Advance Program
Last update: October 15, 2025
Click here to download the PDF file.
| November 11, 2025 (Tuesday) | ||||||
| Early Career Researchers (ECR) Pre-Event | ||||||
| On the evening of Nov. 11, a pre-event (Get
Together Party, free of charge) is held dedicated for ECR
session presenters, oral session students presenters, and young award
recipients. Detailed information of the event will be directly emailed to the eligible participants. |
||||||
| November 12, 2025 (Wednesday) | ||||||
| 4F/5F Main Hall I | 1F Room I | 1F Room II | ||||
| 9:00 | Registration | |||||
| 10:10 | Opening Remark (General Chair, Hideyuki Nawata) | |||||
| 10:25 | Greeting speech (IEEE EPS President-Elect, Jeffrey Suhling) | |||||
| 10:35 | Award Ceremony | |||||
| 10:50-12:30 | Plenary Speech I & II | |||||
| Hall I | ||||||
| Hideyuki Nasu (Furukawa Electric Co., Ltd.) and Takaaki Ishigure (Keio University) | ||||||
| 10:50 | Plenary Speech I: "Nothing" is Better than
Silica Sir David Neil Payne (University of Southampton) |
P-01 | ||||
| 11:40 | Plenary Speech
II: Paradigm Shifts in Silicon Photonics Roel Baets (Ghent University - imec) |
P-02 | ||||
| 12:40-12:55 | Platinum Sponsors' Seminar 1 (with a light
meal) @Meetiing Room 1 TBD |
|||||
| 12:55-13:10 | Platinum Sponsors' Seminar 2 (with a light
meal) @Meetiing Room 1 TBD |
|||||
| 13:30-15:25 | Session 1: Photonics I (Photonics Packaging / Si Photonics) |
Session 2: Process and Material Technologies for Hybrid Bonding | Session 3: High-Speed Package and System (Signal and Power Integrity) | |||
| Chairperson | Chairperson | Chairperson | ||||
| Hidetoshi Numata (IBM Research - Tokyo) | Shinya Takyu (LINTEC Corporation) | Kazuyuki Nakagawa (Renesas Electronics Corporation) | ||||
| Peter O'Brien (Tyndall National Institute) | Masahisa Fujino (Institute of Microelectronics) | Yutaka Uematsu (Hitachi, Ltd.) | ||||
| 13:30 | (Invited) Efficient AI System Scale-Up with Optical Interconnect: Opportunities & Challenges | 01-01 | (Invited) "Solution Proposal and Discussion on C2W-HB Toward to Practical Use" ～Introduction of Polymer Dielectric and Mounting Technology～ | 02-01 | (Invited) Inductors in Power over Signal (PoC and PoDL) for In-Vehicle Networks | 03-01 |
| Sunil Priyadarshi | Takenori Fujiwara | Thomas Schamberger | ||||
| Arista Networks | Toray Industries, Inc. | TDK Electronics AG | ||||
| 13:55 | Underfill with High Thermal Conductivity in Silicon Photonic Chiplets for Co-Packaged Optics (CPO) Devices | 01-02 | (Invited) Direct Transfer Bonding Overcoming the Challenges of Integrating delicate and Ultra-Thin Chips with 50-nm Scale Accuracy | 02-02 | Ultra-Small 145 GHz Coaxial Connector: Edge-Mount PCB Integration and Performance | 03-02 |
| Dai-Fei Li, Wen-Yu Teng, Liang-Yih Hung, Andrew Kang, Yu-Po Wang, Don-Son Jiang | Ichiro Sano | Hitoshi Onoduka, Yu-Cen Sun, Yushi Kirii | ||||
| Siliconware Precision Industries Co., Ltd. | TAZMO CO., LTD. | Yuetsu Seiki Co.,Ltd | ||||
