrialization of Microwave Chemical Process | I-15 | ||||
| Shinichi Endo | Masataka Mochizuki | Iwao Yoshino | ||||||||
| (Ushio Inc.) | (The Heat Pipes) | (Microwave Chemical Co., Ltd.) | ||||||||
| 9:40 | 1l and 2l RDL Design for Fan-Out Panel Level Packaging and Electrical Simulation | 60 | Design Optimization of Heat Sink using Additive Manufacturing | 25 | (Invited) The "NanoSuit" for the observation of living and wet organisms in an electronmicroscope | I-17 | ||||
| Yanwen Bai, Shineng Ma, Xuyi Yang, Yazhou Zhang, Kuancheng Chen, Cong Zhang, and Chih-Chin Liao CHin-Tien Chiu | Y.Tateishi1, H.Gohara2, R.Kato2, Y.Ikeda2, V.Parque1, and T.Miyashita1 | Takahiko Hariyama | ||||||||
| (SanDisk InfoTech Shanghai) | (1. Waseda University, 2. Fujielectric CO.) | (Hamamatsu Univ. School of Medicine) | ||||||||
| 10:05 | Research of Fan-Out Panel Level Package (FOPLP) manufacturing process using single-sided adhesive tape | 29 | Thermal Modeling and Experimental Verification using Large-sized Stacked Chips | 64 | Development of micro-system encapsulation for silicon devices which are in contact with human cells | 48 | ||||
| Kazuhiro Kikuchi, Yasunori Karasawa, Yuusuke Nedzu, Ken Takano, Takeo Yoshinobu, and Takashi Sugino | Shunichi Kikuchi1, Makoto Suwada1, Yoshihisa Iwakiri2, and Naoaki Nakamura2 | Jean-Charles Souriau, Laetitia Castagné, and Simon Gilles | ||||||||
| (Lintec corporation) | (1. Fujitsu Limited, 2. Fujitsu Advanced Technologies Limited) | (CEA-Leti) | ||||||||
| 10:30 | Interview with the Authors (Discussion after the session) | |||||||||
| 10:45- 12:15 |
Session 10: Material | Session 11: Thermal 2 | Session 12: Power Electronics 1 | |||||||
| Chairperson | Chairperson | Chairperson | ||||||||
| Kenji Takahashi (Toshiba Memory Corporation) | Tomoyuki Hatakeyama (Toyama Prefectural Univ.) | Yoshinari Ikeda (Fuji Electric Co., Ltd.) | ||||||||
| Kazuyuki Mitsukura (Hitachi Chemical Co. Ltd.) | TBD | Daisuke Iguchi (Fuji Xerox Co., Ltd.) | ||||||||
| 10:45 | (Invited) Higher Reliability for Low-temperature Curable Positive-Tone Photosensitive Dielectric Materials | I-11 | Thermal Management in a Printing Machine for Improvement of Temperature Response of Printing Process using Design of Experiments | 73 | (Invited) Advanced Power Semiconductors and Development of High performance Power Module | I-06 | ||||
| Yu Shoji | Ryota MATSUTAKE1, Koichi HIROSE1, Tomoko WAUKE2, Hisashi HOSHINO2, Koji SATO1, Hirotoshi TERAO2, and Takashi FUKUE1 | Hiroshi Yamaguchi | ||||||||
| (Toray Industries, Inc.) | (1. Iwate University, 2. ALPS Electric co., Ltd.) | (National Institute of Advanced Industrial Science and Technology (AIST)) | ||||||||
| 11:10 | Development of Newly Bump Support Film (BSF) for WLCSP | 50 | Novel Simulation Method for Thermal Dissipation | 44 | (Invited) Power device applications of Ga2O3 for SBDs and bipolar devices | I-07 | ||||
| Akinori Sato | Kaoru Hashimoto and Kanji Otsuka | Kentaro Kaneko | ||||||||
| (LINTEC Corporation) | (Meisei University) | (Kyoto University, FLOSFIA Inc.) | ||||||||
