Advance Program of ICSJ2019
| November 18, 2019 | (Monday) | |||||||
| Hall I | Hall II | Hall III | Room 3 | |||||
| 9:00 | Registration | |||||||
| 10:00-11:10 | Hall I & II Chairperson Takaaki Ishigure (Keio University) and Hideyuki Nasu (Furukawa Electric Co., Ltd.) |
Sponsor's Exhibition | ||||||
| Opening & Plenary Speech I | ||||||||
| 10:00 | Opening Remarks & Welcome Talk Takaaki Ishigure (General Chair, IEEE CPMT Symposium Japan; Keio University) |
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| 10:15 | Plenary Speech I: Photonic Integrated Circuits
from Research to Manufacturing Peter O'Brien (Tyndall National Institute) |
P-03 | ||||||
| 11:10-12:05 | Hall I & II Chairperson Takaaki Ishigure (Keio University) and Hideyuki Nasu (Furukawa Electric Co., Ltd.) |
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| Plenary Speech II | ||||||||
| 11:10 | Plenary Speech II: Integrated Photonics for
2020 and beyond Ray T. Chen (The University of Texas at Austin) |
P-04 | ||||||
| 12:05 | Lunch break (on your own) | |||||||
| 13:00-14:40 | Session 1: New Material and Process | Session 2: Photonics 1 | Sponsor's Exhibition | Session 3: Bioelectronics · Healthcare & Beauty 1 | ||||
| Chairperson | Chairperson | Chairperson | ||||||
| Tomonori Minegishi (Hitachi Chemical Co., Ltd.) | Shigenori Aoki (LINTEC Corporation) | Naoe Hosoda (NIMS) | ||||||
| Masahiro Aoyagi (AIST) | Lars Brusberg (Corning Research & Development Corporation) | Noboru Asahi (Toray Industries Europe GmbH / Toray Automotive Center Europe) | ||||||
| 13:00 | (Invited) Thermally Stable and Transparent Polyketone Resin | I-12 | (Invited) Market & Industrial Trends of Optical Interconnect | I-06 | Fabrication of Whole-Dissolvable Microneedles Patch in Large Area for Transdermal Drug Delivery | 20 | ||
| Hiroshi Matsutani, Nanako Arima, Youhei Ishikawa, Masahiro Matsunaga, Yutaka Okada | Bernard HL Lee | Leilei BAO, Nobuyuki TAKAMA, Beomjoon KIM | ||||||
| (Hitachi Chemical Co., Ltd.) | (SENKO Advanced Components (HK) Ltd) | (The University of Tokyo) | ||||||
| 13:25 | Characterization of Thick Tin Deposits by Autocatalytic Reaction and Electrochemical Investigations of Autocatalytic Tin Electrolytes and Their Reaction Mechanisms | 5 | A Platform Approach Towards Hybrid Photonic Integration and Assembly for Communications, Sensing, and Quantum Technologies Based on a Polymer Waveguide Technology | 26 | Porous Microneedle Integrated in Paper Based Glucose Sensor for Fluid Channel Interface | 27 | ||
| Britta Schafsteller, Sandra Nelle, Gustavo Ramos, Tuna Kadir | Moritz Kleinert, Madeleine Nuck, Hauke Conradi, David de Felipe, Martin Kresse, Walter Brinker, Crispin Zawadzki, Norbert Keil | Hakjae Lee, Kai Takeuchi, Yui Sasaki, Nobuyuki Takama, Tsuyoshi Minami, Beomjoon Kim | ||||||
| (Atotech Deutschland GmbH) | (Fraunhofer Heinrich Hertz Institute) | (The University of Tokyo) | ||||||
| 13:50 | Reduction and Surface Treatment for Oxidized Copper Electrodes by Water Vapor Plasma | 3 | (Invited) Trends in Enhanced Integrated Photonics for Hyperscale Data Centre and 5G Environments | I-01 | Cuffless Blood Pressure Estimation Using Photoplethysmogram Waveform Obtained from Different Light Color | 30 | ||
