Advance Program
Last update: August 30, 2025
Click here to download the PDF file.
| November 12, 2025 (Wednesday) | ||||||
| 4F/5F Main Hall I | 1F Room I | 1F Room II | ||||
| 9:00 | Registration | |||||
| 10:10 | Opening Remark (General Chair, Hideyuki Nawata) | |||||
| 10:25 | Greeting speech (IEEE EPS Jr. President, Kitty Pearsall) | |||||
| 10:35 | Award Ceremony | |||||
| 10:50-12:30 | Plenary Speech I & II | |||||
| Hall I | ||||||
| Hideyuki Nasu (Furukawa Electric Co., Ltd) and Takaaki Ishigure (Keio University) | ||||||
| 10:50 | Plenary Speech I: TBD Sir David Neil Payne (University of Southampton) |
P-01 | ||||
| 11:40 | Plenary Speech
II: Paradigm Shifts in Silicon Photonics Roel Baets (Ghent University - imec) |
P-02 | ||||
| 12:40-12:55 | Platinum Sponsors' Seminar 1 (with a light
meal) @Meetiing Room 1 TBD |
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| 12:55-13:10 | Platinum Sponsors' Seminar 2 (with a light
meal) @Meetiing Room 1 TBD |
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| 13:30-15:25 | Session 1: Photonics I (Photonics Packaging / Si Photonics) |
Session 2: Process and Material Technologies for Hybrid Bonding | Session 3: High-Speed Package and System (Signal and Power Integrity) | |||
| Chairperson | Chairperson | Chairperson | ||||
| Hidetoshi Numata (IBM Research - Tokyo) | Shinya Takyu (LINTEC Corporation) | Kazuyuki Nakagawa (Renesas Electronics Corporation) | ||||
| Hideyuki Nasu (Furukawa Electric Co., Ltd.) | Mashahisa Fujino (Institute of Microelectronics) | Yutaka Uematsu (Hitachi, Ltd.) | ||||
| 13:30 | (Invited) Efficient AI System Scale-Up with Co-Packaged Optics: Opportunities & Challenges | 01-01 | (Invited) ”Solution Proposal and Discussion on C2W-HB Toward to Practical Use”～Introduction of Polymer Dielectric and Mounting Technology～ | 02-01 | (Invited) Inductors in Power over Data Line (PoDL) for In-Vehicle Networks | 03-01 |
| Sunil Priyadarshi | Takenori Fujiwara | Thomas Schamberger | ||||
| Intel | Toray Industries, Inc. | TDK Electronics AG | ||||
| 13:55 | Underfill with High Thermal Conductivity in Silicon Photonic Chiplets for Co-Packaged Optics (CPO) Devices | 01-02 | (Invited) Direct Transfer Bonding Overcoming the Challenges of Integrating delicate and Ultra-Thin Chips with 50-nm Scale Accuracy | 02-02 | Ultra-Small 145 GHz Coaxial Connector: Edge-Mount PCB Integration and Performance | 03-02 |
| Dai-Fei Li, Wen-Yu Teng, Liang-Yih Hung, Andrew Kang, Yu-Po Wang, Don-Son Jiang | Ichiro Sano | Hitoshi Onoduka, Yu-Cen Sun, Yushi Kirii | ||||
| Siliconware Precision Industries Co., Ltd. | TAZMO CO., LTD. | Yuetsu Seiki Co.,Ltd | ||||
| 14:20 | Development of Simultaneous Electrical and Optical Mounting for Co-Packaged Optics Modules | 01-03 | (Invited) Design and Development of Carrier Tapes for Direct Transfer Bonding Process | 02-03 | Effect of Thermal Distribution on Signal and Power Integrity Analysis of Large Complex 3D-IC System | 03-03 |
| Hisaaki Nishimura, Mizuki Tonomura, Misa Takahashi, Megumi Oishi, Fumiaki Haraguchi, Tokuro Ozawa, Takeshi Yokoyama, Tomoyuki Akahoshi | Tomoka Kirihata | Anushruti Jaiswal, Yu Tomonaga | ||||
| KYOCERA Corporation | LINTEC Corporation | Ansys | ||||
| 14:45 | (Invited) TBD | 01-04 | Chemical resistant dicing tape for hybrid bonding process | 02-04 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |
| Christopher Striemer | Ryoh Takahashi, Koki Maruno, Kazutoshi Furuzono, Naoki Takahara, Seiji Kai | |||||