| 11:35 | New design concept of thermal conductive sheet showing low total thermal resistance | 72 | Study of temperature estimation method for densely mounted surface mount components | 52 | Enhanced Breakdown Voltage for All-SiC Modules | 19 | ||||
| Masao Tomikawa, Atsushi Shimada, and Yoichi Shimba | Yoshinori Aruga1,Koichi Hirasawa1,Takayuki Yamabe1,Hirotoshi Aoki1,Tomoyuki Hatakeyama2,Shinji Nakagawa2, and Masaru Ishizuka2 | Motohito HORI, Yuichiro HINATA, and Katsumi TANIGUCHI | ||||||||
| (Toray Industries Inc.) | (1. KOA Corporation, 2. Toyama Prefectural University) | (Fuji Electric Co., Ltd.) | ||||||||
| 12:00 | Interview with the Authors (Discussion after the session) | |||||||||
| 12:15 | Lunch (free time) & Platinum Sponsor's Seminar | |||||||||
| 13:15- 14:45 |
Hall I & II Chairperson Shinya Takyu (Lintec Corporation) & Tomonori Minegishi (Hitachi Chemical Co. Ltd.) |
|||||||||
| Advanced Packaging Special "Integrated Package all around your life" | ||||||||||
| 13:15 | New industries come out through FOWLP in the future Shuzo Akejima (Toshiba Corporation) |
S-05 | ||||||||
| 14:00 | Fan-out WLP versus Flip Chip, PoP, and SiP:
When is it cost effective? Amy P. Lujan (SavanSys Solutions LLC) |
S-04 | ||||||||
| 14:45 | Coffee break + Sponsor's Exhibition @Conference room IV | |||||||||
| 15:00- 15:55 |
Hall I & II Chairperson Kiyokazu Yasuda (Osaka University) & Shinya Takyu (Lintec Corporation) |
|||||||||
| Plenary Speech II | ||||||||||
| 15:00 | Plenary Speech II: A New Era in Advanced Packaging: FO-WLP Emerges! Jan Vardaman (TechSearch International, Inc.) |
P-01 | ||||||||
| 15:55- 16:50 |
Hall I & II Chairperson Takaaki Ishigure (Keio University) & Hideyuki Nasu (Furukawa Electric Co., Ltd.) |
|||||||||
| Plenary Speech III | ||||||||||
| 15:55 | Plenary Speech III: Packaging of Photonic
Integrated Circuits – Technology, Design Rules and Scale-Up to
Manufacturing Peter O' Brien (Tyndall National Institute) |
P-02 | ||||||||
| 16:50 | Break | |||||||||
| 17:00- 18:30 |
Early Career Researcher's (ECR) Session (Open Forum with Beer) @Hall III |
|||||||||
| A Dual-Band Millimeter-Wave High-Gain Dielectric Resonator Antenna Using Vertical Assembly Technology | 3 | High Signal Integrity Design for Transmission System Including High-Parasitic Inductance Connectors | 24 | Optical Sensing by Exposed Core Fiber using Self-Written Waveguide | 32 | |||||
| Ta-Yeh Lin1, Tsenchieh Chiu2, Yin-Cheng Chang1, Da-Chiang Chang1, Mao-Hsu Yen3, Chiu-Kuo Chen4, and Ming-Shan Lin4 | Shumpei Matsuoka, Shun Akutsu, and Moritoshi Yasunaga | Amalina Athira Ibrahim1, Nurul Atiqah Baharudin1, Osamu Mikami1, Sumiaty Ambran1, Fauzan Ahmad1, Chiemi Fujikawa2, Mohd Adzir Mahdi3, and Mohd Hanif Yaacob3 | ||||||||
| (1. National Applied Research Laboratories, 2. National Central University, 3. National Taiwan Ocean University, 4. Metrology and Inspection, M.O.E.A) | (Graduate School of Systems and Information Engineering, University of Tsukuba) | (1. Universiti Teknologi Malaysia, 2. Tokai University, 3. Universiti Putra Malaysia) | ||||||||
