Program of ICSJ2023

November 15, 2023 (Wednesday)
4F/5F Main Hall I 1F Room I 1F Room II
On-site presentation On-site presentation On-site presentation
9:00 Registration
10:10 Opening Remark: Taiji Sakai (General Chair)
10:25 Guest speech: Yoshio Nakatani (President of Ritsumeikan University)
10:35 Award Ceremony (Hall I)
10:50-12:30 Hall I
Chairperson Hideyuki Nasu (Furukawa Electric Co., Ltd.), Takaaki Ishigure (Keio University)
Plenary Speech I & II
10:50 Plenary Speech I : Optical I/O Chiplets and Architectures for Computing Fabrics
Mark Wade (Ayar Lab)		 P-02
11:40 Plenary Speech II : Co-Package Optics is the big next thing: What happened?
Daniel M. Kuchta (IBM T. J. Watson Research Center)		 P-03
12:35-12:50 Platinum Sponsors' Seminar (with a light meal) @1F Room I
Title: A novel power device material: GeO2  (Patentix Inc.)
12:50-13:05 Platinum Sponsors' Seminar (with a light meal) @1F Room I
Title: Introduction of Semiconductor Package Products and Technology (SHINKO ELECTRIC INDUSTIES CO., LTD.)
13:05-13:20 Platinum Sponsors' Seminar (with a light meal) @1F Room I
Title: Corporate Information / Development roadmap for electrolytic copper plating additive (OKUNO Chemical Industries Co., Ltd.)
13:30-15:25 Session 1: Co-packaged Optics Session 2: Advanced PKG I Session 3: Process and Material Technologies I
Chairperson Chairperson Chairperson
Henning Schröder (Fraunhofer IZM) Shoji Uegaki (Crane Research) Shinya Takyu (LINTEC Corporation)
Hidetoshi Numata (IBM Research) Taiji Sakai (FICT LIMITED) Kei Murayama (Shinko Electric Industries Co., Ltd.)
13:30 A Record High Optical Output Power Pigtailed-OSFP External Laser Source for Co-Packaged Optics 24 (Invited) Changes in Surface Functional Groups and Adhesion Strength to Heterogenous Material of UV Irradiated Epoxy-based Resin I-07 (Invited) Atomic imaging of Al2O3/diamond interface by photoelectron holography I-05
Kohei Umeta, Taketsugu Sawamura, Kyoko Nagai, Kazuhiko Kashima, Hideyuki Nasu Takeyasu Saito Mami N. Fujii, Yusuke Hashimoto, Jun Mizuno, Mutsunori Uenuma, Yukiharu Uraoka, and Tomohiro Matsushita
Furukawa Electric Co., Ltd. Osaka Metropolitan University Kindai University
13:55 Bandwidth Expansion of a Testing Station using a 0.3-mm-Pitch LGA Interface for a 25-Gbaud x 16-channel CPO Transceiver 31 Polishing of CVD Diamond for Direct Bonding using Ar and SF6-Gas Cluster Ion Beams 58 Influence of EMC Tg on Leakage Current in HTRB Test and Delamination in MSL Test for Power Package 19
Kazuya Nagashima, Yuta Ishige, Wataru Yoshida, Hideyuki Nasu Junsha Wang1), Tadatomo Suga1), Hideaki Yamada2), Yoshiaki Mokuno2) ZHIWEN LI, OU DONG, JUANJUAN HUANG, JUNRUI PENG
Furukawa Electric Co., Ltd. 1) Meisei University 2) AIST  Nexperia
14:20 Jitter Margin Analysis of 56-Gb/s PAM4 × 8-Channel VCSEL-Based Optical Transceiver for Co-Packaged Optics 29 Pillar-Concave Copper-Copper Bonding for Face-to-Face Carbon Nanotube Synthesis 63
Wataru Yoshida, Yuta Ishige, Kazuya Nagashima, Hideyuki Nasu Hua XU, Jeffery C.C. LO, S.W. Ricky LEE
Furukawa Electric Co., Ltd. The Hong Kong University of Science and Technology
