Advanced Program
Last update: November 4, 2024
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| November 13, 2024 (Wednesday) | ||||||
| 4F/5F Main Hall I | 1F Room I | 1F Room II | ||||
| 9:00 | Registration | |||||
| 10:10 | Opening Remark (General Chair, Eiji Higurashi) | |||||
| 10:25 | Guest speech (President of Ritsumeikan University, Yoshio Nakatani) | |||||
| 10:35 | Award Ceremony | |||||
| 10:50-12:30 | Plenary Speech I & II | |||||
| Hall I | ||||||
| Hideyuki Nasu (Furukawa Electric Co., Ltd) and Takaaki Ishigure (Keio University) | ||||||
| 10:50 | Plenary Speech I: Silicon Photonic MEMS Switch for AI Super
Computers Ming Wu (University of California, Berkley) |
P-02 | ||||
| 11:40 | Plenary Speech
II: Silicon Photonics Light Engines with 2.5/3D Heterogeneous
Integration Radhakrishnan Nagarajan (Marvell Technology) |
P-03 | ||||
| 12:40-12:55 | Platinum Sponsors' Seminar 1 (with a light
meal) @Meetiing Room 1 OKUNO CHEMICAL INDUSTRIES CO., LTD. |
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| 12:55-13:10 | Platinum Sponsors' Seminar 2 (with a light
meal) @Meetiing Room 1 Vanguard Automation GmbH |
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| 13:30-15:25 | Session 1: Photonics I (Active Optical Device) |
Session 2: Process and Material Technologies I | Session 3: High-Speed Package and System | |||
| Chairperson | Chairperson | Chairperson | ||||
| Nobuo Ohata (Mitsubishi Electric Corporation) | Satomi Kawamoto (NAMICS Corporation) | Kazuyuki Nakagawa (Renesas Electronics Corporation) | ||||
| Motohito Takezaki (Hakusan Inc.) | Kei Murayama (Shinko Electric Industries Co., Ltd.) | Ryo Sakamaki (AIST) | ||||
| 13:30 | 3.2T Co-Package Optics (CPO) Module Based on 200G/ch Silicon-Organic-Hybrid (SOH) Mach-Zehnder Modulator (MZM) | 01-01 | Fluxless Low-Temperature Flip Chip Solder Interconnect for Cost Reduction | 02-01 | Signal Integrity Analysis and Design for HBM3 on Silicon-Based 2.5D Packaging | 03-01 |
| Chin-Ta Chen, Kao-Feng Tsai, Fu-Chieh Chang, Chuan-Kai Lin, Jia-Cong Yu | Teck Kheng Lee, Kelvin Zheng, Kyu Sik Shim, Ngan Yeow Goh, Sandar Tun Khin | Li-Chieh Hung, Cheng-Yu Tsai, Hung-Chun Kuo, Ming-Fong Jhong, Chen-Chao Wang | ||||
| Centera Photonics Inc. | Institute of Technical Education | ASE | ||||
| 13:55 | An Ultra-Compact 106-Gb/s PAM4 × 8-Channel Linear-Drive VCSEL-Based Transceiver for Co-Packaged Optics | 01-02 | Al wiring and Cu wiring connection by newly established AL ribbon stack bonding technology for Power package and module | 02-02 | High Density, High Bandwidth Copper Interconnects to Support High Density IC Packaging | 03-02 |
| Wataru Yoshida, Kazuya Nagashima, Kensho Nishizaki, Sho Yoneyama, Hideyuki Nasu | Noriko Numata, Takashi Aoki, Koichi Hasegawa, Manabu Nejiki, Ken Yamamura, Kazuyuki Nakagawa | Osamu Shimizu, Steve Krooswyk, Andy Shrout, Jignesh Shah, Akinori Mizumura, Chad Faith, Janine Love, Kevin Burt | ||||
| Furukawa Electric Co., Ltd. | Renesas Electronics Corporation | Samtec, Inc | ||||
| 14:20 | Over 25-GHz Bandwidth Testing Station using a 0.3-mm-Pitch LGA Interface for a 50-Gbaud x 16-channel CPO Transceiver | 01-03 | Enhancing Adhesion and Peel strength for fine line design on FCCSP Package | 02-03 | A Study on Reducing Crosstalk by Efficiently Placing Guard Vias | 03-03 |
| Kensho Nishizaki, Kazuya Nagashima, Wataru Yoshida, Sho Yoneyama, Hideyuki Nasu | Rick Yeh, MJ HE, Yu-Cheng Pai, Carl Chen, Yu-Po Wang | Msasahiro Yao, Norio Chujo | ||||