| 14:20 | Development of Simultaneous Electrical and Optical Mounting for Co-Packaged Optics Modules | 01-03 | (Invited) Design and Development of Carrier Tapes for Direct Transfer Bonding Process | 02-03 | Effect of Thermal Distribution on Signal and Power Analysis of Large Complex 3D-IC System | 03-03 |
| Hisaaki Nishimura, Mizuki Tonomura, Misa Takahashi, Akari Watanabe, Megumi Oishi, Fumiaki Haraguchi, Tokuro Ozawa, Takeshi Yokoyama, Tomoyuki Akahoshi | Tomoka Kirihata | Yu Tomonaga, Tejas Jeurkar, Anushruti Jaiswal | ||||
| KYOCERA Corporation | LINTEC Corporation | ANSYS, Inc. and Ansys Japan K.K. | ||||
| 14:45 | (Invited) Co-Design and Co-Process for Co-Packaged Optics - An End-To-End Development Solution | 01-04 | Chemical resistant dicing tape for hybrid bonding process | 02-04 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |
| Christopher Striemer | Ryoh Takahashi, Koki Maruno, Kazutoshi Furuzono, Naoki Takahara, Seiji Kai | |||||
| AIM Photonics Test, Assembly and Packaging Facility | Resonac Corporation | |||||
| 15:10 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
| 15:25 | Coffee break + Sponsor's Exhibition | |||||
| 15:40-17:35 | Session 4: Photonics II (Laser) |
Session 5: Next Generation Packaging Technologies I | Session 6: High-Speed / RF Package and System | |||
| Chairperson | Chairperson | Chairperson | ||||
| Nobuo Ohata (Mitsubishi Electric Corpolation) | Eiji Higurashi (Tohoku University) | Yoichiro Kurita (Tokyo Institute of Technology) | ||||
| Richard Pitwon (Resolute Photonics) | Naoko Araki (Daicel Corporation) | Wataru Shiroi (Renesas Electronics Corporation) | ||||
| 15:40 | (Invited) Optical Signal Processsing (OSP) for pluggable transcedivers and co-packaged optics (CPO) | 04-01 | New Optical Adhesive Design for CPO Packaging Solution | 05-01 | Radiation-Induced Destructive Effects on COTS FPGA in GEO Satellite Environments | 06-01 |
| Yosef Ben Ezra | Fumiya Suzuki, Masashi Kajiwara, Takashi Yamaguchi, Masayoshi Otomo, Noriyuki Sakai | Yuzo Yajima1), Eisuke Haraguchi1), Shigenori Tani1), Hiroshi Kinoda1), Hiroaki Miyake2) | ||||
| Newphotonics | NAMICS CORPORATION | 1) Mitsubishi Electric Corporation 2) Tokyo City University |
||||
| 16:05 | Ultrathin Chips of III-V Bonding Process Using Laser Peel Transfer Technology for Co-Packaged Optics | 04-02 | High I/O Density Solution on Flip Chip Substrate for Advanced Package | 05-02 | Efficient Integral-Equation Methodology for Signal Integrity Analysis of Large-Scale IC Packages | 06-02 |
| Haruka Fujishige1), Takumi Ikehara1), Tatsuya Okada1), Yoshiaki Arai1), Junpei Oniki2), Daichi Miyazaki2), Takenori Fujiwara2), Yukari Jo2) | Yuan Chang Ni1), Hung Kun Chen1), Yu Cheng Pai1), Cheng Yu Kang1), Jen Shang Chen2), Wei Ching Chu2), Yu-Po Wang1), Don-Son Jiang1) | Hans Schreckenbach, Santosh Janaki Raman, Lucas Banting, Nima Chamanara, Andre Fecteau, David Abraham, Max Hughson, Nick Geddert, Troy Lowry, Jonatan Aronsson | ||||
| 1) Toray Engineering, Co. Ltd. 2) Toray Industries, Inc. |
1) Siliconware Precision Industries Co., Ltd. 2) KINSUS INTERCONNECT TECHNOLOGY CORP |
CEMWorks Inc. | ||||