| AIM Photonics | Resonac Corporation | |||||
| 15:10 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
| 15:25 | Coffee break + Sponsor's Exhibition | |||||
| 15:40-17:35 | Session 4: Photonics II (Laser) |
Session 5: Next Generation Packaging Technologies I | Session 6: High-Speed / RF Package and System | |||
| Chairperson | Chairperson | Chairperson | ||||
| Nobuo Ohata (Mitsubishi Electric Corpolation) | Eiji Higurashi (Tohoku University) | Yoichiro Kurita (Tokyo Institute of Technology) | ||||
| Junichi Inoue (Kyoto Institute of Technology) | Naoko Araki (Daicel Corporation) | Wataru Shiroi (Renesas Electronics Corporation) | ||||
| 15:40 | (Invited) Optical Signal Processsing (OSP) for pluggable transcedivers and co-packaged optics (CPO) | 04-01 | New Optical Adhesive Design for CPO Packaging Solutions | 05-01 | Radiation-Induced Destructive Effects on COTS FPGA in GEO Satellite Environments | 06-01 |
| Yosef Ben Ezra | Fumiya Suzuki, Masashi Kajiwara, Takashi Yamaguchi, Masayoshi Otomo, Noriyuki Sakai | Yuzo Yajima1), Eisuke Haraguchi1), Shigenori Tani1), Hiroshi Kinoda1), Hiroaki Miyake2) | ||||
| Newphotonics, CTO & Founder | Namics Corporation | 1) Mitsubishi Electric Corporation 2) Tokyo City University |
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| 16:05 | Ultrathin Chips of III-V Bonding Process Using Laser Peel Transfer Technology for Co-Packaged Optics | 04-02 | High I/O Density Solution on Flip Chip Substrate for Advanced Package | 05-02 | Efficient Integral-Equation Methodology for Signal Integrity Analysis of Large-Scale IC Packages | 06-02 |
| Haruka Fujishige1), Takumi Ikehara1), Tatsuya Okada1), Yoshiaki Arai1), Junpei Oniki2), Yukari Jo2), Daichi Miyazaki2), Takenori Fujiwara2) | Yuan Chang Ni1), Hung Kun Chen1), Yu Cheng Pai1), Cheng Yu Kang1), Jen Shang Chen2), Wei Ching Chu2), Yu-Po Wang1), Don-Son Jiang1) | Hans Schreckenbach, Lucas Banting, Andre Fecteau, Troy Lowry, Nima Chamanara, Santosh Janaki Raman, David Abraham, Max Hughson, Nick Geddert, Jonatan Aronsson | ||||
| 1) Toray Engineering 2) Toray Industries, Inc. |
1) Siliconware Precision Industries Co., Ltd. 2) Kinsus Interconnect Technology Corp |
CEMWorks Inc. | ||||
| 16:30 | An 8-Channel MM VCSEL-based Linear-Drive CPO Transceiver for Compute and Backend Interconnects in AI/ML systems | 04-03 | Development of heat-resistant UV curable dicing tape | 05-03 | An Adjustable Energy-Recovering Electrical-Balance Duplexer for In-Band Full-Duplex Transceivers in the 6G FR3 Band | 06-03 |
| Sho Yoneyama, Wataru Yoshida, Kazuya Nagashima, Kensho Nishizaki, Hideyuki Nasu | Reo Ozeki, Sayaka Tsuchiyama, Akio Fukumoto | Hsin-Chieh Lin1), Chih-Hao Chuang2), Yan-Qi Weng2), Da-Chiang Chang1), Hwann-Kaeo Chiou2) | ||||
| Furukawa Electric Co., Ltd. | LINTEC corporation | 1) National Institutes of Applied Research 2) National Central University |
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| 16:55 | (Invited) Integrated Comb Lasers for Co-Packaged Optics | 04-04 | A Study of Moisture Effects on Fan-out Package | 05-04 | (Invited) TBD | 06-04 |
| Frank Smyth | Chau-Wen Cheng, Chung-Hung Lai, Yao-Hsin Chou, Chin-Li Kao | |||||
| Pilot Photonics | Advanced Semiconductor Engineering, Inc | |||||
| 17:20 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
| 17:35-18:15 | Special Speech I | |||||
| Hall I | ||||||
| Chairperson Shinya Takyu (LINTEC Corporation) and Hideyuki Nawata (Nissan Chemical Corporation) | ||||||
| 17:35 | Artifact Metrics and Individual Management of Semiconductor