| Furukawa Electric Co., Ltd. | SPIL | Hitachi, Ltd. | ||||
| 14:45 | Design of Thin-film Narrowband Retroreflector for Oblique Incidence of Diverging Wave | 01-04 | Comparative studies on the reliability and intermetallic integrity of novel Au-coated Ag versus Cu and Au bonding wires | 02-04 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |
| Keisuke Sakatani, Yuya Yamanishi, Keisuke Ozawa, Junichi Inoue, Shogo Ura | Randolph Flauta, Jorex Lumanog, Suqin Huang, Joe Zhou, King Man Tai, Moon Chen | |||||
| Kyoto Institute of Technology | Nexperia Group | |||||
| 15:10 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
| 15:25 | Coffee break + Sponsor's Exhibition | |||||
| 15:40-17:35 | Session 4: Photonics II (Optical Fiber and Connector) |
Session 5: Process and Material Technologies II | Session 6: mmWave AiP EMC Package and Systems | |||
| Chairperson | Chairperson | Chairperson | ||||
| Hidetoshi Numata (IBM Research - Tokyo) | Satomi Kawamoto (NAMICS Corporation) | Yoichiro Kurita (Tokyo Institute of Technology) | ||||
| Junichi Inoue (Kyoto Institute of Technology) | Naoko Araki (DAICEL CORPORATION) | Wataru Shiroi (Renesas Electronics Corporation) | ||||
| 15:40 | Bend-Optimized Optical Fiber with Low Multipath Interference in the O-band | 04-01 | (Invited) Thermally Stable Solder Resist for High Temperature Applications | 05-01 | Heat Dissipation Study of Sub-THz Band AiP Module | 06-01 |
| Scott Bickham, Riley Freeland, Stephen Smith, Madison Shipman, Xin Chen, Jason Hurley, Snigdharaj Mishra, Garth Scannell, Aramais Zakharian, Martin Hempstead | Daisuke Shibata1), Kazuya Nobuta1), Daichi Okamoto1), Masayuki Shimura1), Yuya Suzuki2) | Makoto Tsukahara1), Kei Murayama1), Hiroko Ota1), Hiroshi Taneda1), Yoichi Nakagawa2) | ||||
| Corning Research and Development Corporation | 1) Taiyo Ink Mfg. Co. Ltd. 2) Taiyo America Inc. |
1) Shinko Electric Industries Co., Ltd. 2) Panasonic Industry Co., Ltd. |
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| 16:05 | Evaluation of MPI suppression by bending a short PMF cable attached to an ELS module | 04-02 | Five sided protection of the chip with Bump support film impact resistance | 05-02 | Evaluation of Transmission Line Properties on Si-CMOS chip by Probe Backside Reflection Method in Millimeter-Wave Frequencies | 06-02 |
| Noe Ishizuka, Daiki Takeda, Tsunetoshi Saito, Hideyuki Nasu | Reina Kainuma, Rikiya Kobashi, Keisuke Shinomiya, Takuo Nishida | Ryo Sakamaki1), Seitaro Kon1), Ichiro Somada2), Takeshi Yoshida3), Shuhei Amakawa3), Minoru Fujishima3) | ||||
| Furukawa Electric Co., Ltd | LINTEC Corporation | 1) AIST 2) Mitsubishi Electric Corporation 3) Hiroshima University |
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| 16:30 | Quantum Co-packaged Optical Assembly | 04-03 | Study on the Novel Fabrication Procedure of Polyimide Multilayer Circuits for a Space Transformer of DRAM Probe Card using Parallel Build-up Process | 05-03 | Socket Design for 1x4 mmWave Antenna in Package with Beamforming Testing | 06-03 |
| Andrew Meek1), Bernard Lee1), Yang Chen1), R.Ryan Vallance1), Michael O'Farrel1), Abu Bakar Bhatti1), Robert Ferguson2), Irshaad Fatadin2), Richard Pitwon3) | Seong-Dae Park, Hyunseung Yang, Hyeok Jang | Chia-Ching Chu, Wen-Chun Hsiao, Hong-Sheng Huang, Sheng-Chi Hsieh, Chen-Chao Wang | ||||
| 1) Senko Advanced Components 2) National Physical Laboratory 3) Resolute Photonics |