14:45 Temperature Distribution Measurement System for a Water-Cooled CPO Daughter Board 62 Nb-Nb direct bonded pads for superconducting devices and their failure mode 44
Yuta Ishige, Kazuya Nagashima, Wataru Yoshida, Takeshi Hirasawa, Hideyuki Nasu Atsushi Kudo1), Masahisa Fujino2), Yuuki Araga2), Hiroshi Nakagawa1), Katsuya Kikuchi2), Tohru Taino1)
Furukawa Electric Co., Ltd. 1) Saitama University 2) AIST 
15:10 Interview with the Authors (Discussion after the session) + Sponsor's Exhibition 
15:25 Coffee break + Sponsor's Exhibition
15:40-17:35 Session 4: Photonics Packaging Session 5: Bioelectronics Session 6: IEEE EPS Technical Committee 6 ~ Challenges of Large Size Organic Substrate
Chairperson Chairperson Chairperson
Takaaki Ishigure (Keio University) Beomjoon Kim (The University of Tokyo) Shigenori Aoki (LINTEC Corporation)
Hideyuki Nawata (Nissan Chemical Corporation) Takafumi Fukushima (Tohoku University) Takashi Hisada (Rapidus)
15:40 (Invited) 2.5D Photonic Integration for GPU Interconnects I-01 FOWLP-based Flexible Hybrid Electronics (FHE) I: Photobiomodulation Device Fabrication on Hydrogel Substrate Using RDL-first Approach 54 (Invited) Large Substrate Manufacturing and Assembly Challenges T-01
Benjamin G. Lee Tadaaki Hoshi, Daichi Nishiguchi, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima Richard Graf
NVIDIA Corporation Tohoku University Marvell
16:05 Development of Adapter-less Compact Multifiber Optical Connector 20 FOWLP-based Flexible Hybrid Electronics II: Heterogeneous Integration Technology of Micro-LEDs on 3D-IC for Smart Skin Display 60 (Invited) Development of Chip-last Ultra Large Organic Package T-02
Alexander William Setiawan Putra, Kentaro Matsuda, Motohito Takezaki Jiayi Shen, Chang Liu, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima Kyota Yamamura
Hakusan Inc. Tohoku University Shinko
16:30 High Density Optical Transceiver Packaging using Glass Substrates and Through Glass Vias 65 Development of a highly porous polycaprolactone (PCL) Microneedles Array Patch to improve the absorption of interstitial fluid (ISF) 33 (Invited) Risk of Delamination in Larger Substrate and Mitigation T-03
Kevin Burt, Joe Ahadian, Chris Bohn, John Coronati, Marc Epitaux, Adam Owens, Nathan Roberson, Sandra Skendzic Yusuke Koma1), Yuko Tsuruma1), Rie Kinoshita2), Hoshimi Aoyagi2), Shigenori Aoki1), Shinya Takyu1), Jongho Park2), Beomjoon Kim2) S.B. Park
Samtec Inc. 1) LINTEC Corporation
2) The University of Tokyo		 The State University of New York
16:55 Unique optical connect structure with polymer waveguide fabricated by the Mosquito method 36 Sampling of biological interstitial fluid by porous microneedle array patches 34 (Invited) Organic Core & Prepreg Materials for Large Size Substrate T-04
Yuji Furuta1), Fumimasa Kondo2), Anzu Ito2), Ryoto Ichinose2), Hisashi Kaneda1), Tomoharu Fujii1), Takaaki Ishigure2) Yuko Tsuruma1), Yusuke Koma1), Shigenori Aoki1), Shinya Takyu1), Hoshimi Aoyagi2), Rie Kinoshita2), Jongho Park2), Beomjoon Kim2) Masahisa Ose
1) SHINKO ELECTRIC INDUSTRIES C., LTD.