| Hirokazu Terai, Taichi Hashimoto, Hirohiko Nakano, Osamu Tsuji | Richard Pitwon | Miki Nakagawa1, Ryoma Ebisuya1, Kaname Hanada2, Hiroki Ishikawa2, Keisaku Fujimoto3, Arata Suzuki1 | ||||||
| (Samco Inc.) | (Resolute Photonics Ltd.) | (1. Wakayama University, 2. Murata Manufacturing Co., Ltd., 3. Shinshu University) | ||||||
| 14:15 | Release Sheet Integrated Backside Coating Tape Corresponding to Stealth Dicing | 46 | A 53-Gbit/s/ch Active Optical Cable Utilizing GI Polymer Waveguide for High-density On-board Optical Interconnects | 31 | ||||
| Daisuke Yamamoto, Naoya Saiki, Shinya Takyu | Naohiro Kohmu1, Maho Ishii2, Takaaki Ishigure2 | |||||||
| (LINTEC Corporation) | (1. Hitachi, Ltd., 2. Keio University) | |||||||
| 14:40 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition @Hall III | |||||||
| 14:55 | Coffee break + Sponsor's Exhibition @Hall III | |||||||
| 15:10-16:50 | Session 4: Advanced Package 1 | Session 5: Photonics 2 | Sponsor's Exhibition | Session 6: Thermal | ||||
| Chairperson | Chairperson | Chairperson | ||||||
| Hiroshi Yamada (Toshiba Corporation) | Junichi Inoue (Kyoto Institute of Technology) | Tomoyuki Hatakeyama (Toyama Prefectural University) | ||||||
| Eiji Higurashi (AIST) | Richard Pitwon (Resolute Photonics Ltd.) | Kishio Yokouchi (JIS, Kanto Gakuin University) | ||||||
| 15:10 | (Invited) "Photo Mold" the Innovation of Packaging | I-11 | (Invited) Hybrid Photonic Integration and 3D Nano-Printing: Combining Silicon Photonics with Organic Materials | I-07 | (Invited) Temporal and Spatial Modification of Thermal Radiation | I-04 | ||
| Shuzo Akejima | Christian Koos | Chih-Ming Wang1, Tzu-Ting Huang2, Wei-Yi Tsai2, Din Ping Tsai2 | ||||||
| (Rising Technologies Co., Ltd.) | (Karlsruhe Institute of Technology) | (1. National Dong Hwa University, 2. Research Center for Applied Sciences) | ||||||
| 15:35 | Assessment of NiPdAuAg Leadframe Rough for Delamination Stable in Electronic Packaging for Automotive | 1 | Fiber Array Unit with Reduced Clad Fibers for High-Density Fiber-Chip Coupling | 19 | (Invited) Vehicle Thermal Management Using Heat Pipes | I-13 | ||
| Suhaimi Azizan1, Ghazali Omar2 | Scott Bickham1, Wen-Lung Kuang2, Ximao Feng2 | Randeep Singh | ||||||
| (1. Corporate R&D ON Semiconductor Malaysia, 2. Universiti Teknikal Malaysia Melaka) | (1. Corning Optical Fiber, 2. Corning Optical Connectivity Solutions) | (Fujikura Ltd.) | ||||||
| 16:00 | Dual Side Molding SiP Drop Reliability Analysis | 43 | Applicability of the Mosquito Method to Fabricate Fan-In/Out Device for Single-Mode Multicore Fiber | 33 | Stimulus-Response Analysis of Interconnected System | 14 | ||
| Wei-Hong LAI | Hitomi Matsui, Sho Yakabe, Takaaki Ishigure | (Cheong Chiang Ng1, Torsten Hauck2) | ||||||
| (Advanced Semiconductor Engineering, Inc.) | (Keio University) | (1. NXP Semiconductors Malaysia, 2. NXP Semiconductors Germany) | ||||||
| 16:25 | (Invited) Single-Mode Glass Waveguide Substrate for PIC Packaging | I-02 | (Invited) Liquid Cooling, opportunity & challenges toward effective and efficient scalabilities | I-18 | ||||
| Lars Brusberg | Jie Wei | |||||||
| (Corning Research & Development Corporation) | (Fujitsu Advanced Technologies Limited) | |||||||
| 16:50- 17:05 |