Korea Electronics Technology Institute | ASE, Inc. | ||||
| 16:55 | Development of Re-assemblable Multifiber Connector for Co-Packaged Optics | 04-04 | A Novel of Ultra Thinner Thermoelectric Device for Wireless Sensor Application | 05-04 | High Reliability Solutions of EMI Shielding Technology for Advanced SiP Module | 06-04 |
| Alexander William Setiawan Putra, Kentaro Matsuda, Motohito Takezaki | Takuro Yoneda1), Kosuke Watanabe2), Koji Miyazaki2), Kunihisa Kato1) | Mike Tsai, Ryan Chiu, James Lin, Ming-fan Tsai, Eddie Zheng, Dave Chen, Tim Chang, Nicholas Kao, J.Y. Chen, Yu-Po Wang | ||||
| Hakusan Inc. | 1) Lintec Corporation 2) Kyushu University |
SPIL | ||||
| 17:20 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
| 17:35-18:15 | Special Speech I | |||||
| Hall I | ||||||
| Chairperson Takaaki Ishigure (Keio University) and Hideyuki Nawata (Nissan Chemical Corporation) | ||||||
| 17:35 | Special Speech I: Wafer-scale packaging of photonic switches and
transceivers Geert Van Steenberge (imec and Ghent University) |
S-05 | ||||
| 19:15 | Welcome Reception | |||||
| 21:15 | Close | |||||
| November 14, 2024 (Thursday) | ||||||
| 4F/5F Main Hall I | 1F Room I | 1F Room II | ||||
| 9:00 | Registration | |||||
| 9:20-11:00 | Plenary Speech III & IV | |||||
| Hall I | ||||||
| Chairperson Shoji Uegaki (Crane Research) and Taiji Sakai (TSMC Japan 3DIC R&D Center, Inc.) | ||||||
| 9:20 | Plenary
Speech III : Advance Heterogeneous Integration package solution for Silicon
Photonics application Scott Chen (Advanced Semiconductor Engineering, Inc.) |
P-01 | ||||
| 10:10 | Plenary
Speech IV : Chiplet and Advanced Packaging Research Ecosystem John Knickerbocker (IBM) |
P-04 | ||||
| 11:00 | Coffee break + Sponsor's Exhibition | |||||
| 11:10-12:40 | Session 7: Advanced PKG I | Session 8: Process and Material Technologies III | Session 9: Bio electronics I | |||
| Chairperson | Chairperson | Chairperson | ||||
| Taiji Sakai (TSMC Japan 3DIC R&D Center, Inc.) | Shinya Takyu (LINTEC Corporation) | Beomjoon Kim (University of Tokyo) | ||||
| Chinami Marushima (IBM Japan, Ltd.) | Naoko Araki (DAICEL CORPORATION) | Takafumi Fukushima (Tohoku University) | ||||
| 11:10 | (Invited) In-line SEM Evaluation Technique for Cu Pad Nanotopography for Hybrid Bonding Applications | 07-01 | (Invited) Polymer Optical Waveguide for Silicon Photonics | 08-01 | (Invited) Wearable Electronic Packaging Technology for VR and Biomedical Applications | 09-01 |
| Hiroaki Kasai1), Kazuhisa Hasumi1), Nobuyuki Mise1), Mayuka Osaki2), Soon Aik Chew3), Bensu Tunca Altinta3), Boyao Zhang3), Alain Moussa3), Anne-Laure Charley3), Eric Beyne3), Gian Lorusso3), Andy Miller3), Maki Tanaka1) | Nobuyuki Otozawa, Hiroyuki Mieno, Kensuke Ono, Shotaro Takenobu, Nobuhiko Imajyo, Masanobu Maeda, Yoshiki Takahashi | Seiichi Takamatsu | ||||
| 1) Hitachi High-Tech Corporation 2) Hitachi, Ltd. 3) imec |
AGC Inc. | Thomas J State University of New York at Binghamton | ||||
| 11:35 | Oxide microtubes fabrication with 10μm to 5μm pitches and assembly characterization | 07-02 | New PFAS-free optical adhesive with high heat resistance and low refractive index | 08-02 | (Invited) Wood Nanocellulose-Based Green Electronics | 09-02 |
| Raphoz Natacha, Peray Patrick, Berger Frédéric, Mailliart Olivier, Desbordes Cloé, Gueugnot Alain | Masashi Kajiwara, Yoshito Yamada, Takashi Yamaguchi, Noriyuki Sakai | Hirotaka Koga | ||||