| A Built-in Current Sensor Made of a Comparator of Offset Cancellation Type for Electrical Interconnect Tests of 3D ICs | 34 | Low temperature, low pressure, fluxless and plateless Cu-Cu bonding by Cu nano particle transient liquid phase sintering | 37 | Microcosmic mechanisms of Cu to Cu bonding by molecular dynamic simulation. | 38 | |||||
| Michiya Kanda1, Masaki Hashizume1, Hiroyuki Yotsuyanagi1, and Shyue-Kung Lu2 | Takehiro Yamamoto1, M. Khairi Faiz1, and Makoto Yoshida2 | Ying Xu Lu1, Ying-Ta Chiu1, Tang-Yuan Chen1, Meng-Kai Shih1, and Sheng-Rui Jian2 | ||||||||
| (1. Tokushima University, 2. National Taiwan Univ. of Science and Technology) | (1. Graduate School of Creative Science and Engineering, Waseda University, 2. Kagami Memorial Research Institute for Materials Science and Technology, Waseda University) | (1. Advanced Semiconductor Engineering, Inc., 2. I-Shou University) | ||||||||
| Accurate Core Alignment Technique in the Mosquito Method for realizing 3-dimensional Optical Wiring | 53 | Low-loss Light Coupling Design for Multimode Polymer Optical Waveguides with VCSEL Light Sources | 61 | A System-in-Package device which can reach 200 degC at most | 63 | |||||
| Kumi Date1,Koji Fukagata2, and Takaaki Ishigure2 | Kohei Suganuma1 and Takaaki Ishigure2 | Yunlong Fan Pu and Zhang Jingjing Cheng | ||||||||
| (1. Graduate School of Science and Technology, Keio University, 2. Faculty of Science and Technology, Keio University) | (1. Graduate School of Science and Technology, Keio University, 2. Faculty of Science and Technology, Keio University) | (Huazhong University of Science and Technology) | ||||||||
| Time evolution of strain distribution under bonding pad during ultrasonic wire-bonding at 200 degC | 65 | Low Loss Multimode Polymer Shuffling Optical Waveguide for High-Density Optical Circuit | 66 | Carbon Fiber Reinforced Platform for Automotive Electronics | 67 | |||||
| Mamoru Sakamoto, Kenichi Nakadozono, Keiichiro Iwanabe, and Tanemasa Asano | Kohei Abe1 and Takaaki Ishigure2 | Yuki Uchida, Kiyokazu Yasuda, and Yoshinori Hirata | ||||||||
| (Kyushu University, Japan) | (1. Graduate School of Science and Technology, Keio University, 2. Faculty of Science and Technology, Keio University) | (Osaka University) | ||||||||
| Hydrogen radical treatment of printed indium solder paste for bump formation | 74 | |||||||||
| Kohta Furuyama1, Eiji Higurashi1,2, and Tadatomo Suga1 | ||||||||||
| (1. The University of Tokyo, 2. National Institute of Advanced Industrial Science and Technology (AIST)) | ||||||||||
| 18:30 | Close | |||||||||
| November 22, 2017 | (Wednesday) | |||||||||
| Hall I | Hall II | Hall III | ||||||||
| 9:00 | Registration | |||||||||
| 9:10- 9:55 |
Hall I & II Chairperson Kazuyuki Nakagawa (Renesas Electronics Corporation) & Daisuke Iguchi (Fuji Xerox Co., Ltd.) |
|||||||||
| CPMT Special Talk | ||||||||||
| 9:10 | Packaging of UV Light-Emitting Diodes for Non-Lighting Applications S.W. Ricky Lee (HKUST) |
S-03 | ||||||||
| 9:55 | Early Career Researcher Session Award @Hall I & II | |||||||||
| 10:00 | Coffee Break + Sponsor's Exhibition @Conference room IV | |||||||||
| 10:25- 12:20 |
