| November 19, 2018 | (Monday) | ||||||
| Hall I | Hall II | Hall III | |||||
| 9:00 | Registration | ||||||
| 10:00- 11:55 |
Session 1: Advanced Package 1 | Session 2: Optoelectronics 1 | Session 3: Thermal IoT Power Electronics 1 | ||||
| Chairperson | Chairperson | Chairperson | |||||
| Eiji Higurashi (The University of Tokyo) | Takaaki Ishigure (Keio University) | Tomoyuki Hatakeyama (Toyama Prefectural Univ.) | |||||
| Masahiro Inoue (Gunma University) | Hideyuki Nasu (Furukawa Electric Co., Ltd.) | Daisuke Iguchi (Fuji Xerox Co., Ltd.) | |||||
| 10:00 | A Response Spectrum Method and Post-layout Optimization for Mechanical Shock Analysis of 3D NAND BGA Packages | 5 | (Invited) High-Speed Optical Devices for Data Center Networks | I-13 | (Invited) Phase-change thermal management solutions for advanced electronics: two-phase jet impingement technologies | I-17 | |
| Chun Sean Lau, Ning Ye, Hem Takiar | Shigehisa Tanaka | Matthew Rau | |||||
| (Western Digital) | (Ocralo Japan Incorporated) | (The Pennsylvania State University) | |||||
| 10:25 | Substrate Shrinkage Effect on Warpage Evaluation for High Bandwidth Package on Package | 17 | A 53-Gbit/s VCSEL-Based High Density Optical Assembly for Large Capacity Optical Interconnection | 6 | Development of Standalone Deep Learning Module for Right Mobile Feature | 33 | |
| Ming-Han Wang, Ian Hu, Meng-Kai Shih, David Tarng | Naohiro Kohmu, Toshiaki Takai, Norio Chujo | Kanji Otsuka, Machiko Yamamoto, Yoichi Sato | |||||
| (ASE Group) | (Hitachi, Ltd) | (Meisei University) | |||||
| 10:50 | The Advantages of Coupling Experimental Methods and Analytical Modelling to Fix Deformation Problems in Devices' Conception and Manufacturing | 8 | An Analysis of the Thermal Efficiency of Different Heat Sinking Solutions by High Accuracy Measurements of the Laser Die Temperature of a High Density Optical Engine | 58 | Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding | 9 | |
| Lionel VIGNOUD, Christine MORIN, Nicolas ASSIGBE, Guillaume PARRY, Rafael ESTEVEZ | Kevin Burt, Jimmy Grayson | Collin Dymel1, Reinhard Schemmel1, Tobias Hemsel1, Michael Brökelmann2, Matthias Hunstig2, and Walter Sextro1 | |||||
| (Univ. Grenoble Alpes, CEA, LETI) | (Samtec, Inc) | (1. Chair for Dynamics and Mechatronics, Paderborn University, 2. Hesse GmbH) | |||||
| 11:15 | Electromigration Lifetime Improvement of WLCSP by Using Different Structure of UBM | 13 | (Invited) 400G Multi-Mode and Single-Mode Optical Transmitter Realized by Hybrid-Integrated Silicon Interposer for Data Center Application | I-07 | |||
| Yung-Sheng Lin, H.-Y. Kung, S.-H. Lee, M.-H. Chen, T.-C. Lin | Hsiao-Chin Lan, Chin-Ta Chen, Po-Kuan Shen, Hsin-Chieh Wu, Yu-Chun Wang, Chien-Chen Hsieh | ||||||
| (ASE Group) | (Centera Photonics Incorporated) | ||||||
| 11:40 | Interview with the Authors (Discussion after the session)+ Sponsor's Exhibition @Room 3 | ||||||
| 11:55 | Lunch (free time) | ||||||
| 12:50- 14:30 |
Session 4: Advanced Package 2 | Session 5: Optoelectronics 2 | Session 6: Bioelectronics | ||||
| Chairperson | Chairperson | Chairperson | |||||
| Taiji Sakai (Fujitsu Laboratories Ltd.) | Shigehisa Tanaka (Ocralo Japan Incorporated) | Yoshio Nogami (Toray Engineering Co. Ltd.) | |||||
| Kei Murayama (Shinko Electric Industries Co. Ltd.) | Hsiao-Chin Lan (Centera Photonics Incorporated) | Beomjoon KIM (The University of Tokyo) | |||||