| CEA-LETI | NAMICS Corporation | Osaka University | ||||
| 12:00 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | Verification of dicing method for Silicon Photonic wafers | 08-03 | Impact of Laser Welding on Assembly of Printed Circuit Boards in Medical Devices | 09-03 | |
| Haruki Otaka, Kazuhiro Yoshida, Tomoharu Fujii | Kshitij Jayantilal Bopalkar, Viraj Patwardhan, Anthony Okello, Adi Chola Venkatesh | |||||
| Shinko Electric Industries Co., Ltd. | Vision Engineering Intuitive | |||||
| 12:25 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
| 12:50-13:05 | Platinum Sponsors' Seminar 3 (with a light
meal) @Meetiing Room 1 SENKO Advance Co., Ltd. |
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| 13:05-13:20 | Platinum Sponsors' Seminar 4 (with a light
meal) @Meetiing Room 1 SURUGA SEIKI CO., LTD. |
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| 13:45-15:40 | Session 10: Hybrid bonding | Session 11: Photonics III (Photonics Packaging) |
Session 12: Bio electronics II | |||
| Chairperson | Chairperson | Chairperson | ||||
| Takafumi Fukushima (Tohoku University) | Hidetoshi Numata (IBM Research - Tokyo) | Shigenori Aoki (LINTEC Corporation) | ||||
| Kenji Takahashi (AIST) | Richard C. Pitwon(Resolute Photonics Ltd.) | Kai Takeuchi (Tohoku University) | ||||
| 13:45 | (Invited) Hybrid Bonding in Advanced Heterogenous Integration: Key Metrology Enablers | 10-01 | Ultra High Optical Output Power 8-channel ELS Module Employing a Blind Mate Optical Connector for Co-Packaged Optics | 11-01 | Diagnosing PCB(A) deficiencies in medical instruments during reprocessing and sterilization cycles | 12-01 |
| Bongsub Lee | Yuki Shiroishi, Kohei Umeta, Taketsugu Sawamura, Hideyuki Nasu | Toshak Singhal, Viraj Patwardhan | ||||
| Adeia Inc. | Furukawa Electric Co., Ltd | Intuitive Surgical Inc | ||||
| 14:10 | (Invited) Fine pitch die-to-wafer hybrid bonding integration | 10-02 | High-Bandwidth Optical Transmission with Single External Laser Source (ELS) and Polymer Splitters for Co-packaged Optics | 11-02 | Development of optical microneedle lens array to deliver light efficiently for photodynamic therapy to treat basal cell carcinoma | 12-02 |
| Ye Lin | Satoshi Suda, Md Omar Faruk Rasel, Akihiro Noriki, Fumi Nakamura, Haruhiko Kuwatsuka, Tadashi Murao, Takeru Amano | Anthony Lefebvre1), Wataru Hanamoto1), Jongho Park1), Anne-Sophie Dewalle-Vignion2), Guillaume Paul Grolez2), Nadira Delhem2), Laurent Mortier2), Beomjoon Kim1) | ||||
| imec | AIST | 1) The University of Tokyo 2) Univ. Lille |
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| 14:35 | (Invited) Next-Generation Wafer-to-Wafer Bonding Technologies for Sub-50nm Bonding Overlay Accuracy | 10-03 | Co-Design of Photonic IC, Electronic IC, and Interposer for 1.6 Tbps O/E Converter in Active Optical Package | 11-03 | Simulation and Fabrication of Highly Bendable Advanced 3D Corrugated Interconnects Using Flexible FOWLP | 12-03 |
| Tomohiro Chiba | Naoki Matsui1), Akihiro Noriki2), Haruhiko Kuwatsuka2), Fumi Nakamura2), Satoshi Suda2), Takayuki Kurosu2), Takeru Amano2), Satoshi Ishikawa1), Hiromichi Yoshikawa1), Reona Motoji1), Dan Maeda1), Tomoya Sugita1), Hirotaka Uemura1) | Han Zhang, Chang Liu, Jiayi Shen, Tetsu Tanaka, Takafumi Fukushima | ||||
| Nikon Corporation | 1) KYOCERA Corporation 2) AIST |
Tohoku University | ||||