| 16:30 | An 8-Channel MM VCSEL-Based Linear Drive CPO Transceiver for Compute and Backend Interconnects in AI/ML Systems | 04-03 | Development of heat-resistant UV-curable dicing tape | 05-03 | An Adjustable Energy-Recovering Electrical-Balance Duplexer for In-Band Full-Duplex Transceivers in the 6G FR3 Band | 06-03 |
| Sho Yoneyama, Wataru Yoshida, Kazuya Nagashima, Kensho Nishizaki, Hideyuki Nasu | Reo Ozeki, Sayaka Tsuchiyama, Akio Fukumoto | Hsin-Chieh Lin1), Chih-Hao Chuang2), Yan-Qi Weng2), Da-Chiang Chang1), Hwann-Kaeo Chiou2) | ||||
| Furukawa Electric Co., Ltd. | LINTEC corporation | 1) National Institutes of Applied Research 2) National Central University |
||||
| 16:55 | (Invited) Chip-Scale Comb Lasers for Co-Packaged Optics | 04-04 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | (Invited) TBD | 06-04 | |
| Frank Smyth, M. Deseada Gutierrez, Shane Duggan, Alison Kearney, Chris McGuinness, Amol Delmade | TBD | |||||
| Pilot Photonics Ltd | ||||||
| 17:20 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
| 17:35-18:15 | Special Speech I | |||||
| Hall I | ||||||
| Chairperson Shinya Takyu (LINTEC Corporation) and Hideyuki Nawata (Nissan Chemical Corporation) | ||||||
| 17:35 | Artifact Metrics and Individual Management of Semiconductor
Packages Tsutomu Matsumoto (National Institute of Advanced Industrial Science and Technology) |
S-03 | ||||
| 19:15 | Welcome Reception | |||||
| 21:15 | Close | |||||
| November 13, 2025 (Thursday) | ||||||
| 4F/5F Main Hall I | 1F Room I | 1F Room II | ||||
| 9:00 | Registration | |||||
| 9:20 | Guest speech (President of Ritsumeikan University, Yoshio Nakatani) | |||||
| 9:30-10:20 | Plenary Speech III | |||||
| Hall I | ||||||
| Chairperson Shoji Uegaki (Crane Research) and Taiji Sakai (TSMC Japan 3DIC R&D Center, Inc.) | ||||||
| 9:30 | Plenary Speech III : Challenges and
Opportunities for Japan Ecosystem in CoWoS® Technology Development for
Further Evolution of AI Shimpei Yamaguchi (TSMC Japan 3DIC R&D Center) |
P-03 | ||||
| 10:20 | Coffee break + Sponsor's Exhibition | |||||
| 10:30-12:00 | Session 7: Advanced PKG I | Session 8: Next Generation Packaging Technologies II | ||||
| Chairperson | Chairperson | |||||
| Taiji Sakai (TSMC Japan 3DIC R&D Center, Inc.) | Jun Maeda (LINTEC Corporation) | |||||
| Chinami Marushima (IBM Japan, Ltd.) | Satomi Kawamoto (Namics Corporation) | |||||
| 10:30 | (Invited) TBD | 07-01 | Extraction Techniques of Dielectric Characterization of Materials up to E-band Frequency | 08-01 | ||
| TBD | Chia Chu Lai, Ho-chuan Lin, Vito Lin, Andrew Kang, Yu Po Wang, Don-Son Jiang | |||||
| Siliconware Precision Industries Co., Ltd. | ||||||
| 10:55 | Generation of the thermal digital twin model for an IC chip | 07-02 | Measurement and Analysis of Substrate Integrated Waveguide Using Low Temperature Co-fired Ceramics at 250 GHz | 08-02 | ||
| Shuainan Lin1), Yanbo Tang1), Jiajia Sui2), Junan Ji2), Boping Wu1), Cheng Yang1), Harvey Jin2), Fay Cui3), Jonny Wang3) | Nobuki Hiramatsu1), Hiroshi Uchimura1), Tuchjuta Ruckkwaen1), Masahiro Tomisako1), Kouhei Hirose1), Naoki Hirayama1), Issei Watanabe2), Kunio Sakakibara3) | |||||