| 12:50 | (Invited) Improvement of Joint Reliability for 3D and Power IC Packaging by Nanomechanical Property Optimization of Intermetallic Compounds | I-05 | Enhanced Silicon photonics platform: toward low energy consumption of optical transceiver for datacentre communications | 34 | (Invited) Development of "smart cell" construction platform for next-generation microbial breeding | I-09 | |
| Jenn-Ming Song | Quentin Wilmart, Corrado Sciancalepore, Daivid Fowler, Hussein El Dirani, Karim Hassan, Stéphanie Garcia, Stéphane Malhouitre, Ségolène Olivier | Tomohisa Hasunuma | |||||
| (National Chung Hsing University) | (University Grenoble Alpes, CEA, LETI) | (Kobe University) | |||||
| 13:15 | A Study of Adhesion Interface about Die Bonding Structure with Conductive Silver Paste | 35 | SiN Integrated Photonics for near-infrared LIDAR | 51 | Technical Challenges of Active Implantable Medical Devices for Neurotechnology | 21 | |
| Naoaki Tsurumi, Taiki Baba, Hiroyuki Murata, Yuta Tsuji, Noriyuki Masago, Kazunari Yoshizawa | Nicola Tyler, Daivid Fowler, Stephane Malhouitre, Stephane Brision, Olivier Lemonnier, Wilfried Rabaud, Bertrand Szelag | Jorge M. Herrera-Morales, Claude Clément | |||||
| (ROHM Co., Ltd., Institute for Materials Chemistry and Engineering, Kyushu University) | (University Grenoble Alpes, CEA, LETI) | (Wyss Center for Bio and Neuroengineering) | |||||
| 13:40 | Analysis of Molecular Heterogeneity and Interfacial Chemical Interactions in Electrically Conductive Adhesives using Time-domain NMR Spectroscopy | 52 | Wavelength matching of resonance reflection and guided-wave launching for high-performance CRIGF | 38 | Fabrication of porous biodegradable microneedles for glucose monitoring sensor | 30 | |
| Masahiro Inoue, Tomohito Negishi | Toshiki Kusuura1), Atsushi Tsuji1), Junichi Inoue1), Naoto Takishita1), Kenji Kintaka2), Kenzo Nishio1), Shogo Ura1) | Yasuhisa Morishita, Kai Takeuchi, Nobuyuki Takama, Beomjoon Kim | |||||
| (Gunma University) | (1) Kyoto Insititute of Technology, 2) National Institute of Advanced Industrial Science and Technology) | (The University of Tokyo) | |||||
| 14:05 | Connection structure using rubber connectors in the IoT edge platform, Trillion Node Engine. | 20 | Graded-Index Polymer Optical Waveguide for Restricted Mode Launch Device Enabling High-Bandwidth, Longer-Reach Multimode Fiber Link | 40 | A Porous Microneedle Array Connected to Microfluidic System for ISF Collection | 47 | |
| Kenichi Agawa, Tokihiko Mori, Ryoji Ninomiya, Minoru Takizawa, Takayasu Sakurai | Ryosuke Hatai1), Takaaki Ishigure2) | Kai Takeuchi1), Nobuyuki Takama1), Beomjoon Kim1), Kirti Sharma2), Patrick Ruther2), Oliver Paul2) | |||||
| (Toshiba Electronic Devices & Storage, The University of Tokyo) | (1) Graduate School of Science and Technology, Keio University), 2) Faculty of Science and Technology, Keio University) | (1) The University of Tokyo, 2) University of Freiburg) | |||||
| 14:30 | Interview with the Authors (Discussion after the session)+ Sponsor's Exhibition @Room 3 |
Gold Sponsor's Seminar @Hall III "ANSYS SDPD Chip Package System For PCB Design" Akira Ohta (ANSYS) |
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| 14:45 | Coffee break + Sponsor's Exhibition @Room 3 | ||||||
| 15:00- 16:10 |
Hall I & II Chairperson Takaaki Ishigure (Keio University) & Hideyuki Nasu (Furukawa Electric Co., Ltd.) |
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| Opening & Plenary Speech I | |||||||
| 15:00 | Opening Remarks & Welcome Talk Kiyokazu Yasuda (General Chair, IEEE CPMT Symposium Japan; Osaka University) |