| 15:00 | (Invited) CMOS Directly Bonded to Array (CBA) Technology for Future 3D Flash Memory | 10-04 | Fabrication of a glass sub-mount with high heat dissipation | 11-04 | Multichip-to-Wafer Mini-LED Bonding Technology for Photobiomodulation Sheet Devices Using Flexible FOWLP | 12-04 |
| Masayoshi Tagami | Takuma Fujita, Asami Uchiyama, Shinya Okuda, Mizuki Shirao, Nobuo Ohata | Xingyao Guo, Tadaaki Hoshi, Nishiguchi Daichi, Jiayi Shen, Chang Liu, Tetsu Tanaka, Takafumi Fukushima | ||||
| Kioxia Corporation | Mitsubishi Electric Corporation | Tohoku University | ||||
| 15:25 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
| 15:40 | Coffee break + Sponsor's Exhibition | |||||
| 15:50-16:30 | IEEE EPS Special Speech I | |||||
| Hall I | ||||||
| Chairperson Shinya Takyu (LINTEC Corporation) and Eiji Higurashi (Tohoku University) | ||||||
| 15:50 | IEEE EPS Special Speech I: Technologies for
Chiplet based System Integration Tanja Braun (Fraunhofer IZM) |
S-01 | ||||
| 16:30-17:10 | IEEE EPS Special Speech II | |||||
| Hall I | ||||||
| Chairperson Shinya Takyu (LINTEC Corporation) and Eiji Higurashi (Tohoku University) | ||||||
| 16:30 | IEEE EPS Special Speech II: Mechanical Behavior
of Solder Micro Bumps in Advanced Packaging for Heterogeneous
Integration Jeffrey Suhling (Auburn University) |
S-02 | ||||
| 17:15-18:15 | Early Career Researcher's (ECR) Session (Open Forum with Beer) @ 1F Room I | |||||
| Chairperson Kazuyuki Nakagawa (Renesas Electronics Corporation) and Takafumi Fukushima (Tohoku University) | ||||||
| Poster presentation | ||||||
| Multi-channel Integration of Polymer Spot Size Expander on Silicon Photonics Chip | ECR-01 | Formation of Au hollow micro-bump arrays for low temperature Au-Au bonding | ECR-02 | Development of Through Semiconductor Via manufacturing process for heterogeneous integration of GaN power device on Si-LSI | ECR-03 | |
| Atsuki Sawada1), Yoshiki Kamiura2), Chiemi Fujikawa1), Osamu Mikami3) | Shintaro Goto1), Kai Takeuchi1), Le Hac Huong Thu2), Takashi Matsumae2), Hideki Takagi2), Yuichi Kurashima2), Eiji Higurashi1) | Hidejiro Mishima, Kaiyuan Zheng, Satoshi Matsumoto, Satoko Shinkai | ||||
| 1) Tokai University 2) Kyushu University 3) Universiti Teknologi Malaysia |
1) Tohoku
University 2) AIST |
Kyushu Institute of Technology | ||||
| Direct Connection of Multimode Polymer Waveguide and Multimode Fibers Using the Mosquito Method | ECR-04 | Structural Investigation of Microchannel and Optical Waveguide Co-integrated Sensor Devices | ECR-05 | Field-size converter for edge coupling of multimode LD to thin film waveguide | ECR-06 | |
| Tatsuya Nakamura, Takaaki Ishigure | Tomohiro Ichizuka, Takaaki Ishigure | Yuya Yamanishi1), Junichi Inoue1), Keisuke Ozawa1), Kenji Kintaka2), Kouki Ichihashi3), Ura Shogo1) | ||||
| Keio University | Keio University | 1) Kyoto
Institute of Technology 2) National Institute of Advanced Industrial Science and Technology 3) Panasonic Holdings Corp. |
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| Feasibility Study of Self Assembly Using Copper Nano Film Formed by Blue Laser for Die-to-Wafer Hybrid Bonding | ECR-07 | 3D Polymer Optical Waveguide-based Fan-in/out Device for Silicon Photonics Chips | ECR-08 | Fixed Connection of Single-mode Polymer Optical Waveguide with Single-mode Optical Fiber | ECR-09 | |
| Hayami Asahara, Kiyokazu Yasuda | Anzu Ito, Takaaki Ishigure | Shunsuke Toshida, Takaaki Ishigure | ||||
| Osaka University | Keio University | Keio University | ||||