| 1) JCET Group Co., Ltd. 2) Shanghai Southchip Semiconductor Technology Co., LTD 3) Siemens industry software Co., Ltd |
1) KYOCERA Corporation 2) National Institute of Information and Communications Technology 3) Nagoya Institute of Technology |
|||||
| 11:20 | Study of Structural Evaluation in Fan-Out Large Body Size Packaging | 07-03 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||
| Shuai-Lin Liu, Teny Shih, Vito Lin, Sam Lin, Yu-Po Wang | ||||||
| Siliconware Precision Industries Co., Ltd. | ||||||
| 11:45 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
| 12:00-12:15 | Platinum Sponsors' Seminar 3 (with a light
meal) @Meetiing Room 1 SENKO Advance Co., Ltd. |
|||||
| 12:15-12:30 | Platinum Sponsors' Seminar 4 (with a light
meal) @Meetiing Room 1 SURUGA SEIKI CO., LTD. |
|||||
| 13:00-14:55 | Session 9: Advanced PKG II | Session 10: Photonics III (Optical Waveguide) |
Session 11: Bio electronics | |||
| Chairperson | Chairperson | Chairperson | ||||
| Takafumi Fukushima (Tohoku University) | Geert Van Steenberge (IMEC and Ghent University) | Beomjoon Kim (University of Tokyo) | ||||
| Kenji Takahashi (AIST) | Motohito Takezaki (Hakusan Inc.) | Shigenori Aoki (LINTEC Corporation) | ||||
| 13:00 | A Novel Negative-Tone Chemically Amplified Photoresist of High Resolution and Chemical Resistance for Fine Copper Wirings | 09-01 | Extremely low bending loss (<0.5 dB at 1-mm bending radius) GI core polymer optical waveguide | 10-01 | (Invited) Development of a Rumen Bacteria Microbial Fuel Cell for Cattle Health and Methane Emission Monitoring Devices | 11-01 |
| Yuanfei Liu, Masahiko Ebihara, Irwansyah, Masahiro Miyasaka | Masahiro Karakawa1), Takaaki Ishigure2) | Michitaka Yamamoto, Jarred W. Fastier-Wooller, Shun Muramatsu, Toshihiro Itoh | ||||
| Resonac | 1) Ajinomoto Co., Inc. 2) Keio University |
The University of Tokyo | ||||
| 13:25 | Development of 1.6 µm Fine-Pitch RDL Damascene Process using Low-NA i-Line Stepper and a New Negative-tone Photosensitive Dielectric Material | 09-02 | Application of graphene-doped polymer optical waveguides to wavelength convertor | 10-02 | High Performance X-ray detection module, with Indium bumps interconnections, manufactured on a die level packaging line | 11-02 |
| Lili Wang1), Murat Pak1), Go Inoue2), Kaho Shibasaki2), Ayano Okuda2), Kenyu Sugita2), Nobuhiro Ishikawa2), Toshiyuki Ogata2), Andy Miller1), Eric Beyne1) | Ken Kuboyama1), Naoki Yamaguchi2), Sze Yum Set2), Shinji Yamashita2), Takaaki Ishigure1) | Abdenacer AIT MANI, Patrick PERAY, Nadia MILOUD-ALI, Andrea BRAMBILLA, Arnaud PEIZERAT, Kim ABDOUL-CARIME, Loick VERGER | ||||
| 1) imec 2) TAIYO HOLDINGS CO., LTD |
1) Keio University 2) The University of Tokyo |
CEA-LETI | ||||
| 13:50 | Thermal Conductivity Aware Design Approach of Non-Conductive Film Layers for Enhanced Vertical Heat Dissipation in 3D HBM Packages | 09-03 | Low Wavelength Dependent Polymer Waveguide type Multiplexer for MDM Link | 10-03 | Fabrication of Flexible Electrochemical Sensor for Interstitial Fluid Biomarker Monitoring using Pattern Transfer Method | 11-03 |