2) Keio University		 1) LINTEC Corporation
2) The University of Tokyo		 Resonac
17:20 Interview with the Authors (Discussion after the session) + Sponsor's Exhibition 
17:35-18:15 Hall I
Chairperson Shinya Takyu (LINTEC Corporation) & Eiji Higurashi (Tohoku University)
IEEE EPS Special Speech I
17:35 IEEE EPS Special Speech I: Supply Chain Trends, Challenges, and Disruptions in Semiconductor Packaging
Kitty Pearsall (Boss Precision, Inc.)		 S-02
19:15 Welcome Reception
21:15 Close
November 16, 2023 (Thursday)
4F/5F Main Hall I 1F Room I 1F Room II
On-site presentation On-site presentation On-site presentation
9:00 Registration
9:20-10:10 Hall I
Chairperson Shoji Uegaki (Crane Research) & Kazuyuki Nakagawa (Renesas Electronics Corporation)
Plenary Speech III
9:20 Plenary Speech III: Latest Advanced Packaging Solutions for Heterogeneous Integration
C.P. Hung (ASE Group)		 P-04
10:10-11:00 Hall I
Chairperson Yoichiro Kurita (Tokyo Institute of Technology) & Taiji Sakai (FICT LIMITED)
Plenary Speech IV
10:10 Plenary Speech IV: New Level Innovation of Advanced Heterogeneous Integration
Seung Wook Yoon (Samsung Electronics Co., Ltd.)		 P-01
11:00 Coffee break + Sponsor's Exhibition
11:10-12:40 Session 7: Advanced PKG II Session 8: Automotive I Session 9: VCSEL-Based Optical Interconnects
Chairperson Chairperson Chairperson
Kiyokazu Yasuda (Osaka University) Hajime Kimura (Nissan Motor Co., Ltd.)
 Hideyuki Nasu (Furukawa Electric Co., Ltd.)
Kenji Takahashi (AIST) Yutaka Uematsu (Hitachi Ltd.) Junichi Inoue (Kyoto Institute of Technology)
11:10 (Invited) Metal-polymer direct joining using small textures on metal surface I-06 Packaging of SiC Power Module with a Low-Permittivity Material to Reduce Capacitive Coupling 30 Crosstalk Reduction in Ultra-High-Density High-Speed Optical Receiver 48
Yusuke Kajihara Sihoon Choi1), Jiyoon Choi1), Jong-Won Shin2), Jun Imoka1), Masayoshi Yamamoto1) Takatoshi Yagisawa, Tomonori Azuma, Makoto Miyoshi, Jumpei Miike, Yoshiyuki Harada, Satoshi Ide
Tokyo University 1) Nagoya University 2) Chung-Ang University  Fujitsu Optical Components Limited
11:35 Multi Die Stacked Structure fabricated by WoW Bonding 52 A Review of the Packaging Scheme of a Traction Inverter: Layout, Capacitor, Current Sensing and Power Module 39 Polymer Optical Waveguide Coupler with Vertically Bent Cores 9
Haruo Shimamoto1), Yuuki Araga1), Masahisa Fujino1), Naoya Watanabe1), Kenji Takahashi1), Tsuyoshi Kawagoe2), Ichirou Honma2), Katsuya Kikuchi1), Takatoshi Masuda2) Thiyu Warnakulasooriya, Sihoon Choi, Arihiro Kamiya, Jun Imaoka, Masayoshi Yamamoto  Nagi Itaru, Takaaki Ishigure
1) AIST
2) UltraMemory Inc.		 Nagoya University Keio University
12:00 Packaging of a 25-tiles device on large dimension AlN ceramic substrate keeping low dead areas and tight planarity 59 Abnormal Position Identification Technique for Communication Channel using Adaptive DFE 7
Sarah Renault Soshi Shimomura, Yasuhiro Ikeda, Yutaka Uematsu
CEA-Leti Hitachi Ltd.
12:25 Interview with the Authors (Discussion after the session) + Sponsor's Exhibition 
12:40-14:10 Lunch (free time)
14:10-15:40 Session 10: Automotive II Session 11: Millimeter Wave applications Session 12: Advanced PKG III
Chairperson Chairperson Chairperson
Yutaka Uematsu (Hitachi Ltd.) Kazuyuki Nakagawa (Renesas Electronics Corporation)
 Kenji Takahashi (AIST)
Hajime Kimura (Nissan Motor Co., Ltd.) Ryo Sakamaki (AIST) Chinami Marushima (IBM Japan, Ltd.)