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| 15:15 | Plenary Speech I:Short Reach Optical
Technologies to enable progress towards Self-Awareness Daniel Kuchta (IBM T. J. Watson Research Center) |
P-01 | |||||
| 16:10- 17:05 |
Hall I & II Chairperson Hideyuki Nasu (Furukawa Electric Co., Ltd.) & Takaaki Ishigure (Keio University) |
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| Plenary Speech II | |||||||
| 16:10 | Plenary Speech II:Opportunities for Si
Photonics in Next-Generation Data Centers Clint Schow (University of California, Santa Barbara) |
P-02 | |||||
| 18:00 | Welcome Reception | ||||||
| 20:00 | Close | ||||||
| November 20, 2018 | (Tuesday) | ||||||
| Hall I | Hall II | Hall III | |||||
| 9:00 | Registration | ||||||
| 9:15- 10:00 |
Hall I & II Chairperson Daisuke Iguchi (Fuji Xerox Co., Ltd.) |
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| Singularity Special Speech | |||||||
| 9:15 | Impact of Computing Reimagined on Electronics
Packaging Shintaro Yamamichi (IBM Research - Tokyo) |
S-01 | |||||
| 10:00- 10:45 |
Hall I & II Chairperson Shoji Uegaki (ASE Group) & Taiji Sakai (Fujitsu Laboratories, Ltd.) |
||||||
| Advanced PKG Special Speech | |||||||
| 10:00 | New Heterogeneous Integrated SiP Technology
& Challenges CP Hung (ASE Inc.) |
S-04 | |||||
| 10:45 | Coffee break + Sponsor's Exhibition @Room 3 | ||||||
| 11:00- 11:55 |
Hall I & II Chairperson Yutaka Uematsu (Hitachi, Ltd.) & Kazuyuki Nakagawa (Renesas Electronics Corporation) |
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| Plenary Speech III | |||||||
| 11:00 | Plenary Speech III: Evolution of the GPU Device
leading the AI and Parallel Processing Computing Toru Baji (NVIDIA) |
P-03 | |||||
| 11:55- 12:50 |
Hall I & II Chairperson Yutaka Uematsu (Hitachi, Ltd.) & Mitsuaki Katagiri (Micron Memory Japan, Inc.) |
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| Plenary Speech IV | |||||||
| 11:55 | Plenary Speech IV: New Packaging Alternatives
via high bandwidth and low power USR SerDes Amin Shokrollahi (Kandou BUS) |
P-04 | |||||
| 12:50 | Lunch (free time) | ||||||
| 13:50- 15:05 |
Session 7: Advanced Package 3 | Session 8: Power Electronics 2 | |||||
| Chairperson | Chairperson | ||||||
| Masahiro Aoyagi (AIST) | Yoshikazu Takahashi (Tohoku University) | ||||||
| Kazuyuki Mitsukura (Hitachi Chemical Co. Ltd.) | Kentaro Kaneko (Kyoto University) | ||||||
| 13:50 | (Invited) Low power AI hardware platform for deep learning in edge computing. | I-16 | (Invited) Estimation of residual common mode voltage in floating voltage measurement with differential voltage probe for high voltage power electroincs circuit | I-10 | |||
| Eisaku Ohbuchi | Tsuyoshi Funaki, Kei Hayashi | ||||||
| (Digital Media Professionals Inc.) | (Osaka University) | ||||||
| 14:15 | (Invited) Power Consumption Issue at Data Center in the era of AI/IoT | I-01 | (Invited) Development of Corundum-Structured Gallium Oxide Power Devices by MIST EPITAXY(R) | I-11 | |||
| Yasumitsu Orii | Takashi Shinohe | ||||||
| (Nagase Group) | (FLOSFIA Inc.) | ||||||
| 14:40 | (Invited) New concept 3D FOWLP Proposal | I-14 | Study on corundum-structured p-type iridium oxide thin films and band alignment at iridium oxide /gallium oxide hetero-junction | 61 | |||
| Shuzo Akejima | Shin-ichi Kan1), Shu Takemoto1), Kentaro Kaneko2), Takashi Shinohe3), and Shizuo Fujita2) | ||||||