| Yuna Lee, Sang Won Yoon | Takumi Kanai, Takaaki Ishigure | Boyu Qin, Jongho Park, Beomjoon Kim | ||||
| Seoul National University | Keio University | The University of Tokyo | ||||
| 14:15 | Non-Invasive Corrosion Quantification in Electronic Packages Using Smith Charts | 09-04 | Miniaturization of 1x2 and 1x4 branched multimode polymer optical waveguide for MUX device in SWDM links | 10-04 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |
| Tae Yeob Kang, Namgyeong Kim, Minkyu Kang | Koki Atsumi, Takaaki Ishigure | |||||
| The University of Suwon | Keio University | |||||
| 14:40 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
| 14:55 | Coffee break + Sponsor's Exhibition | |||||
| 15:10-15:50 | IEEE EPS Special Speech I | |||||
| Hall I | ||||||
| Chairperson Shinya Takyu (LINTEC Corporation) and Eiji Higurashi (Tohoku University) | ||||||
| 15:10 | IEEE EPS Special Speech I: Co-Packaged Optics – 3D
Heterogeneous Integration of Photonic IC and Electronic IC John H Lau (Unimicron Technology Corporation) |
S-01 | ||||
| 15:50-16:30 | IEEE EPS Special Speech II | |||||
| Hall I | ||||||
| Chairperson Shinya Takyu (LINTEC Corporation) and Eiji Higurashi (Tohoku University) | ||||||
| 15:50 | IEEE EPS Special Speech II: Aging of Lead-Free
Solders Jeffrey C. Suhling (Auburn University) |
S-02 | ||||
| 16:40-17:40 | Early Career Researcher's (ECR) Session (Open Forum with Beer) @ 1F Cafeteria | |||||
| Chairperson Takaaki Ishigure (Keio University) | ||||||
| Poster presentation | ||||||
| Packaging Technology for Ion Trap Quantum Processor Chips | ECR-01 | Automated 5-axis system for mosquito dispensed waveguides | ECR-02 | Investigations into the use of synthetic image data for the automated active alignment of micro-optics | ECR-03 | |
| Nila Krishnakumar1), Friederike Giebel1), Eike Iseke1), Konstantin Thronberens1), Jacob Stupp2), Nora D. Stahr2), Christian Ospelkaus1),2) | Laura Fuetterer, Andreas Evertz, Ludger Overmeyer | Anna-Lena Fritze, Ludger Overmeyer | ||||
| 1) Physikalisch-Technische Bundesanstalt 2) Gottfried Willhelm Leibniz University |
Leibniz University Hannover | Leibniz University Hannover | ||||
| Direct Thermal Characterization of Thinned InP-Laser Diodes | ECR-04 | Deep Learning with De-embedded S-parameters for Assessing Crack Propagation in Solder Joints | ECR-05 | Investigation of Polarization Performance in Polymer Optical Splitters for Co-Packaged Optics | ECR-06 | |
| Kiyoto Taniguchi1),2), Taro Itatani2), Joji Maeda1), Akihiro Noriki2), Takeru Amano2) | Namgyeong Kim, Minkyu Kang, Hyunwoo Nam, Tae Yeob Kang | Yudai Nagano1),2), Taro Itatani2), Fumi Nakamura2), Akihiro Noriki2), Takeru Amano2), Joji Maeda1), Satoshi Suda2) | ||||
| 1) Tokyo University of Science 2) AIST |
The University of Suwon | 1) Tokyo
University of Science 2) National Institute of Advanced Industrial Science and Technology |
||||
| 3-D Optical Interconnection of Bent Waveguides and Micro-Mirror by Planar Semiconductor Process | ECR-07 | Non-destructive Diagnosis of Cracks in SMD Capacitors Using Deep Learning on Impedance Spectra | ECR-08 | Quantum dot doped polymer optical waveguide amplifier | ECR-09 | |