Session 13: Substrate and Interposer | Session 14: Optoelectronics 3 | Session 15: Power Electronics 2 | |||||||
| Chairperson | Chairperson | Chairperson | ||||||||
| Taiji Sakai (Fujitsu Laboratories Ltd.) | Hideyuki Nasu (Furukawa Electric Co., Ltd.) | Yoshikazu Takahashi (Tohoku University) | ||||||||
| Kei Murayama (Shinko Electric Industries Co. Ltd.) | Blanca Ruiz (Reichle & De-Massati AG) | Daisuke Iguchi (Fuji Xerox Co., Ltd.) | ||||||||
| 10:25 | (Invited) Development of Large-size CPU Package Structure Using Embedded Thin Film Capacitor Substrate | I-14 | 3-Dimensionally Crossed Polymer Optical Waveguide with GI Circular Core Using the Mosquito Method | 43 | (Invited) An Mathematical Analysis of False Turn-On Phenomenon of GaN HEMT | I-12 | ||||
| Masateru Koide | Md. Omar Faruk Rasel and Takaaki Ishigure | Masayoshi Yamamoto | ||||||||
| (Fujitsu Advanced Technologies Ltd.) | (Graduate School of Science and Technology, Keio University) | (Nagoya University) | ||||||||
| 10:50 | Improvement of Power Integrity with Sub-RDL STO Thin Film Capacitors for WLP/FO-WLP | 75 | Single-mode polymer waveguide with circular core operating at 1550 nm for high-density and high-speed optical interconnect applications | 58 | (Invited) Recent Progress of Power Semiconductor Devices and Their Futures | I-19 | ||||
| Masamitsu Yoshizawa1, Atsunori Hattori1, Hirotaka Hatano1, Younggun Han2, Osamu Horiuchi2, Yoshihisa Katoh2, and Toru Nakura3 | Xiao Xu, Lin Ma, and Zuyuan He | Noriyuki Iwamuro | ||||||||
| (1. Noda Techno Co. Ltd., 2. Fukuoka University, 3. The University of Tokyo) | (Shanghai Jiao Tong University) | (University of Tsukuba) | ||||||||
| 11:15 | Novel Ultra-fine line 2.1 D package with organic interposer | 12 | Polymer waveguide incorporated with europiumaluminum polymer composite for compact and efficient amplification devices | 68 | Low temperature and low pressure fluxless Cu-Cu bonding by Ag-based transient liquid phase sintering for high temperature application | 35 | ||||
| Wei-Chung Chen, Chiu-Wen Lee, Min-Hua Chung, Chuang-Chi Wang, Shang-Kun Huang, and Yen-Sen Liao | Yurie Yoshida1, Toshimi Fukui2, Hitomi Miki2, and Takaaki Ishigure3 | M. Khairi Faiz1, Takehiro Yamamoto1, and Makoto Yoshida2 | ||||||||
| (ASE) | (1. Graduate School of Science and Technology, Keio University, 2. Intelligence & Energy Materials Research laboratory, KRI, Inc., 3. Faculty of Science and Technology, Keio University) | (1. Graduate School of Creative Science and Engineering, Waseda University, 2. Kagami Memorial Research Institute for Materials Science and Technology, Waseda University) | ||||||||
| 11:40 | (Invited) Polymer based Photonic Integration for Sensors, Communication, and Active Optical PCB | I-03 | 3.3kV All-SiC Module for Power Distribution Apparatus | 56 | ||||||
| Martin Schell | Katsumi Taniguchi, Ryouhei Takayanagi, Satoshi Kaneko, and Naoyuki Kanai | |||||||||
| (Fraunhofer Heinrich-Hertz-Institut) | (Fuji Electric Co., Ltd.) | |||||||||
| 12:05 | Interview with the Authors (Discussion after the session) | |||||||||
| 12:20 | Lunch (free time) | |||||||||