Interview with the Authors (Discussion after the session) + Sponsor's Exhibition @Hall III | |||||||
| 18:00 | Welcome Reception | |||||||
| 20:00 | Close | |||||||
| November 19, 2019 | (Tuesday) | |||||||
| Hall I | Hall II | Hall III | Room 3 | |||||
| 9:00 | Registration | |||||||
| 9:15-10:10 | Hall
I & II Chairperson Kentaro Kaneko (Kyoto University) and Kiyokazu Yasuda (Osaka University) |
Sponsor's Exhibition | ||||||
| Plenary Speech III | ||||||||
| 9:15 | Novel crystalline and amorphous
semiconductors Hideo Hosono (Tokyo Institute of Technology) |
P-01 | ||||||
| 10:10-11:05 | Hall
I & II Chairperson Beomjoon Kim (The University of Tokyo) and Tomoyuki Hatakeyama (Toyama Prefectural University) |
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| Plenary Speech IV | ||||||||
| 10:10 | 2D-materials spread heat at nanoscales Sebastian Volz (LIMMS/CNRS-IIS, The University of Tokyo) |
P-02 | ||||||
| 11:05 | Coffee break + Sponsor's Exhibition @Hall III | |||||||
| 11:20-12:05 | Hall
I & II Chairperson Hidetoshi Numata (IBM Research - Tokyo) and Takaaki Ishigure (Keio University) |
Sponsor's Exhibition | ||||||
| AI Special Speech I | ||||||||
| 11:20 | Photonic and memristive technologies on silicon
for analog synaptic processing in neuromorphic computing Bert Jan Offrein (IBM Research - Zurich) |
S-04 | ||||||
| 12:05 | Lunch break + Sponsor's seminar (with light meal and beverages) | |||||||
| 13:00-13:45 | Hall
I & II Chairperson Yutaka Uematsu (Hitachi, Ltd.) and Mitsuaki Katagiri (Micron Memory Japan, Inc.) |
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| AI Special Speech II | ||||||||
| 13:00 | Ultra-Low Power Brain-Inspired Processors and
Neuromorphic Processors with CMOS/MTJ Hybrid technology for Edge AI
Systems Tetsuo Endoh (Tohoku University) |
S-03 | ||||||
| 13:45-14:30 | Hall
I & II Chairperson Yutaka Uematsu (Hitachi, Ltd.) and Yasuhiro Ikeda (Hitachi, Ltd.) |
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| AI Special Speech III | ||||||||
| 13:45 | On-Device Learning and Its Applications: Toward
Learning AI Chips Hiroki Matsutani (Keio University) |
S-05 | ||||||
| 14:30 | Coffee break + Sponsor's Exhibition @Hall III | |||||||
| 14:55-16:35 | Session 7: Advanced Package 2 | Session 8: Automotive | Sponsor's Exhibition | Session 9: Bioelectronics · Healthcare & Beauty 2 | ||||
| Chairperson | Chairperson | Chairperson | ||||||
| Toshihisa Nonaka (Hitachi Chemical Co., Ltd.) | Yutaka Uematsu (Hitachi, Ltd.) | Kiyokazu Yasuda (Osaka University) | ||||||
| Shoji Uegaki (E-ThermoGentek Co., Ltd.) | Daisuke Iguchi (Fuji Xerox Co., Ltd.) | Yoshio Nogami (Toray Engineering Co., Ltd.) | ||||||
| 14:55 | (Invited) Panel Level Packaging - From Idea to Industrialization - | I-05 | (Invited) High Efficiency MIMD-Based Vector Processor for Automotive AI Applications | I-14 | (Invited) Development of Tangible Controller for Ikebana Training System | I-19 | ||
| Tanja Braun1, K.-F. Becker1, O. Hoelck1, S. Voges1, L. Boettcher1, M. Töpper1, L. Stobbe1, R. Aschenbrenner1, M. Voitel2, M. Schneider-Ramelow2, K.-D. Lang2 | Teppei Hirotsu | Anna Yokokubo1, Yuji Kato2, Itiro Siio3 | ||||||
| (1. Fraunhofer IZM, 2. Technical University Berlin) | (NSITEXE, Inc.) | (1.