14:10 (Invited) The Cutting-edge Simulation and Validation Technology using Model-based Development I-02 Design and Optimization of Test Socket for Millimeter-Wave Steerable Beam Measurement Technology 16 Understanding Design Rules of Wafer Level Chip Scale Packaging Addressing Thermo-Mechanical Challenges 2
Markus Plöger Yu-Chang Hsieh, Hong-Sheng Huang, Wen-Chun Hsiao, Sheng-Chi Hsieh, Chen-Chao Wang Yiyi Ma, Jing-En Luan
dSPACE GmbH ASE Inc. STMicroelectronics
14:35 High Density Automotive Module with Fan-Out Package 40 Ceramic-packaged Multichip Front-end Module for 5G Millimeter Wave Communication applications 12 A DfT Technique for Electrical Interconnect Testing of Circuit Boards with 3D Stacked SRAM ICs 15
Wataru Shiroi, Shuuichi Kariyazaki, Yuji Kayashima, Takafumi Betsui, Shiro Machida, Kazuyuki Nakagawa, Toshihiko Akiba  Bo Zhou, Zheng Pan, Yong Cheng Yuki Ikiri1), Hiroyuki Yotsuyanagi1), Fara ASHIKIN Binti Ali2), Shyue-Kung Lu3), Masaki Hashizume4)
Renesas Electronics Corporation Nanjing University of Posts and Telecommunications 1) Tokushima University
2) Universiti Teknikal Malaysia
3) National Taiwan Univ.
4) The Open Univ. of Japan
15:00 Board-Level Drop Reliability Analysis for Fine-Pitch BGA Packages in Automotive Applications 28 A Study on the Inductance and Thermal Regression and Optimization for Automatic Layout Design of Power Modules 61
Wei-Hong Lai Victor Parque, Aiki Nakamura, Tomoyuki Miyashita
ASE Inc. Department of Modern Mechanical Engineering, Waseda University
15:25 Interview with the Authors (Discussion after the session) + Sponsor's Exhibition 
15:40 Coffee break + Sponsor's Exhibition
15:50-16:30 Hall I
Hajime Kimura (Nissan Motor Co., Ltd.) & Yutaka Uematsu (Hitachi, Ltd.)
Special Speech I
15:50 Special Speech I: Special Speech I: Dynamic Wireless Power Transfer Technologies for Future Electric Vehicles
Takehiro Imura (Tokyo University of Science)		 S-05
16:30-17:10 Hall I
Chairperson Shinya Takyu (LINTEC Corporation) & Eiji Higurashi (Tohoku University)
IEEE EPS Special Speech II
16:30 IEEE EPS Special Speech II: Design Challenges with Chiplets
Sam Karikalan (Broadcom Inc.)		 S-01
16:50 Free time
17:00-18:00 Early Career Researcher's (ECR) Session (Open Forum with Beer) @ 1F Room I
Poster presentation
A D-Band Waveguide-feed Patch Array on GaAs IPD Process 4 Fabrication of Polymer Optical Waveguide Based Splitter by the Mosquito Method and Investigation of Its Signal Splitting Ratio 11 Structural Investigation of Rare-Earth Metal Polymer Composite Doped Optical Amplifiers for Higher Gain 14
Ta-Yeh Lin, Shuw-Guann Lin, Yin-Cheng Chang, Chaoping Hsieh, Tsenchieh Chiu, Da-Chiang Chang   Kosei Azuma, Takaaki Ishigure Kohei Ono, Takaaki Ishigure
National Central University Keio University Keio University
Polymer Spot Size Expander on Laser Diode Chip for Fiber Coupling 26 Study on Power Transmission System for a Dynamic Charging System Shared Between Light-Duty and Heavy-Duty Vehicles 32 Reserch on strain sensor using bending loss of optical fiber 43
Atsuki Sawada1), Yoshiki Kamiura2), Chiemi Fujikawa1), Osamu Mikami3) Kouki Onimaru, Kraisorn Throngnumchai Takaya Waki, Masaki Fujii, Ryo Nagase
1) Tokai University 2) Kyushu University
3) Universiti Teknologi Malaysia		 Kanagawa Institute of Technology Graduate School Chiba Institute of Technology
Template stripping of Au from polyimide film for smoothing of bonding surface 47 Suppression of surface roughening of Ag films by capping layer for Ag/Ag surface activated bonding 49