| Sequential surface treatment process with VUV light and Ar plasma for room temperature Au-Au bonding | ECR-10 | Adhesion Between Si Substrates in Liquid Water Using Inorganic Polymer | ECR-11 | |||
| Mika Ogino, Kai Takeuchi, Eiji Higurashi | Daiki Nemoto, Kai Takeuchi, Eiji Higurashi | |||||
| Tohoku University | Tohoku University | |||||
| 18:15 | Close | |||||
| November 15, 2024 (Friday) | ||||||
| 4F/5F Main Hall I | 1F Room I | 1F Room II | ||||
| 9:00 | Registration | |||||
| 9:20 | ECR Award Ceremony | |||||
| 9:30-10:10 | Special Speech II | |||||
| Hall I | ||||||
| Chairperson Eiji Higurashi (Tohoku University) and Kei Murayama (Shinko Electric Industries Co., Ltd.) | ||||||
| 9:30 | Special Speech II: Innovation and steps in
hetero-integration Harald Kuhn (Fraunhofer ENAS) |
S-03 | ||||
| 10:10-10:50 | Special Speech III | |||||
| Hall I | ||||||
| Chairperson Kraisorn Throngnumchai (Kanagawa Institute of Technology) and Yutaka Uematsu (Hitachi, Ltd.) | ||||||
| 10:10 | Special Speech III: Wireless Power Transfer
Theory Established Last Decade Takashi Ohira (Toyohashi University of Technology) |
S-04 | ||||
| 10:50 | Coffee break + Sponsor's Exhibition | |||||
| 11:00-12:30 | Session 13: IEEE EPS Technical session Glass Substrate |
Session 14: Advanced Automotive Electronics | Session 15: Advanced PKG II | |||
| Chairperson | Chairperson | Chairperson | ||||
| Shigenori Aoki (LINTEC Corporation) | Atsushi Nakamura (Ultimate Technologies Inc.) | Kiyokazu Yasuda (Osaka University) |
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| Takashi Hisada (Rapidus) | Yutaka Uematsu (Hitachi, Ltd.) | Shoji Uegaki (Crane Research) | ||||
| 11:00 | (Invited) Advanced Materials and Processes for Glass-core Packaging | 13-01 | (Invited) Application of EMC Simulation Including Semiconductor for Short-term Development | 14-01 | Novel Additive Manufacturing Platform for Freeform 3D Microelectronics and Packaging | 15-01 |
| Mohan Kathaperumal | Kazuki Furukawa, Kento Shimizu, Toshiki Mikura | Darragh Walsh, Jeroen Sol, Pim Ostendorf, Hylke Akkerman | ||||
| Georgia Institute of Technology | AISIN Corporation | Holst Centre/TNO | ||||
| 11:25 | (Invited) Glass materials and glass structuring technologies for glass-core substrates | 13-02 | Design of Compact ECU with Two-layer Daughter Board Structure for Automotive High-performance Computing | 14-02 | Effect of Microstructure on the Electromigration Performance of 2-μm-Cu Redistribution Line under In-situ SEM Observation | 15-02 |
| Yoichiro Sato | Soshi Shimomura, Masako Kato, Yutaka Uematsu | Min-Yan Tsai, Ting-Chun Lin, Yen-Cheng Huang, Shan-Bo Wang, Yung-Sheng Lin, Kwang-Lung Lin | ||||
| AGC Inc. | Hitachi, Ltd. | ASE Group | ||||
| 11:50 | (Invited) Reliability Assessment of Glass Substrate/Interposer | 13-03 | German License Plate Recognition System Using the YoloV8 Model and EasyOCR | 14-03 | Implementation of Curved CMOS Image Sensors by Transferring Silicon-On-Insulator Layers | 15-03 |
| SB Park | Hasan Aljzaere, Atul Chandra Nath, Wolfram Hardt | Masahide Goto, Shigeyuki Imura, Hiroto Sato | ||||
| Binghamton University | Chemnitz University of Technology | NHK Science & Technology Research Laboratories | ||||
| 12:15 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
| 12:30-14:00 | Lunch (free time) | |||||
| 14:00-16:20 | Session 16: Photonics IV (Laser, Process and Polymer technologies for Photonics) |