Ochanomizu University/Aoyama Gakuin University, 2. Independent, 3. Graduate
School of Humanities and Sciences Ochanomizu University) |
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| 15:20 | Neural Network Assisted Speed up of High Fidelity Warpage Simulations Towards Design for Reliability in Ultra-Thin Packages | 37 | (Invited) Inductors for modern Power over Signal applications in automotive | I-16 | Conformable Electronics: Integration of Electronic Functions into Static and Dynamic Free Form Surfaces | 50 | ||
| Cheryl Selvanayagam, Duong Pham Luu Trung, Nagarajan Raghavan | Felipe Jerez | Thomas Loeher, Manuel Seckel, Julian Haberland, Joao Marques, Malte von Krshiwoblozki, Christine Kallmayer, Andreas Ostmann | ||||||
| (Singapore University of Technology and Design) | (TDK Electronics AG) | (Fraunhofer IZM and TU Berlin) | ||||||
| 15:45 | High-Resolution Structural Analysis of Multilayer Package Substrate with Open-Source Parallel FE Software FrontISTR | 52 | (Invited) Physical Layer Simulation Technology for Automotive Ethernet | I-10 | Fabrication for Polymer Microchannels with Circular Cross-Section Using Photo-Curable PDMS | 32 | ||
| Shinji Nakazawa1, Naoki Iwasaki1, Ryuichi Matsuki1, Kazuya Goto2, Gaku Hashimoto3, Hiroshi Okuda3 | Takehiro Kawauchi1, Akihito Iwata1, Hirofumi Urayama1, Tatsuya Izumi1, Koichi Takayama1, Takeshi Hagihara2 | Ryota Nakazawa, Takaaki Ishigure | ||||||
| (1. SHINKO Electric Industries Co., Ltd., 2. PExProCS, LLC., 3. The University of Tokyo) | (1. Sumitomo Electric Industries, LTD., 2. AutoNetworks Technologies, LTD.) | (Keio University) | ||||||
| 16:10 | X-ray Inspection Methodology on QFN and BGA | 2 | (Invited) Automotive Ethernet System level Signal Integrity Test | I-17 | Biodegradable microneedles - trapezoidal micropatterned patch in the LED therapy | 21 | ||
| Jui Ang Tan, Chong Seng Foo | Darshan Mehta | Xiaobin Wu, Junichiro Kono, Nobuyuki Takama, Beomjoon Kim | ||||||
| (Intel Product (M) Sdn. Bhd.) | (Tektronix, Inc.) | (The University of Tokyo) | ||||||
| 16:35 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition @Hall III | |||||||
| 16:50 | Coffee break + Sponsor's Exhibition @Hall III | |||||||
| 17:00-18:30 | Early Career Researcher's (ECR) Session (Open Forum with Beer) @Hall III |
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| Study on the Reduction of Computational Complexity and Sound Analysis of the Modified Gabor Wavelet | 4 | Compact 77 GHz 4x4 Patch Array Design Using Backside Metal Grounded GaAs-based IPD Technology | 8 | Millimeter-Wave TRL Calibration Technique with the Demonstration of an IPD Antenna | 9 | Discrete 1Ω Probe by Using Flip-Chip IPD Resistor and Amplifier for Inspecting EMI of a Packaged IC | 10 | |
| Miyori Shirasuna, Yuya Nakade, Masaru Nakagawa | Ta-Yeh Lin1, Shuw-Guann Lin1, Yin-Cheng Chang1, Chaoping Hsieh1, Tzung-Hsien Chen2, Da-Chiang Chang1 | Ta-Yeh Lin, Shuw-Guann Lin, Yin-Cheng Chang, Chaoping Hsieh, Ming-Kun Hsieh, Da-Chiang Chang | Yin-Cheng Chang1, Ta-Yeh Lin1, Chaoping Hsieh1, Shawn S. H. Hsu2, Mao-Hsu Yen3, Jian-Li Dong4, Da-Chiang Chang1 | |||||
| (The Japan Society of Mechanical Engineers) | (1. Taiwan Semiconductor Research Institute, 2. Bureau of Standards) | (Taiwan Semiconductor Research Institute) | (1. Taiwan Semiconductor Research Institute, 2. Institute of Electronics Engineering, 3. Department of Computer Science and Engineering, 4. Bureau of Standards) | |||||