Shogo Koseki1), Mika Ogino1), Kai Takeuchi1), Le Hac Huong Thu2), Takashi Matsumae2), Hideki Takagi2), Yuichi Kurashima2), Tomoaki Tokuhisa3), Toshikazu Shimizu3), Eiji Higurashi1) Yuanhao Cai1) Kai Takeuchi1) Miyuki Uomoto2) Takehito Shimatsu2), Eiji Higurashi1)
1) Tohoku University 2) AIST
3) Kanto Chemical Co., Inc.		 1) Tohoku University
2) FRIS, Tohoku University
18:00 Close
November 17, 2023 (Friday)
4F/5F Main Hall I 1F Room I 1F Room II
On-site presentation On-site presentation On-site presentation
9:00 Registration
9:20 ECR Award Ceremony
9:30-10:10 Hall I
Chairperson Kenji Takahashi (AIST) & Shoji Uegaki (Crane Research)
Special Speech II
9:30 Special Speech II: Strategical Positioning of AIST Open R&D platform on Advanced Logic Semiconductors Technology
Yoshihiro Hayashi (AIST/Keio University)		 S-04
10:50 Coffee break + Sponsor's Exhibition 
11:00-12:55 Session 13: Process and Material Technologies II Session 14: High-Speed Electrical Interconnect Session 15: Polymer Waveguide Technology
Chairperson Chairperson Chairperson
Satomi Kawamoto (Namics Corporation)  Kazuyuki Nakagawa (Renesas Electronics Corporation) Hideyuki Nawata (Nissan Chemical Corporation)
Shinya Takyu (LINTEC Corporation) Yoichiro Kurita (Tokyo Institute of Technology) Junichi Inoue (Kyoto Institute of Technology)
11:00 (Invited) Laser-assisted high-throughput integration of microLEDs I-04 (Invited) Challenges of Semiconductor Microfabrication Technology for 3D Chiplet Integration I-11 Demonstration of high-power stability of polymer optical waveguides using external laser source (ELS) for co-packaged optics 6
Sergio Roso Yasuhiro Morikawa Satoshi Suda, Takayuki Kurosu, Akihiro Noriki, Fumi Nakamura, Takeru Amano
Holst Centre ULVAC National Institute of Advanced Industrial Science and Technology
11:25 Inductive sintering module for improved multi die attach in the field of power packaging 41 Simulation method of 32Gbps Signal Transmission Considering Xtalk Impact using Probability Density Function 35 Low Loss Design and Fabrication for Tapered Waveguide Based Spot Size Converter 45
Christian Hofmann1), Patrick Rochala2), Martin Kroll2), Sushant Panhale2), Mario Baum1), Harald Kuhn1), Kiyoshi Oi3),Masaki Sanada3), Kei Murayama3) Masahiro Yao, Norio Chujo Fumimasa Kondo1), Yuji Furuta2), Hisashi Kaneda2), Tomoharu Fujii2), Takaaki Ishigure1)
1) Fraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz University of Technology
2) Institute for Machine Tools and Production Processes (IWP), Professorship for Forming and Joining
3) SHINKO Electric Industries Co., Ltd.		 Hitachi, Ltd. 1) Keio University
2) SHINKO ELECTRIC INDUSTRIES CO., LTD. 
11:50 Printable Sheet Sensor System with Organic Circuit for Structural Health Monitoring 21 A 3.6–4.5 GHz Doherty RF Power Amplifier Using 0.25-um GaN/SiC HEMT and GaAs IPD technology 5 Temperature dependence of coupling loss between SMF and polymer optical waveguides with various refractive index profiles 22
Mihoko AKIYAMA1,2), Teppei ARAKI1,2), Takafumi UEMURA2), Shusuke YOSHIMOTO2), Naoko NAMBA2), Yuko KASAI2), Hiroshi OHTA2), Toshikazu NEZU2), Shichi TSURUTA1,2), Tsuyoshi SEKITANI1,2) Hsin-Chieh Lin1), Hsin-Chieh Lin2), Te-Hua Fan2), Hwann-Kaeo Chiou2), Da-Chiang Chang1) Ryota Kinoshita1), Takaaki Ishigure2)
1) Graduate School of Engineering, Osaka University, Suita, Osaka, Japan
2) SANKEN (Institute of Scientific and Industrial Research), Osaka University, Japan		 1) Taiwan Semiconductor Research Institute
2) National Central University
 1) Sumitomo Bakelite Co., Ltd.