| 13:15- 15:10 |
Session 16: Reliability | Session 17: Optoelectronics 4 | Session 18: Test & PI/SI | |||||||
| Chairperson | Chairperson | Chairperson | ||||||||
| Masahiro Aoyagi (AIST) | Takaaki Ishigure (Keio University) | Keitaro Yamagishi (Mitsubishi Electric Corporation) | ||||||||
| Hiroshi Yamada (Toshiba Corporation) | Martin Schell (Fraunhofer Heinrich-Hertz-Institut) | Kazuyuki Nakagawa (Renesas Electronics Corp.) | ||||||||
| 13:15 | Analysis of the Wire/Substrate Interface during Ultrasonic Bonding Process | 23 | (Invited) Low-loss Multi-fiber to Waveguide Connector for On-Board Applications | I-01 | Resistive Open Defects Detected by Interconnect Testing Based on Charge Volume Injected to 3D ICs | 36 | ||||
| Yangyang Longa1, Folke Denckerb2, Andreas Isaakb2, Friedrich Schneiderc3, Jörg Hermsdorfc3, Marc Wurzb2, Jens Twiefela1, and Jörg Wallascheka1 | Blanca Ruiz | Kouhei Ohtani1, Naho Osato1,Masaki Hashizume1, Hiroyuki Yotsuyanagi1, and Shyue-Kung Lu2 | ||||||||
| (1. Institute of Dynamics and Vibration Research, Leibniz Universitat Hannover, 2. Institute of Micro Production Technology, Leibniz Universitat Hannover, 3. Laser Zentrum Hannover e.V.) | (Reichle & De-Massati AG) | (1. Tokushima University, 2. National Taiwan Univ. of Science and Technology) | ||||||||
| 13:40 | Improvement of Board Level-Reliability for Fine Pitch PoP | 31 | Guided-wave leaking cavity-resonator-integrated guided-mode resonance filters for a compact WDM light source | 40 | Resonant-Plane Common-Mode Filter in Differential Lines | 42 | ||||
| GyuWan Han, JinYoung Khim, KwangSeok Oh, WoonKab Jung, DongGun Lee, and YunAh Kim | Junichi Inoue1, Atsushi Tsuji1, Nobutaka Miyauchi1, Kenji Kintaka2, Kenzo Nishio1, and Shogo Ura1 | A. Ege Engin1 and Hiroyasu Oomori2 | ||||||||
| (Amkor Technology Korea) | (1. Kyoto Institute of Technology, 2. National Institute of Advanced Industrial Science and Technology) | (1. San Diego State University, 2. Sumitomo Electric Industries) | ||||||||
| 14:05 | New, Old JEDEC Board Level Drop Reliability Test Standards Evaluation - Measurement and Simulation Study | 33 | Heterogeneous and Multi-Level Integration on Mature 25Gb/s Silicon Photonic Platform | 70 | Power Source Consideration for 56Gbps I/O Interface | 57 | ||||
| Ryan Chen, Ming-Han Wang, Sarah Lee, Janae Ho, and Ian Hu | Stéphane Malhouitre, Bertrand Szelag, Stéphane Brision, Daivid Fowler, Cécilia Dupré, and Christophe Kopp | Daisuke Ogawa, Fumiaki Fujii, Kaoru Hashimoto, Yutaka Akiyama, and Kanji Otsuka | ||||||||
| (Advanced Semiconductor Engineering Inc.) | (Univ. Grenoble Alpes, CEA-LETI, Minatec, CEA-Grenoble) | (Meisei University) | ||||||||
| 14:30 | Optically reconfigurable gate array driven by a lithium-ion battery | 71 | Analysis of Coupling Capacitance between TSV and Adjacent RDL Interconnections | 69 | ||||||
| Shinya Fujisaki and Minoru Watanabe | Zheng Mei and Gang Dong | |||||||||
| (Shizuoka University) | (Xidian University) | |||||||||
| 14:55 | Interview with the Authors (Discussion after the session) | |||||||||
| 15:10 | Close | |||||||||