Packages Tsutomu Matsumoto (AIST) |
S-03 | ||||
| 19:15 | Welcome Reception | |||||
| 21:15 | Close | |||||
| November 13, 2025 (Thursday) | ||||||
| 4F/5F Main Hall I | 1F Room I | 1F Room II | ||||
| 9:00 | Registration | |||||
| 9:20 | Guest speech (President of Ritsumeikan University, Yoshio Nakatani) | |||||
| 9:30-10:20 | Plenary Speech III | |||||
| Hall I | ||||||
| Chairperson Shoji Uegaki (Crane Research) and Taiji Sakai (TSMC Japan 3DIC R&D Center, Inc.) | ||||||
| 9:30 | Plenary Speech III : TBD Shimpei Yamaguchi (TSMC Japan 3DIC R&D Center) |
P-03 | ||||
| 10:20 | Coffee break + Sponsor's Exhibition | |||||
| 10:30-12:00 | Session 7: Advanced PKG I | Session 8: Next Generation Packaging Technologies Ⅱ | ||||
| Chairperson | Chairperson | |||||
| Taiji Sakai (TSMC Japan 3DIC R&D Center, Inc.) | Jun Maeda (LINTEC Corporation) | |||||
| Chinami Marushima (IBM Japan, Ltd.) | Satomi Kawamoto (Namics Corporation) | |||||
| 10:30 | Generation of the thermal digital twin model for an IC chip. | 07-01 | Extraction Techniques of Dielectric Characterization of Materials up to E-band Frequency | 08-01 | ||
| Shuainan Lin1), Yanbo Tang1), Jiajia Sui2), Junan Ji2), Boping Wu1), Cheng Yang1) | Chia Chu Lai, Ho chuan Lin, Vito Lin, Andrew Kang, Yu Po Wang, Don Son Jiang | |||||
| 1) JCET Group Co., Ltd. 2) Shanghai Southchip Semiconductor Technology Co., LTD, |
Siliconware Precision Industries Co., Ltd. | |||||
| 10:55 | Study of Structural Evaluation in Fan-Out Large Body Size Packaging | 07-02 | Measurement and Analysis of Substrate Integrated Waveguide Using Low Temperature Co-fired Ceramics at 250 GHz | 08-02 | ||
| Bradley Liu, Teny Shih, Vito Lin, Sam Lin, Yu-Po Wang | Nobuki Hiramatsu1), Hiroshi Uchimura1), Tuchjuta Ruckkwaen1), Masahiro Tomisako1), Kouhei Hirose1), Naoki Hirayama1), Issei Watanabe2), Kunio Sakakibara3) | |||||
| Siliconware Precision Industries Co., Ltd. | 1) Kyocera Corporation, 2) National Institute of Information and
Communications Technology 3) Nagoya Institute of Technology |
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| 11:20 | Induction-bonded silver sinter layers for multi-die applications: characterization and evaluation | 07-03 | Die Attach Solder Fatigue Study in Clipbond Power Package | 08-03 | ||
| Patrick Rochala1), Martin Kroll1), Christian Hofmann2), Tom Petzold2), Till Clausmeyer1) | Vegneswary Ramalingam, Haima Santican, Hazrul Alang Abd Hamid, Nazirul Izzat Mohd Arifen | |||||
| 1) Chemnitz University of Technology 2) Fraunhofer Institute for Electronic Nano Systems ENAS |
Nexperia Malaysia Sdn Bhd | |||||
| 11:45 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
| 12:00-12:15 | Platinum Sponsors' Seminar 3 (with a light
meal) @Meetiing Room 1 SENKO Advance Co., Ltd. |
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| 12:15-12:30 | Platinum Sponsors' Seminar 4 (with a light
meal) @Meetiing Room 1 SURUGA SEIKI CO., LTD. |
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| 13:00-14:55 | Session 9: Advanced PKG II | Session 10: Photonics III (Optical Waveguide) |
Session 11: Bio electronics | |||
| Chairperson | Chairperson | Chairperson | ||||
| Takafumi Fukushima (Tohoku University) | Hideyuki Nawata (Nissan Chemical Corporation) | Beomjoon Kim (University of Tokyo) | ||||
| Kenji Takahashi (AIST) | Motohito Takezaki (Hakusan Inc.) | Shigenori Aoki (LINTEC Corporation) | ||||