| Research on Solder Joint Intermittent Fault Diagnosis Based on Dynamic Characteristic Analysis | 11 | Research on Intermittent Fault Dynamic Characteristic Based on Electrical Connector | 12 | Si(100)-GaN/Si(111) Low Temperature Wafer Bonding Process for 3D Power Supply on Chip | 22 | Design of Cavity-Resonator-Integrated Guided-Mode Resonance Narrowband-Pass Filter | 23 | |
| Li Huakang, Lyu Kehong, Zhang Yong, Yang Peng, Jing Qiu, Liu Guanjun | Xianzhe Cheng, Kehong Lv, Peng Yang, Yong Zhang, Guanjun Liu, Jing Qiu | Ryuki Ishito, Kota Ono, Satoshi Matsumoto | Ryo Asai, Junichi Inoue, Shogo Ura | |||||
| (Science and Technology on Integrated Logistics Support Laboratory) | (National University of Defense Technology) | (Kyushu Institute of Technology) | (Kyoto Institute of Technology) | |||||
| MMF Exciter Composed of Graded-Index Core Polymer Optical Waveguide Fabricated Applying the Mosquito Method and the Imprint Method | 24 | Simulation of Refractive Index Profile Formed in Polymer Optical Waveguides Fabricated Using the Mosquito Method | 28 | Polymer Optical Coupling Device with Single Mode Fiber for Silicon Photonics | 29 | Fabrication and Evaluation for Polymer Waveguide Optical Amplifier Incorporated with Rare Earth-Metal Polymer Composite | 36 | |
| Ryosuke Hatai, Fukino Nakazaki, Tomoki Nakayama, Takaaki Ishigure | Yoji Sakaguchi, Takaaki Ishigure | Ryo Sato1, Chiemi Fujikawa1, Osamu Mikami1, Takayuki Inayama2, Kazuya Ohashi2, Kazuto Noguchi2 | Toshifumi Horie, Takaaki Ishigure | |||||
| (Keio University) | (Keio University) | (1. Tokai University, 2. Ehime University) | (Keio University) | |||||
| Ultrasonic Joining of Carbon Fiber Reinforced Thermoplastic and Magnesium Alloy | 39 | Study on Loss Variation Measurement of Branched Fibers | 42 | Effect of Several Surfactants for Enhancing Electrical Conductivity Development Through Silver Fillers in an Epoxy-Based Binder | 45 | |||
| Kohei Kawakami, Kiyokazu Yasuda | Kentaro Matsuda, Ryota Kuramochi, Takaaki Endo, Ryo Nagase | Shiho Nakazawa1, Yoshiaki Sakaniwa2, Masahiro Inoue1 | ||||||
| (Osaka University) | (Chiba Institute of Technology) | (1. Gunma University, 2. Mitsubishi Materials Co.) | ||||||
| 19:00-21:00 | Committee Reception | |||||||
| November 20, 2019 | (Wednesday) | |||||||
| Hall I | Hall II | Hall III | Room 3 | |||||
| 9:00 | Registration | |||||||
| 9:15-10:45 | Hall I & II Chairperson Shinya Takyu (LINTEC Corporation) and TBD |
Sponsor's Exhibition | ||||||
| EPS Special Speech | ||||||||
| 9:15 | EPS Special Talk I: Design Challenges for
Advanced Electronic Packaging Chris Bailey (University of Greenwich) |
S-01 | ||||||
| 10:00 | EPS Special Talk II: Electronic Packaging: The
Next 20 Years Beth Keser (Intel Corporation) |
S-02 | ||||||
| 10:45 | Early Career Researcher Session Award Ceremony @Hall I & II | |||||||
| 11:00 | Coffee break + Sponsor's Exhibition @Hall III | |||||||
| 11:25-12:15 | Session 10: Power Electronics | Session 11: Photonics 3 | Sponsor's Exhibition | Session 12: SI/PI/RF 1 | ||||
| Chairperson | Chairperson | Chairperson | ||||||
| Yoshikazu Takahashi (Tohoku University) | Hidetoshi Numata (IBM Research - Tokyo) | Kazuyuki Nakagawa (Renesas Electronics Corp.) | ||||||
| Kentaro Kaneko (Kyoto University) | Bernard HL Lee (SENKO Advanced Components (HK) Ltd) | Masahiro Aoyagi (AIST) | ||||||
| 11:25 | (Invited) Mapping of Metal/Semiconductor and Semiconductor/Semiconductor Interfaces Using Scanning Internal Photoemission Microscopy | I-09 | Polarization Dependence Analysis of Polymer Optical Waveguides | 51 | Adjustable EMI Shielding on Electronic Packages Realized by Electrolytic Plating | 15 | ||