| (Rising Technologies Co.,Ltd.) | (1) Department of Electronic Science and Engineering, Kyoto Univ., 2) Photonics and Electronics Science and Engineering Center, Kyoto Univ., 3) FLOSFIA INC.) | ||||||
| 15:05 | Interview with the Authors (Discussion after the session)+ Sponsor's Exhibition @Room 3 | ||||||
| 15:20- 16:35 |
Session 9: Advanced Package 4 | Session 10: SI/PI/RF & Test 1 | |||||
| Chairperson | Chairperson | ||||||
| Toshihisa Nonaka (Hitachi Chemical Co. Ltd.) | Kazuyuki Nakagawa (Renesas Electronics Corp.) | ||||||
| Masao Tomikawa (Toray Industries Inc.) | Masahiro Aoyagi (AIST) | ||||||
| 15:20 | (Invited) Development of novel fine line 2.1 D package with organic interposer using advanced substrate-based process | I-03 | Micro-Cables out of High-Speed Communication Chip through Embedded Wires in the Package Substrate | 25 | |||
| Wei-Chung Chen | Boping Wu | ||||||
| (ASE Inc.) | (Huawei Technologies) | ||||||
| 15:45 | (Invited) 2.5D Like High Density Organic Interposer for Heterogeneous Integration | I-15 | A 77GHz Antenna-in-Package with Low-Cost Solution for mmWave System Integration | 19 | |||
| Kiyoshi Oi | Cheng Yu Ho | ||||||
| (Shinko Electric Industries Co., Ltd.) | (ASE Inc.) | ||||||
| 16:10 | Glass Multilayer Package Substrate using Conductive Paste Via Connection | 48 | Beyond Norm Package Interconnects Crosstalk Radiation Analysis and Optimization | 2 | |||
| Toshiki Iwai, Taiji Sakai, Daisuke Mizutani, Seiki Sakuyama, Kenji Iida, Takayuki Inaba, Hidehiko Fujisaki, Yoshinori Miyazawa | Chin Pheing Wong | ||||||
| (Fujitsu Laboratories Ltd., Fujitsu Interconnect Technologies Ltd.) | (Cypress Semiconductor, Malaysia) | ||||||
| 16:35 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition @Room 3 | ||||||
| 16:50 | Break | ||||||
| 17:00- 18:30 |
Early Career Researcher's (ECR) Session (Open Forum with Beer) @Hall III |
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| A 60 GHz High-Gain Circularly Polarized Dielectric Resonator Antenna Array Using Bondwire Feeding Structure | 14 | Low propagation loss of a single mode polymer optical waveguide on a glass epoxy substrate | 22 | Resistive Open Defect Detection in SoCs by a Test Method Based on Injected Charge Volume after Test Input Application | 23 | ||
| Ta-Yeh Lin, Yin-Cheng Chang, Chaoping Hsieh, Da-Chiang Chang, Tsenchieh Chiu | Dai Hashimoto, Akihiro Noriki, Takeru Amano, Yoshinobu Okano | Yuta Matsumoto, Masaki Hashizume, Hiroyuki Yotsuyanagi, Shyue-Kung Lu | |||||
| (National Central University) | (Tokyo City University) | (National Taiwan Univ. of Science and Technology) | |||||
| Application of the Mosquito Method for Implementing Waveguides on Surface Emitting Light Sources | 41 | Modeling of Stomatitis in Rats and novel Treatment using microneedles-based patch | 43 | 3-Dimensional Channel-Shuffling Single-mode Polymer Waveguides: Design and Fabrication | 44 | ||
| Jun Nakamura, Takaaki Ishigure | Kaifeng Luo, Yutaka Maruoka, Rie Kinoshita, Teru Okitsu, Libo Wu, Nobuyuki Takama, Beomjoon Kim | Omar Faruk Rasel, Takaaki Ishigure | |||||
| (Keio University) | (The University of Tokyo) | (Keio University) | |||||
| Fabrication for Organic-Inorganic Hybrid Resin based Single-mode Polymer Optical Waveguides Using the Imprinting Method for High Density Optical Circuit | 45 | Ultrasonic joining of carbon fiber reinforced thermoplastic and Ti alloy | 46 | Low-loss Single-mode Polymer Optical Waveguides: comparison between direct-curing and the Mosquito methods | 50 | ||