| 13:00 | A Novel Negative-Tone Chemically Amplified Photoresist of High Resolution and Chemical Resistance for Fine Copper Wirings | 09-01 | Extremely low bending loss (<0.5 dB at 1-mm bending radius) GI core polymer optical waveguide | 10-01 | (Invited) Development of a Rumen Bacteria Microbial Fuel Cell for Cattle Health and Methane Emission Monitoring Devices | 11-01 |
| Yuanfei Liu, Masahiko Ebihara, Irwansyah, Masahiro Miyasaka | Masahiro Karakawa1), Takaaki Ishigure2) | Michitaka Yamamoto | ||||
| Resonac Corporation | 1) Ajinomoto Co., INC. 2) Keio University |
The University of Tokyo | ||||
| 13:25 | Development of 1.6 µm Fine-Pitch RDL Damascene Process using Low-NA i-Line Stepper and a New Negative-tone Photosensitive Dielectric Material | 09-02 | Application of graphene-doped polymer optical waveguides to wavelength convertor | 10-02 | X-rays detection module, with Indium bumps interconnections, manufactured on a die level packaging line | 11-02 |
| Lili Wang1), Murat Pak1), Go Inoue2), Kaho Shibasaki2), Ayano Okuda2), Kenyu Sugita2), Nobuhiro Ishikawa2), Toshiyuki Ogata2), Andy Miller1), Eric Beyne1) | Ken Kuboyama, Takaaki Ishigure, Naoki Yamaguchi, Shinji Yamashita, Sze Set | Abdenacer AIT MANI, Patrick PERAY, Nadia MILOUD-ALI, Andrea BRAMBILLA, Arnaud PEIZERAT, Kim ABDOUL-CARIME, Loick VERGER | ||||
| 1) imec 2) TAIYO HOLDINGS CO., LTD |
Keio University | CEA-LETI | ||||
| 13:50 | Thermal Conductivity-Aware Design Approach of Non-Conductive Film Layers for Enhanced Vertical Heat Dissipation in 3D HBM Packages | 09-03 | Low Wavelength Dependent Polymer Waveguide type Multiplexer for MDM Link | 10-03 | Fabrication of Flexible Embedded Electrochemical Sensor for Interstitial Fluid Biomarker Monitoring using Pattern Transfer Method | 11-03 |
| Yuna Lee, Sang Won Yoon | Takumi Kanai, Takaaki Ishigure | Boyu Qin, Jongho Park, Beomjoon Kim | ||||
| Seoul National University | Keio University | IThe University of Tokyo | ||||
| 14:15 | Non-Invasive Corrosion Quantification in Electronic Packages Using Smith Charts | 09-04 | Miniaturization of 1x2 and 1x4 branched multimode polymer optical waveguide for MUX device in SWDM links | 10-04 | Multi-Sensor Integrated Urethane Foam Package for Wearable Vital Sensing in Everyday Setting | 11-04 |
| Tae Yeob Kang, Minkyu Kang, Namgyeong Kim | Koki Atsumi, Takaaki Ishigure | Suguru Sato, Naoto Tomita, Jarred Fastier-Wooller, Shun Muramatsu, Michitaka Yamamoto, Toshihiro Itoh | ||||
| The University of Suwon | Keio University | The University of Tokyo | ||||
| 14:40 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
| 14:55 | Coffee break + Sponsor's Exhibition | |||||
| 15:10-15:50 | IEEE EPS Special Speech I | |||||
| Hall I | ||||||
| Chairperson Shinya Takyu (LINTEC Corporation) and Eiji Higurashi (Tohoku University) | ||||||
| 15:10 | IEEE EPS Special Speech I: Co-Packaged Optics – 3D
Heterogeneous Integration of Photonic IC and Electronic IC John H Lau (Unimicron Technology Corporation) |
S-01 | ||||
| 15:50-16:30 | IEEE EPS Special Speech II | |||||
| Hall I | ||||||
| Chairperson Shinya Takyu (LINTEC Corporation) and Eiji Higurashi (Tohoku University) | ||||||
| 15:50 | IEEE EPS Special Speech II: Aging of Lead-Free
Solders Jeffrey Suhling (Auburn University) |
S-02 | ||||
| 16:40-17:40 | Early Career Researcher's (ECR) Session (Open Forum with Beer) @ 1F Cafeteria | |||||
| Chairperson Takaaki Ishigure (Keio University) | ||||||
| Poster presentation | ||||||