| Keito Kikuchi1),2), Taro Itatani2), Yoshinobu Okano1), Akihiro Noriki2), Takeru Amano1),2) | Minkyu Kang, Namgyeong Kim, Hyunwoo Nam, Tae Yeob Kang | Hayato Kitta, Takaaki Ishigure | ||||
| 1) Tokyo City University 2) AIST |
The University of Suwon | Keio University | ||||
| Core Position Accuracy Improvement of Polymer Optical Waveguide fabricated using the Mosquito-Method | ECR-10 | Steeply bent core single-mode polymer waveguide with low bending loss fabricated using the Mosquito method | ECR-11 | Investigation of surface activation conditions using VUV light to enable room-temperature Au–Au bonding | ECR-12 | |
| Airi Nakao, Takaaki Ishigure | Ayu Tanimoto, Takaaki Ishigure | Mika Ogino, Kai Takeuchi, Eiji Higurashi | ||||
| Keio University | Keio University | Tohoku University | ||||
| Multi-Sensor Integrated Urethane Foam Package for Wearable Vital Sensing in Everyday Setting | ECR-13 | |||||
| Suguru Sato, Naoto Tomita, Jarred Fastier-Wooller, Shun Muramatsu, Michitaka Yamamoto, Toshihiro Itoh | ||||||
| The University of Tokyo | ||||||
| 17:40 | Close | |||||
| November 14, 2025 (Friday) | ||||||
| 4F/5F Main Hall I | 1F Room I | 1F Room II | ||||
| 9:00 | Registration | |||||
| 9:20 | ECR Award Ceremony | |||||
| 9:30-10:10 | Special Speech II | |||||
| Hall I | ||||||
| Chairperson Shoji Uegaki (Crane Research) and Shinya Takyu (LINTEC Corporation) | ||||||
| 9:30 | Special
Speech II: Innovative AI for Advanced Packaging Solutions C.P. Hung (ASE Group) |
S-05 | ||||
| 10:10-10:50 | Special Speech III | |||||
| Hall I | ||||||
| Chairperson Taiji Sakai (TSMC Japan 3DIC R&D Center, Inc.) and Kenji Takahashi (AIST) | ||||||
| 10:10 | Special
Speech III: Advanced Packaging Technologies Enabling AI Semiconductors at
Applied Materials Noriaki Matsunaga (Applied Materials Japan) |
S-04 | ||||
| 10:40 | Coffee break + Sponsor's Exhibition | |||||
| 11:05-12:35 | Session 12: IEEE EPS Technical session Glass Substrate |
Session 13: Advanced PKG III | Session 14: Power Electronics I | |||
| Chairperson | Chairperson | Chairperson | ||||
| Shigenori Aoki (LINTEC Corporation) | TBD | Kentaro Kaneko (Ritsumeikan University) | ||||
| Takashi Hisada (Rapidus) | TBD | Masafumi Yokoyama (SUMITOMO CHEMICAL COMPANY, LIMITED) | ||||
| 11:05 | (Invited) TBD | 12-01 | (Invited) TBD | 13-01 | (Invited) Wafer Bonding of Diamond for Improving Heat Dissipation of Properties of Nitride Devices | 14-01 |
| Akihiro Noriki | TBD | Naoteru Shigekawa, Jianbo Liang, Yutaka Ohno | ||||
| AIST | Osaka Metropolitan University | |||||
| 11:30 | (Invited) Fiber-to-chip self-coupling based on near-infrared self-written optical waveguide | 12-02 | Digital-Twin-Driven Machine Learning for Thermal Optimization of Flip-Chip Packages | 13-02 | Material and Process Characterization to Enable Heavy Copper Wire Bonding on Power Modules | 14-02 |
| Hidetaka Terasawa | Mohammad Rafiee, Vysak Vijayan Nair | Randolph Flauta1), Jing Chen2), Howie Ding2), Rito Wang2), Shixing Zhu2), Tino Minotti3), King Man Tai1), Joe Zhou2), Haibin Chen4) | ||||