| Kenji Shiojima | Yoshie Morimoto, Hitomi Matsui, Takaaki Ishigure | Mustafa Özkök1, Sven Lamprecht1, Eckart Klusmann1, Toshiya Fujiwara2 | ||||||
| (University of Fukui) | (Keio University) | (1. Atotech Germany GmbH, 2. Atotech Japan) | ||||||
| 11:50 | (Invited) Unleashing the Potential of α-Ga2O3 | I-08 | Effect of Sidewall Roughness on Polymer Waveguides for Optical Interconnects Application | 47 | Compact and Wideband Rat-Race Coupler for 5G Applications | 34 | ||
| Takuto Igawa | Ying Shi, Lin Ma, Zuyuan He | Bo Zhou, LI Qian, Changkun Li, Zhen Wang, ZhiKuang Cai | ||||||
| (FLOSFIA Inc.) | (Shanghai Jiao Tong University) | (Nanjing University of Posts and Telecommunications) | ||||||
| 12:15 | Improvement of Brittleness for Maleimide Molding Film and Package Level Reliability | 38 | ||||||
| Kazuhiro Kikuchi1,2, Takashi Sugino1, Yasunori Karasawa1, Yasutaka Watanabe1, Tadashi Suetsugu2 | ||||||||
| (1. Lintec Corporation, 2. Fukuoka University) | ||||||||
| 12:40 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition @Hall III | |||||||
| 12:55 | Lunch break (on your own) | |||||||
| 13:50-15:30 | Session 13: Advanced Package 3 | Session 14: Photonics 4 | Sponsor's Exhibition | Session 15: SI/PI/RF 2 | ||||
| Chairperson | Chairperson | Chairperson | ||||||
| Shinya Takyu (LINTEC Corporation) | Hideyuki Nasu (Furukawa Electric Co., Ltd.) | Masahiro Aoyagi (AIST) | ||||||
| Naoko Araki (Daicel Corporation) | Christian Koos (Karlsruhe Institute of Technology) | Kazuyuki Nakagawa (Renesas Electronics Corp.) | ||||||
| 13:50 | (Special Invited) Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging with Multi-layer RDL | S-06 | (Invited) 53.5625 Gb/sX4-ch Optical Interconnect Module Based on Silicon Interposer for Data Center Application | I-15 | High Density I/O Fan-out Design Optimization with Signal and Power Integrity | 16 | ||
| S.W. Ricky Lee | Chin-Ta Chen, Hsiao-Chin Lan, Po-Kuan Shen, Hsin-Chieh Wu, Yu-Chun Wang, Chien-Chen Hsieh | Keng Tuan Chang, Chih Yi Huang, Hung Chun Kuo, Ming Fong Jhong, Tsun Lung Hsieh, Mi Chun Hung, Chen Chao Wang | ||||||
| (Hong Kong University of Science & Technology) | (Centera Photonics Inc.) | (Advanced Semiconductor Engineering, Inc.) | ||||||
| 14:15 | (Special Invited) (continued) | S-06 | Design Modifications to an Existing Mid Board Optical Engine to Enable Liquid Immersion Cooling | 40 | AI-Based Design Methodology for High-Speed Transmission Line in PCB | 17 | ||
| S.W. Ricky Lee | Kevin Burt, Raymond Lee, Louis LaCroix | Moritoshi Yasunaga, Shumpei Matsuoka, Yuya Hoshino, Takashi Matsumoto, Tetsuya Odaira | ||||||
| (Hong Kong University of Science & Technology) | (Samtec, Inc.) | (University of Tsukuba) | ||||||
| 14:40 | The Study of Warpage of an Embedded Trace Substrate | 18 | (Invited) Holistic Transformation to Enable the Mass Manufacturing of Tb/s Transceivers | I-03 | Power Channel Design and Verification for Automotive Chipset with Multi-Core Processor | 25 | ||
| Ming Chang Shih, Yi-Hao Laio | Bogdan Sirbu | Nansen Chen | ||||||
| (National University of Kaohsiung) | (Fraunhofer IZM) | (MediaTek Inc.) | ||||||
| 15:05 | Strip Warpage Evaluation after FCB and Molding Procedure | 44 | Feasibility Study on Polyethylene as a Printed Wiring Board Material for High-Frequency Signal Transmission Around 50 GHz | 41 | ||||
| Ming-Han Wang, KarenYU Chen, Guan-Han Lin, Frank Cheng, Meng-Kai Shih, Shiu-Fang Yen | Kaoru Hashimoto, Kanji Otsuka | |||||||
| (Advanced Semiconductor Engineering, Inc.) | (Meisei University) | |||||||
| 15:30 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition @Hall III | |||||||
| 15:45 | Close | |||||||