Session 17: EMC and Automotive PKG | Session 18: Power Electronics Materials and devices of UWBG and WBG semiconductors | |||
| Chairperson | Chairperson | Chairperson | ||||
| Hideyuki Nasu (Furukawa Electric Co., Ltd.) | Yutaka Uematsu (Hitachi, Ltd.) | Kentaro Kaneko (Ritsumeikan University) | ||||
| Motohito Takezaki (Hakusan Inc.) | Atsushi Nakamura (Ultimate Technologies Inc.) | Hiroki Imabayashi (University of Fukui) | ||||
| 14:00 | Heat Assisted Magnetic Recording - Ultra-dense laser and plasmonic component integration to increase storage density on magnetic media | 16-01 | (Invited) EMC overview, Causes and Physics | 17-01 | (Invited) Recent progress and task of GaN materials and devices for power applications | 18-01 |
| Richard Pitwon1),2), Anil Reddy1), Michael Kautzky1), Martin Blaber1), Mark Gubbins1), Beverley McConnell1) | Hideho Yamamura | Yohei Otoki | ||||
| 1) Seagate Technology 2) University of St Andrews |
Ultimate Technologies Inc. | Nagoya University, National Yang Ming Chiao Tung University | ||||
| 14:25 | Evaluation and Analysis of Polarization Dependent Polymer Optical Waveguide Characteristics | 16-02 | A Review of BMW iX3 Power Module – Part 1: Inner Configuration, Die Attachment, Busbar Connection and Encapsulation | 17-02 | Sintered Ag & Cu Based Die attach for Power Package and Power Module Application | 18-02 |
| Takumi Wakabayashi, Takaaki Ishigure | Thiyu Warnakulasooriya, Jiyoon Choi, Sihoon Choi, Arihiro Kamiya, Jun Imaoka, Masayoshi Yamamoto | Tamimoto Hideaki, Kazuki Matsumura, Kazuyuki Nakagawa, Kenji Ikura, Chikara Obama | ||||
| Keio University | Nagoya University | Renesas Electronics Corporation | ||||
| 14:50 | Loss Reduction of Single-mode Y-branched Polymer Optical Waveguide for MUX/DEMUX Devices in Mode Division Multiplexing Links | 16-03 | A Review of BMW iX3 Power Module – Part 2: Stacked-Plate Fin Heatsink Structure | 17-03 | Simulation Study of Factor Effect on Transient Thermal Test Performance for Electronic Power Devices | 18-03 |
| Seiya Sakai, Takaaki Ishigure | Jiyoon Choi, Thiyu Warnakulasooriya, Sihoon Choi, Arihiro Kamiya, Jun Imaoka, Masayoshi Yamamoto | Nick Chenchao Zhong, Haibo Fan, Yuning Shi | ||||
| Keio University | Nagoya University | Nexperia Group | ||||
| 15:15 | Towards scalable aligned two-photon lithography for photonic integration | 16-04 | High-Performance Flip-Chip BGA Packages Reliability Prediction in Automotive Applications | 17-04 | Effect of Sb dopant in growth of r-GeO2 thin films | 18-04 |
| Mareike Trappen, Matthias Blaicher, Tobias Hoose, Nicole Lindenmann, Stephan Dottermusch, Benjamin Richter, Andrea Bertoncini, Michael Thiel | Bo-Heng Chen, Wei-Hong Lai, Chin-Li Kao, Alexcc Wang, CP Hung | Toya Yagura1), Yuri Shimizu1), Toyosuke Ibi1), Isao Takahashi1), Kentaro Kaneko2) | ||||
| Nanoscribe GmbH & Co. KG | ASE Inc. | 1)
Patentix Incorporated 2) Ritsumeikan University |
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| 15:40 | Post-fab laser trimming: increasing yield and lowering power consumption of PICs | 16-05 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||
| Simon Duval1), Philippe Lassonde1)2), François Légaré2), Ignazio Piacentini3), Louis-Rafael Robichaud1) | ||||||
| 1) Femtum Inc, 2) INRS-EMT 3) IP Consulting |
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| 16:05 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
| 16:20 | Close | |||||