| Utsunomiya University | University of Ottawa | 1) Nexperia HK 2) Nexperia China 3) Nexperia Italy 4) HKUST |
||||
| 11:55 | (Invited) TBD | 12-03 | Laser-Induced Forward Transfer of Thin Micro-Chiplets in quasi-contact mode | 13-03 | Study of Factor Effect on Surge Current Test Performance for Clip-Bonded Semiconductor Devices by Simulation | 14-03 |
| TBD | Harindra Kumar Kannojia, Geert Van Steenberge | Nick Chenchao ZHONG1), Thomas IGEL-HOLTZENDORFF2), Haibo FAN1), Tim BOETTCHER2), Owen Yi Kei LAW1) | ||||
| IMEC and Ghent University | 1) Nexperia Hong Kong 2) Nexperia Hamburg |
|||||
| 12:20 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
| 12:35-13:40 | Lunch (free time) | |||||
| 13:40-15:35 | Session 15: Photonics IV (Optical connection) |
Session 16: Power Electronics II | ||||
| Chairperson | Chairperson | |||||
| Junichi Inoue (Kyoto Institute of Technology) | Kentaro Kaneko (Ritsumeikan University) | |||||
| Takaaki Ishigure (Keio University) | Hiroki Imabayashi (University of Fukui) | |||||
| 13:40 | (Invited) Accelerating the Future: Silicon Photonics and Advanced Packaging at the Heart of HPC | 15-01 | (Invited) Development of Planar-Gate Vertical GaN MOSFETs | 16-01 | ||
| Sandeep Sane | Ryo Tanaka, Tsurugi Kondo, Nao Suganuma, Katunori Ueno, Shinya Takashima | |||||
| Lightmatter | Fuji Electric Co.,Ltd. | |||||
| 14:05 | 40-channel Detachable Optical Connector Enabling Ultra-high Density Connectivity in Co-packaged Optics | 15-02 | EMI Mitigation and Inductance Reduction in SiC Power Modules through Layout Optimization | 16-02 | ||
| Yuki Fujimaki, Shosuke Ikeda, Kengo Watanabe, Tsunetoshi Saito, Masaki Kotoku | Raymond Borres1), Thiyu Warnakulasooriya1), Sihoon Choi1), Koichi Shigematsu1), Masayoshi Yamamoto1), Ang-Ying Lin2), Yan Bo Fang2), Chien Wei Chang2), Po-Kai Chiu2), Yan-Cheng Liu2) | |||||
| Furukawa Electric Co., Ltd. | 1) Nagoya University 2) Industrial Technology Research Institute |
|||||
| 14:30 | Single Mode Multifiber Expanded Beam Connector for Immersion Cooling System Using GRIN Lens | 15-03 | Research on low thermal resistance/high reliability technology for ultra-compact double-sided cooled SiC power modules | 16-03 | ||
| Alexander William Setiawan Putra1), Yusuke Ishibashi1), Motohito Takezaki1), Kazutaka Aboshi2) | Akira Kitamura, Yoshihiro Tateishi, Shoichiro Otani, Satoharu Tanai, Keita Suzuki, Tetsuo Endoh, Yoshikazu Takahashi | |||||
| 1) Hakusan Inc. 2) Nippon Sheet Glass Co., LTD. |
TOHOKU UNIVERSITY | |||||
| 14:55 | Evaluation of fabricating polymer waveguides for die-to-die optical connections | 15-04 | Additive fan-out packaging for discrete components | 16-04 | ||
| Honoka Shima, Masaharu Kato, Kazunao Yamamoto, Masaki Matsumoto, Yuji Furuta, Hisashi Kaneda | Edsger C.P. Smits1),2), Arjun Wadhwa2), Milan Saalmink2), Marieke Burghoorn2), Iris Kerkhof2), Ruben Pranger1),2), Frans Meeuwsen1),2), Francesca Chiappini1),2), Jeroen van den Brand2) | |||||
| SHINKO ELECTRIC INDUSTRIES CO., LTD. |
1) CITC 2) TNO |
|||||
| 15:20 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
| 15:35 | Close | |||||