Best Paper Award

Si Interposers Integrated with SrTiO3 Thin Film Decoupling Capacitors and Through-Si-Vias:
Koichi Takemura, Akira Ohuchi and kinobu Shibuya,
Device Platforms Research Laboratories, NEC Corporation

Young Paper Award

Room Temperature Wafer Bonding Using Surface Activated Bonding Method:
Shingo Taniyama, (co-authors: Ying-Hui Wang, Masahisa Fujino, and Tadatomo Suga),
School of Engineering, the University of Tokyo

Numerical Analysis and Experimental Validation for the Prediction of Flip Chip Solder Joint Standoff Height in MEMS Microphone Application:
Jeffery C.C.LO, (co-author: S.W.Ricky Lee),
Electronics Packaging Laboratory Center for Advanced Microsystems Packaging Hong Kong University of Science and Technology