| Yuto Fujihara, Takaaki Ishigure | Rennosuke Tamura, Kiyokazu Yasuda, Satoru Asai | Yoshie Morimoto, Makoto Hikita, Hitomi Matsui, Yuto Fujihara, Takaaki Ishigure | |||||
| (Keio University) | (Osaka University) | (Keio University) | |||||
| Surface analysis of argon and oxygen plasma-treated gold for room temperature wafer scale gold-gold bonding | 53 | Variations in Electrical Conductivity of Phenolic-based Adhesives Containing Copper Particles Treated with a Carboxylic Acid during Environmental Test | 57 | Silicide based integration approach for fabricating highly reliable, hermitically sealed on-chip, low form factor-microfluidics for 3D IC cooling applications | 60 | ||
| Michitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Tadatomo Suga, Toshihiro Itoh, Eiji Higurashi | Kenta Kawarai, Masahiro Inoue | Hemanth Kumar Cheemalamarri, Satish Bonam, Siva Rama Krishna Vanjari, Shiv Govind Singh | |||||
| (The University of Tokyo, AIST) | (Gunma University) | (Indian Institute of Technology Hyderabad) | |||||
| Wearable Hand Motion Capture Device | 63 | ||||||
| Hirotoshi Kosawa, Satoshi Konishi | |||||||
| (Ritsumeikan University) | |||||||
| 19:00- 21:00 |
Committee Reception | ||||||
| November 21, 2018 | (Wednesday) | ||||||
| Hall I | Hall II | Hall III | |||||
| 9:00 | Registration | ||||||
| 9:15- 10:45 |
Hall I & II Chairperson Shinya Takyu (Lintec Corporation) & Kazuyuki Nakagawa (Renesas Electronics Corporation) |
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| EPS Special Speech | |||||||
| 9:15 | EPS Special Talk I:3D-Printing for Electronics
Packaging – Current Status and Future Challenges Chris Bailey (University of Greenwich) |
S-02 | |||||
| 10:00 | EPS Special Talk II:Networking: The backbone of
IoT, Edge Computing and Artificial Intelligence Mudasir Ahmad (Cisco Systems) |
S-03 | |||||
| 10:45 | Early Career Researcher Session Award @Hall I & II | ||||||
| 10:55 | Coffee Break + Sponsor's Exhibition @Room 3 | ||||||
| 11:20- 12:35 |
Session 11: Advanced Package 5 | Session 12: Optoelectronics 3 | Session 13: Material | ||||
| Chairperson | Chairperson | Chairperson | |||||
| Tomonori Minegishi (Hitachi Chemical Co. Ltd.) | Gunnar Böttger (Fraunhofer-IZM) | Osamu Suzuki (Namics Corporation) | |||||
| Kenji Takahashi (AIST) | Takeru Amano (AIST) | Yoichiro Sato (AGC Inc.) | |||||
| 11:20 | (Invited) Comparative Study on Mechanical and Thermal Performance of eWLB, M-SeriesTM and Fan-Out Chip Last Packages | I-04 | (Invited) Ultra-broadband hybrid polymer/sol-gel waveguide modulators | I-12 | (Invited) Material and Process to Enhance High Density Circuitry of the Package | I-02 | |
| Meng-kai Shih | Yasufumi Enami | Kazuyuki Mitsukura | |||||
| (ASE Inc.) | (Kochi University of Technology) | (Hitachi Chemical Co., Ltd.) | |||||
| 11:45 | (Invited) Made to Order Half-Inch Packaging Technology Using Minimal Fab Process Tools | I-19 | Fabrication for Y-branched multimode polymer optical waveguides using the Mosquito method | 16 | Quantitative Investigation of Pick-up Performance for UV-curable Dicing Tape | 29 | |
| Fumito Imura, Michihiro Inoue, Sommawan Khumpuang, Shiro Hara | Tomoki Nakayama1), Takaaki Ishigure2) | Takafumi Ogasawara, Naoya Saiki, Shinya Takyu | |||||
| (National Institute of Advanced Industrial Science and Technology (AIST)) | (1) Graduate School of Science and Technology, Keio University), 2) Faculty of Science and Technology, Keio University) | (Lintec Corporation) | |||||