| Packaging Technology for Ion Trap Quantum Processor Chips | ECR-01 | System accuracy of an automated 5-axis system for mosquito dispensed waveguides | ECR-02 | Investigations into the use of synthetic image data for the automated active alignment of micro-optics | ECR-03 | |
| Nila Krishnakumar1), Friederike Giebel1), Eike Iseke1), Konstantin Thronberens1), Jacob Stupp2), Nora D. Stahr2), Christian Ospelkaus1),2) | Laura Fuetterer, Andreas Evertz, Ludger Overmeyer | Anna-Lena Fritze, Ludger Overmeyer | ||||
| 1) Physikalisch-Technische Bundesanstalt 2) Gottfried Willhelm Leibniz University Hannover |
Leibniz University Hannover | Leibniz University Hannover | ||||
| Direct Thermal Imaging of Localized Heating in Thinned InP Laser Diodes | ECR-04 | Deep Learning with de-embedded S-parameters for Assessing Crack Propagation in Solder Joints | ECR-05 | Investigation of Polarization Performance in Polymer Optical Splitters for Co-Packaged Optics | ECR-06 | |
| Kiyoto Taniguchi1),2), Taro Itatani2), Joji Maeda1), Akihiro Noriki2), Takeru Amano2) | Namgyeong Kim, Minkyu Kang, Hyunwoo Nam, Tae Yeob Kang | Yudai Nagano1),2), Taro Itatani2), Fumi Nakamura2), Akihiro Noriki2), Takeru Amano2), Joji Maeda1), Satoshi Suda2) | ||||
| 1) Tokyo University of Science 2) AIST |
The University of Suwon | 1) Tokyo
University of Science 2) AIST |
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| 3-D Optical Interconnection of Bent Waveguide and Micro-Mirror by Planar Semiconductor Process | ECR-07 | Non-destructive Diagnosis of Cracks in SMD Capacitors Using Deep Learning on Impedance Spectra | ECR-08 | Quantum dot doped polymer optical waveguide amplifier | ECR-09 | |
| Keito Kikuchi1),2), Taro Itatani2), Yoshinobu Okano1), Akihiro Noriki2), Takeru Amano1),2) | Minkyu Kang, Namgyeong Kim, Hyunwoo Nam, Tae Yeob Kang | Hayato Kitta, Takaaki Ishigure | ||||
| 1) Tokyo University of Science 2) AIST |
The University of Suwon | Keio University | ||||
| Core Position Accuracy Improvement of Polymer Optical Waveguide fabricated using the Mosquito-Method | ECR-10 | Steeply bent core single-mode polymer waveguide with low bending loss fabricated using the Mosquito method | ECR-11 | Investigation of surface activation conditions using VUV light to enable room-temperature Au–Au bonding | ECR-12 | |
| Airi Nakao, Takaaki Ishigure | Ayu Tanimoto, Takaaki Ishigure | Mika Ogino, Kai Takeuchi, Eiji Higurashi | ||||
| Keio University | Keio University | Tohoku University | ||||
| 17:40 | Close | |||||
| November 14, 2025 (Friday) | ||||||
| 4F/5F Main Hall I | 1F Room I | 1F Room II | ||||
| 9:00 | Registration | |||||
| 9:20 | ECR Award Ceremony | |||||
| 9:30-10:10 | Special Speech II | |||||
| Hall I | ||||||
| Chairperson Taiji Sakai (TSMC Japan 3DIC R&D Center, Inc.) and Kenji Takahashi (AIST) | ||||||
| 9:30 | Special
Speech II: TBD Mr. Noriaki Matsunaga (Applied Materials Inc.) |
S-04 | ||||
| 10:10 | Coffee break + Sponsor's Exhibition | |||||
| 10:25-12:20 | Session 12: IEEE EPS Technical session Glass Substrate |
Session 13: Advanced PKG III | Session 14: Power Electronics I | |||
| Chairperson | Chairperson | Chairperson | ||||
| Shigenori Aoki (LINTEC Corporation) | TBD | Kentaro Kaneko (Ritsumeikan University) | ||||
| Takashi Hisada (Rapidus) | TBD | Masafumi Yokoyama (SUMITOMO CHEMICAL COMPANY, LIMITED) | ||||
| 10:25 | (Invited) TBD | 12-01 | (Invited) TBD | 13-01 | (Invited) Wafer Bonding of Diamond for Improving Heat Dissipation of Properties of Nitride Devices | 14-01 |
| Naoteru Shigekawa, Jianbo Liang, Yutaka Ohno | ||||||