2) Keio University
12:15 Warpage Observation of Liquid Compression Mold Underfill on Strip Substrate 42 Crosstalk Mitigation for High Speed SerDes Applications on FCBGA Package 25 Tactile Pressure Sensor Based on Flexible Polymer Optical Waveguides Fabricated by the Mosquito Method 17
Takayuki Oe, Yuto Shigeno, Yukihiro Ikeda, Kyota Aoyama, Tsuyoshi Kamimura Li-Chieh Hung, Hung-Chun Kuo, Ming-Fong Jhong, Chen-Chao Wang YUANTIAN YIN, Takaaki Ishigure
NAMICS CORPORATION ASE Inc. Keio University
12:40 Interview with the Authors (Discussion after the session) + Sponsor's Exhibition 
12:55-14:25 Lunch (free time)
14:25-16:45 Session 16: Power Electronics Session 17: Integrated Photonics Session 18: Process and Material Technologies III
Chairperson Chairperson Chairperson
Kentaro Kaneko (Ritsumeikan University) Benjamin G. Lee (NVIDIA Corporation) Kei Murayama (Shinko Electric Industries Co., Ltd.)
Hiroki Imabayashi (Fukui University) Hidetoshi Numata (IBM Research) Satomi Kawamoto (Namics Corporation) 
14:25 (Invited) 350℃ operation of SiC complementary JFET logic gates I-03 (Invited) Energy-Efficient Integrated Photonics for Future Optical Interconnects and Neuromorphic Computing I-08 Development of Anti-ESD back grinding tape 10
Mitsuaki Kaneko Stanley Cheung Shinya Takaoka, Issei Adachi
Kyoto University Hewlett Packard Labs Lintec Corporation
14:50 The effect of the power module structure (cupper clip thickness) on reliability under power cycling test 23 Retroreflection Using Bloch Surface Wave Resonance for External Laser Mirror 53 Development of high heat-resistant multilayer barrier electrodes suitable for multiple reflow processes 18
Ryoichi Kato, Yoshinari Ikeda, Takafumi Yamada, Kohei Yamauchi, Hiromichi Gohara, Tatsuhiko Asai, Hirohisa Oyama Keisuke Ozawa, Aika Taniguchi, Yuya Yamanishi, Junichi Inoue, Shogo Ura KAZUTAKA MAEDA, DAISUKE TOYOTA, SUGURU MISAWA
Fuji electric Co., Ltd. Kyoto Institute of Technology KYOCERA Corporation
15:15 Study of Nitride Crack Reduction for Electronic Power Devices 3 Polymer Optical Waveguide Type 3-D MUX device for Mode Division Multiplexing Links 46 Interview with the Authors (Discussion after the session) 
Nick Chenchao Zhong1), Haibo Fan1), Nivasan Yogeswara2), Mark Gajda2) Ryoto Ichinose, Takaaki Ishigure
1) Nexperia Hong Kong 2) Nexperia UK  Keio University
15:40 Schottky barrier diode based on Ge-doped α-Ga2O3 films grown by mist-CVD method 55 (Invited) Photonic System-in-Package (pSiP) by applying thin glass I-10
Takeru Wakamatsu1), Yuki Isobe1), Hitoshi Takane1), Kentaro Kaneko2), Katsuhisa Tanaka1) Henning Schroder, Oliver Kirsch, Daniel Weber, Julian Schwietering
1) Kyoto University 2) Ritsumeikan University Fraunhofer IZM
16:05 Prototyping and Evaluation of SiC Half Bridge Circuit using Power Device Embedded Module Process Towards Future Three Dimensional Packaging. 38 Interview with the Authors (Discussion after the session) 
Kazuhito NAKAMURA, Koichi SHIGEMATSU, Jun IMAOKA, Masayoshi YAMAMOTO
Nagoya University
16:30 Interview with the Authors (Discussion after the session) + Sponsor's Exhibition 
16:45 Close