| 12:10 | A Concept of A Large Scale Multi-Chip Module in which High Speed Data Transmission among the chips is done by T-Hz Radio Communication | 49 | Direct Fabrication for Multimode / Single-mode Polymer Optical Waveguides on Printed Circuit Board using the Mosquito Method | 42 | Low Dispersion Loss Polyimides for High Frequency Applications | 59 | |
| Katsuhiko Ohsaki | Chinami Marushima1), Takaaki Ishigure2) | Masao Tomikawa, Yohei Kiuchi, Hitoshi Araki, and Akira Shimda | |||||
| (Zayit Science LLC) | (1) Graduate School of Science and Technology, Keio University), 2) Faculty of Science and Technology, Keio University) | (Electronic & Imaging Materials Research Labs., Toray Industries Inc.) | |||||
| 12:35 | Interview with the Authors (Discussion after the session)+ Sponsor's Exhibition @Room 3 | ||||||
| 12:50 | Lunch (free time) | ||||||
| 13:45- 15:25 |
Session 14: Advanced Package 6 | Session 15: Optoelectronics 4 | Session 16: SI/PI/RF & Test 2 | ||||
| Chairperson | Chairperson | Chairperson | |||||
| Shinya Takyu (Lintec Corporation) | Yasufumi Enami (Kochi University of Technology) | Kazuyuki Nakagawa (Renesas Electronics Corp.) | |||||
| Hiroshi Yamada (Toshiba Corporation) | Hideyuki Nasu (Furukawa Electric Co., Ltd.) | Kenji Takahashi (AIST) | |||||
| 13:45 | (Advanced PKG Special Speech) Implementation of Chip Level Micro-bumping and Re-distribution by Additive Manufacturing | S-05 | (Invited) Thin glass based photonic and electronic assemblies | I-08 | Stand-by Mode Test Method of Interconnects between Dies in 3D ICs with IEEE 1149.1 Test Circuits | 24 | |
| S.W. Ricky Lee | Gunnar Böttger | Michiya Kanda, Masaki Hashizume, Hiroyuki Yotsuyanagi, Shyue-Kung Lu | |||||
| (HKUST) | (Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration (IZM)) | (Tokushima University) | |||||
| 14:10 | (Advanced PKG Special Speech) (continued) Implementation of Chip Level Micro-bumping and Re-distribution by Additive Manufacturing | S-05 | Fabrication and Evaluation for Polymer Waveguide Coupler Devices Using the Imprint Method | 39 | Design of 9:4 Step-Down Impedance Transformation Ruthroff Balun with Center-tap in GIPD Technology | 62 | |
| S.W. Ricky Lee | Fukino Nakazaki1), Takaaki Ishigure2) | Hwann-Kaeo Chiou, Hua-Yen Chung | |||||
| (HKUST) | (1) Graduate School of Science and Technology, Keio University), 2) Faculty of Science and Technology, Keio University) | (National Central University) | |||||
| 14:35 | (Invited) 2.4 GHz Slot Antenna Integrated in Small Shielded Module | I-18 | High density optical card edge connector for polymer optical waveguide on printed circuit board | 18 | Internet of Things for locating ground loop in a complex situation | 3 | |
| Keiju Yamada | Takeru Amano, Akihiro Noriki, Masahiko Mori | MD Saifur Rahman, Young-Pil Kim, Sikung Kim | |||||
| (Toshiba Corporation) | (The National Institute of Advanced Industrial Science and Technology (AIST), Photonics Electronics Technology Research Association (PETRA)) | (Kongju National University) | |||||
| 15:00 | An optically reconfigurable gate array using four liquid crystal spatial light modulators | 15 | Wideband vertically-interdigital-capacitor | 28 | |||
| Yusuke Takaki, Minoru Watanabe | Bo Zhou, Lingxuan Huang, Qipeng Chen, Xuan Ni, Xiuxian Li, Ninglin Wang, Zhikuang Cai | ||||||
| (Shizuoka University) | (Nanjing University of Posts and Telecommunications) | ||||||
| 15:25 | Interview with the Authors (Discussion after the session)+ Sponsor's Exhibition @Room 3 | ||||||
| 15:40 | Close | ||||||