| Osaka Metropolitan University | ||||||
| 10:50 | (Invited) TBD | 12-02 | Digital-Twin-Driven Machine Learning for Thermal Optimization of Flip-Chip Packages | 13-02 | Material and Process Characterization to Enable Heavy Copper Wire Bonding on Power Modules | 14-02 |
| Mohammad Rafiee, Vysak Nair | Randolph Estal Flauta, Jing Chen, Howie Ding, Rito Wang, Shixing Zhu, Tino Minotti, King Man Tai, Joe Zhou, Haibin Chen | |||||
| University of Ottawa | Nexperia Hong Kong | |||||
| 11:15 | (Invited) TBD | 12-03 | Laser-Induced Forward Transfer of Thin Micro-Chiplets in quasi-contact mode | 13-03 | Study of Factor Effect on Surge Current Test Performance for Clip-Bonded Semiconductor Devices by Simulation | 14-03 |
| Harindra Kumar Kannojia Harindra Kumar Kannojia, Geert Van Steenberge | Nick Chenchao ZHONG, Thomas IGEL-HOLTZENDORFF, Haibo FAN, Tim BOETTCHER, Owen Yi Kei LAW | |||||
| IMEC | Nexperia Hong Kong | |||||
| 11:40 | (Invited) TBD | 12-04 | ||||
| 12:05 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
| 12:20-13:20 | Lunch (free time) | |||||
| 13:20-15:15 | Session 15: Photonics IV (Optical connection) |
Session 16: Power Electronics II | ||||
| Chairperson | Chairperson | |||||
| Nobuo Ohata (Mitsubishi Electric Corpolation) | Kentaro Kaneko (Ritsumeikan University) | |||||
| Takaaki Ishigure (Keio University) | Hiroki Imabayashi (University of Fukui) | |||||
| 13:20 | (Invited) Silicon Photonics and Advanced Packaging at the Heart of HPC | 15-01 | (Invited) Development of Planar-Gate Vertical GaN MOSFETs | 16-01 | ||
| Sandeep Sane | Ryo Tanaka, Tsurugi Kondo, Nao Suganuma, Katunori Ueno, Shinya Takashima | |||||
| Lightmatter | Fuji Electric Co.,Ltd. | |||||
| 13:45 | 40-channel Detachable Optical Connector Enabling Ultra-high Density Connectivity in Co-packaged Optics | 15-02 | EMI Mitigation and Inductance Reduction in SiC-Based Power Modules through Layout-Aware Redesign | 16-02 | ||
| Yuki Fujimaki, Shosuke Ikeda, Kengo Watanabe, Tsunetoshi Saito, Masaki Kotoku | Raymond Borres1), Thiyu Warnakulasooriya1), Sihoon Choi1), Koichi Shigematsu1), Masayoshi Yamamoto1), Ang-Ying Lin2), Yan Bo Fang2), Chien Wei Chang2), Po-Kai Chiu2), Yan-Cheng Liu2) | |||||
| Furukawa Electric Co., Ltd. | 1) Nagoya University 2) Industrial Technology Research Institute (ITRI) |
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| 14:10 | Single Mode Multifiber Expanded Beam Connector for Immersion Cooling System Using GRIN Lens | 15-03 | Research on low thermal resistance/high reliability technology for ultra-compact double-sided cooled SiC power modules | 16-03 | ||
| Alexander William Setiawan Putra1), Yusuke Ishibashi1), Motohito Takezaki1), Kazutaka Aboshi2) | Akira Kitamura, Yoshihiro Tateishi, Shoichiro Otani, Satoharu Tanai, Keita Suzuki, Tetsuo Endoh, Yoshikazu Takahashi | |||||
| 1) Hakusan Inc. 2) Nippon Sheet Glass Co., LTD. |
Tohoku University | |||||
| 14:35 | Evaluation of fabricating polymer waveguides for die-to-die optical connections | 15-04 | Additive fan-out packaging for discrete components | 16-04 | ||
| Honoka Shima, Masaharu Kato, Kazunao Yamamoto, Masaki Matsumoto, Yuji Furuta, Hisashi Kaneda | Edsger C.P. Smits, Arjun Wadhwa, Milan Saalmink, Marieke Burghoorn, Iris Kerkhof, Ruben Pranger, Francesca Chiappini, Jeroen van den Brand | |||||
| Shinko Electric Industries Co., Ltd. | CITC / TNO | |||||
| 15:00 | Interview with the Authors (Discussion after the session) + Sponsor's Exhibition | |||||
| 15:15 | Close | |||||